-ar 模块化系统 - SOM

结果: 164
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 外观尺寸 处理器品牌 处理器类型 频率 RAM最大容量 已安装RAM 工作电源电压 接口类型 最小工作温度 最大工作温度 尺寸 封装
AMobile Solutions 模块化系统 - SOM Amobile Genio 700 SOM (MT8390, WiFi 5, SODIMM-260) 10库存量
最低: 1
倍数: 1

Genio 700 ARM ARM Cortex-A55, ARM Cortex-A78 6.4 GHz GPIO, I2C, SPI, USB - 10 C + 60 C 69.7 mm x 50 mm Bulk
Trenz Electronic 模块化系统 - SOM FPGA Module with AMD Artix 7A200T-2I, 1 GByte DDR3L, 32 MByte Flash, 4 x 5 cm 34库存量
最低: 1
倍数: 1

4 cm x 5 mm Xilinx XC7A200T-2FBG484I 3.3 V, 5 V Ethernet, JTAG, QSPI - 40 C + 85 C 50 mm x 40 mm
Trenz Electronic 模块化系统 - SOM FPGA Module with AMD Artix 7A100T-2I, 2 x 50 Pin-Header, 3.5 x 7.3 cm 2库存量
2预期 2027/7/14
最低: 1
倍数: 1


NetBurner 模块化系统 - SOM ARM Cortex Ethernet SoM 1,216库存量
最低: 1
倍数: 1

MODM7AE70 Ethernet, I2C, SPI, UART - 40 C + 85 C Bulk
Trenz Electronic 模块化系统 - SOM High IO FPGA Module with AMD Artix 7A35T-2C, USB, 4 x 5 cm 22库存量
最低: 1
倍数: 1

4 cm x 5 cm AMD XC7A35T-2CSG324C 0 GB 0 GB 3.3 V, 5 V 0 C + 70 C 50 mm x 40 mm
Trenz Electronic 模块化系统 - SOM FPGA Module with AMD Artix 7A200T-2C, 1 GByte DDR3L, 4 x 5 cm, low profile 7库存量
最低: 1
倍数: 1

4 cm x 5 mm Xilinx XC7A200T-2C 3.3 V, 5 V Ethernet, JTAG, QSPI 0 C + 70 C 50 mm x 40 mm
NetBurner 模块化系统 - SOM ARM Cortex Ethernet SoM 10 PIN Header 102库存量
最低: 1
倍数: 1

MODM7AE70 ARM Cortex M7 Ethernet, I2C, SPI, UART - 40 C + 85 C 66.04 mm x 50.8 mm Bulk
ReFLEX CES 模块化系统 - SOM Module "Lite 12G" v5 version, new 3库存量
最低: 1
倍数: 1

Arria 10 SoC I2C, SPI, UART 95 mm x 83.1 mm
Octavo Systems 模块化系统 - SOM System-in-Package: Texas Instruments AM3358 ARM Cortex A8 Processor, 512MB DDR3, TPS65217C PMIC, TL5209 LDO, 4KB EEPROM, Passives - 21mm X 21mm 256 Ball BGA - -40 C to 85 C 213库存量
4,560在途量
最低: 1
倍数: 1

OSD3358 Texas Instruments AM3358 1 GHz 512 MB 512 MB 1.1 V CAN, Ethernet, GPIO, I2C, SPI, UART, USB - 40 C + 85 C 21 mm x 21 mm Tray
Octavo Systems 模块化系统 - SOM System-in-Package: ST Micro STM32MP157C Dual ARM Cortex A7 + M4 Processor, 512MB DDR3L, STPMIC1A, 4KB EEPROM, 24MHz Oscillator, Passives - 18mm x 18mm 302 Ball BGA - -40 C to 85 C 14库存量
168预期 2026/11/10
最低: 1
倍数: 1
OSD32MP15x STMicroelectronics STM32MP157C 209 MHz, 650 MHz 1 GB 512 MB 2.8 V to 5.5 V Camera, CAN, I2C, SAI, SDIO, SPI, UART, USB - 40 C + 85 C 18 mm x 18 mm Tray
ReFLEX CES 模块化系统 - SOM Module "Indus 12G" v5 version, new
6预期 2026/9/14
最低: 1
倍数: 1

Arria 10 SoC I2C, SPI, UART 95 mm x 83.1 mm
iWave Global 模块化系统 - SOM XC2VE3858, -2 Speed Versal Edge AI Gen2 SOM with 4GB PS RAM, Triple 4GB PL RAM, 32GB eMMC, 256MB SPI NOR, Industrial grade
3在途量
最低: 1
倍数: 1

iG-G77M 70 mm x 80 mm ARM 2.2 GHz 32 GB 8 GB 5 V PCIe - 20 C + 85 C 80 mm x 70 mm x 11.7 mm Bulk
krtkl 模块化系统 - SOM Snickerdoodle Black, connectors down. Features Zynq-7000 (XC7Z020-3), 866MHz Dual-Core ARM Cortex-A9, Artix 7 FGPA, 1GB LPDDR2, Dual-Band MIMO Wi-Fi, 180 I/O (125 FPGA, 55 additional), SD cardcage, copper heat sink, connector configuration: down
217在途量
最低: 1
倍数: 1

snickerdoodle Xilinx XC7Z020-3CLG400E 866 MHz 1 GB 1 GB 3.7 V to 17 V Audio, CAN, Ethernet, GPIO, I2C, I2S, SPI, UART, USB 2.0, WiFi 0 C + 85 C 88.9 mm x 50.8 mm
ReFLEX CES 模块化系统 - SOM Module "Indus" v5 version, new
32预期 2026/10/21
最低: 1
倍数: 1

