PG 开发板与工具包 - x86

结果: 85
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS 系列 产品 核心 工具用于评估 封装
Arbor Technology StarterKit-003-2506
Arbor Technology 开发板与工具包 - x86 Qseven Starter Kit for EmQ-i2506 无库存
最低: 1
倍数: 1

Starter Kits Intel Atom EmQ-i2506
Arbor Technology StarterKit-003-50M1
Arbor Technology 开发板与工具包 - x86 Qseven Starter Kit for EmQ-a50M1 无库存
最低: 1
倍数: 1

Starter Kits AMD Fusion G-T40E EmQ-a50M1
congatec 开发板与工具包 - x86 Evaluation carrier board for standard SMARC modules based on SMARC Specification 2.1.1

conga-SA5 Carrier Boards Intel Atom, Intel Celeron, Intel Pentium SMARC 2.0
congatec 开发板与工具包 - x86 EVALUATION CARRIER BRD FOR QSEVEN 2.0

Evaluation Boards
ADLINK Technology Starterkit-cKL-i7-7600U-M16G
ADLINK Technology 开发板与工具包 - x86 Starterkit-COM Express 6 PLUS with cExpress-KL-i7-7600U Compact size Type 6 module, H/P passive heatsink, 16GB DDR4 2133 non-ECC SODIMM, operating temperature 0C to 60C degree
3库存量
最低: 1
倍数: 1

Starter Kits Intel Core i7 cExpress-KL
congatec 开发板与工具包 - x86 EVALUATION CARRIER BRD COM EXP TYPE 10

conga-MA3 Carrier Boards Intel Atom, Celeron COM Express Type 10 Bulk
congatec 开发板与工具包 - x86 3.5 Carrier Board for SMARC 2.0 modules with x86 CPUDimensions are 146mm x 102 mm (5.74" x 4.02")Operating Temperature: 0 C to 60 C (commercial)

Evaluation Boards
congatec 开发板与工具包 - x86 Evaluation carrier board for COM HPC Client.

conga-HPC/cTLU Intel Tiger Lake-UP3 Evaluation Carrier Boards conga-HPC
congatec 开发板与工具包 - x86 Evaluation Carrier Board for COM Express Type 7 modules with four 10GbE SFP+ fiber/copper ports. The carrier features an Aspeed AST2500 Board Management Controller (BMC). Commercial temperature range from 0 C to 60 C.
congatec 开发板与工具包 - x86 QSEVEN STARTER KIT FOR MOBILE APPS

Starter Kits Intel Atom Qseven Modules
congatec 开发板与工具包 - x86 Evaluation Carrier Board for COM Express Type 7 modules with four 10GbE SFP+ fiber/copper ports. No BMC. Industrial temperature range from -40 C to 85 C.

Carrier Boards COM Express Type 7
ADLINK Technology I-Pi LEC-EL-6425E-4G-64G/US
ADLINK Technology 开发板与工具包 - x86 I-Pi SMARC Plus X Prototype Kit for AIOT with LEC-EL-6425E-4G-64G-CT, low profile heatsink and HDA ALC888 Audio (US 110/220V to 19V Adapter)
Development Kits Atom x6425E LEC-EL-6425E-4G-64G
Altera EB-HPSTB
Altera 开发板与工具包 - x86 Hard Processor System Test Board

Eurotech 开发板与工具包 - x86 Eurotech DeviceCloud (EDC) Dev Kit

Development Kits Intel Atom Z5xx Helios
Eurotech 开发板与工具包 - x86 Eurotech DeviceCloud (EDC) Dev Kit

Development Kits Intel Atom Z5xx Helios
Advantech ROM-DB7503-SCA1E
Advantech 开发板与工具包 - x86 ROM-DB7503 Qseven 21 Carrier Board

ADLINK Technology I-cExpress-MTL-125H-Kit
ADLINK Technology 开发板与工具包 - x86 COM Express Type 6 Prototype Kit with cExpress-MTL-125H, Express-BASE6 R3.1 carrier, heatsink with FAN and necessary parts for enabling
Development Kits Ultra 5 125H cExpress-MTL-125H
ADLINK Technology I-nanoX-EL-x6211E-2G-Kit
ADLINK Technology 开发板与工具包 - x86 I-nanoX-EL-x6211E-2G-KitCOM Express Type 10 Prototype Kit with nanoX-EL-x6211G-2G, miniBase-10R carrier, heatspreader, US 110/220V to 19V Adapter and necessary enabling parts
Development Kits Atom x6211E nanoX-EL-x6211E-2G
ADLINK Technology I-COM-HPC-sIDH-2796-C827 Dev Kit
ADLINK Technology 开发板与工具包 - x86 COM-HPC Intel Ice Lake-D HCC development kit with D-2796 CPU module, with carrier, C827 OCP, heatsink and accessories
Development Kits Xeon D-2796 COM-HPC-sIDH-D-2796TE
ADLINK Technology I-COM-HPC-sIDH-2796-X557 Dev Kit
ADLINK Technology 开发板与工具包 - x86 COM-HPC Intel Ice Lake-D HCC development kit with D-2796 CPU module, with carrier, X557 OCP, heatsink and accessories
Development Kits Xeon D-2796 COM-HPC-sIDH-D-2796TE
ADLINK Technology I-Express-RLP-i5-13600HE-Kit
ADLINK Technology 开发板与工具包 - x86 COM Express Type 6 Prototype Kit with Express-RLP-i5-13600HE, Express-BASE6 R3.1 carrier, heatsink with FAN and necessary parts for enabling
Development Kits Core i5-13600HE Express-ADP-i5-13600HE
ADLINK Technology I-Pi LEC-EL-6425E-4G-64G/EU
ADLINK Technology 开发板与工具包 - x86 I-Pi SMARC Plus X Prototype Kit for AIOT with LEC-EL-6425E-4G-64G-CT, low profile heatsink and HDA ALC888 Audio (EU 110/220V to 19V Adapter)

Development Kits Atom x6425E LEC-EL-6425E-4G-64G
ADLINK Technology Starterkit-COMe 7 PLUS-CEI 4x10G Copper
ADLINK Technology 开发板与工具包 - x86 COM Express formfactor starterkit with Express-BASE7 carrier, CEI-4x10GBASE-T Card, power supply and accessory (order COM Express module, memory and thermal solution separately)
Starter Kits COM Express Type 7 Series
ADLINK Technology Starterkit-COM Express 7 PLUS-4 Copper
ADLINK Technology 开发板与工具包 - x86 Starterkit-COM Express 7 PLUS-Full CopperCOM Express formfactor starterkit with Express-BASE7 carrier, 10GbE Full BaseT Card, power supply and accessory (order COM Express module, memory and thermal solution separately)
Starter Kits COM Express Type 7 Series
ADLINK Technology Starterkit-COMe 7 PLUS-CEI 4x10G Fiber
ADLINK Technology 开发板与工具包 - x86 COM Express formfactor starterkit with Express-BASE7 carrier, CEI-4x10G-SFP+ Card, power supply and accessory (order COM Express module, memory and thermal solution separately)
Starter Kits COM Express Type 7 Series