Arria 10 SoC I2C, SPI, UART 95 mm x 83.1 mm
Octavo Systems 模块化系统 - SOM System-in-Package: Texas Instruments AM3358 ARM Cortex A8 Processor, 1GBB DDR3, TPS65217C PMIC, TL5209 LDO, 4KB EEPROM, Passives - 21mm X 21mm 256 Ball BGA - -40 C to 85 C
400在途量
最低: 1
倍数: 1

Texas Instruments AM3358 1 GHz 1 GB 1 GB 1.1 V CAN, Ethernet, GPIO, I2C, SPI, UART, USB 0 C + 85 C 27 mm x 27 mm Tray
Octavo Systems 模块化系统 - SOM AM3358 512MB DDR3 System-In-Package
264预期 2026/11/23
最低: 1
倍数: 1

OSD3358 Texas Instruments AM3358 1 GHz 512 MB 512 MB 1.1 V CAN, Ethernet, GPIO, I2C, SPI, UART, USB 0 C + 85 C 21 mm x 21 mm Tray
Trenz Electronic 模块化系统 - SOM High IO FPGA Module with AMD Artix 7A100T-2I, USB, 4 x 5 cm
28在途量
最低: 1
倍数: 1

4 cm x 5 cm AMD XC7A100T-2CSG324I 0 GB 0 GB 3.3 V, 5 V - 40 C + 85 C 50 mm x 40 mm
Trenz Electronic 模块化系统 - SOM FPGA Module with AMD Artix 7A200T-2C, 1 GByte DDR3L, 32 MByte Flash, 4 x 5 cm 5库存量
3预期 2026/8/28
最低: 1
倍数: 1

AMD 3.3 V, 5 V USB 3.0 0 C + 70 C
Trenz Electronic 模块化系统 - SOM High IO FPGA Module with AMD Artix 7A100T-2C, USB, 4 x 5 cm
24预期 2027/3/5
最低: 1
倍数: 1

4 cm x 5 cm AMD XC7A100T-2CSG324C 0 GB 0 GB 3.3 V, 5 V 0 C + 70 C 50 mm x 40 mm
Trenz Electronic 模块化系统 - SOM FPGA-Modul with AMD Artix 7A100T-1I, 1 GByte DDR3L, 32 MByte Flash, 4 x 5 cm
6预期 2027/1/13
最低: 1
倍数: 1

4 cm x 5 mm Xilinx XC7A100T-1FGG484I 3.3 V, 5 V Ethernet, JTAG, QSPI - 40 C + 85 C 50 mm x 40 mm
Trenz Electronic 模块化系统 - SOM SoC-Module with AMD Zynq 7020-2I, 1 GByte DDR3L, 8 GByte eMMC, 4 x 5 cm
30预期 2027/8/18
最低: 1
倍数: 1

4 cm x 5 cm AMD / Xilinx ARM Cortex A9 1 GB Ethernet, USB - 40 C + 85 C
Trenz Electronic 模块化系统 - SOM FPGA-Module with AMD Artix 7A200T-1I, 1 GByte DDR3L, 32 MByte Flash, 4 x 5 cm
15预期 2026/8/28
最低: 1
倍数: 1

4 cm x 5 mm Xilinx XC7A200T-1FBG484I 3.3 V, 5 V Ethernet, JTAG, QSPI - 40 C + 85 C 50 mm x 40 mm
Octavo Systems 模块化系统 - SOM System-in-Package: ST Micro STM32MP157C Dual ARM Cortex A7 + M4 Processor, 512MB DDR3L, STPMIC1A, 4KB EEPROM, 24MHz Oscillator, Passives - 18mm x 18mm 302 Ball BGA - 0 C to 85 C
168预期 2026/11/10
最低: 1
倍数: 1

OSD32MP15x STMicroelectronics STM32MP157C 209 MHz, 650 MHz 1 GB 512 MB 2.8 V to 5.5 V Camera, CAN, I2C, SAI, SDIO, SPI, UART, USB 0 C + 85 C 18 mm x 18 mm Tray
Octavo Systems 模块化系统 - SOM Complete System-in-Package: Texas Instruments AM3358 ARM Cortex A8 Processor, 512MB DDR2, TPS65217C PMIC, TL5209 LDO, 4GB eMMC, 24MHz Oscillator, 4KB EEPROM, Passives - 27mm x 27mm 400 Ball BGA - 0 C to 85 C
120预期 2026/8/25
最低: 1
倍数: 1

OSD3358 Texas Instruments AM3358 1 GHz 512 MB 512 MB 1.1 V CAN, Ethernet, GPIO, I2C, SPI, UART, USB 0 C + 85 C 27 mm x 27 mm Tray
Trenz Electronic 模块化系统 - SOM FPGA Module with AMD Artix 7A35T-2I, 16 MByte Flash, 3,3V Config., 3 x 4 cm
1预期 2026/8/28
最低: 1
倍数: 1