-ar 无线与射频模块

结果: 701
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS 产品类型 产品 频率 接口类型 协议 - 蓝牙、BLE - 802.15.1 协议 - 蜂窝、Nbiot、LTE 协议 - GPS、GLONASS 协议 - WiFi - 802.11 协议 - ANT、Thread、Zigbee - 802.15.4 协议 - Sub GHz
Quectel 多协议模块 Wi-Fi /BT variant. 1+8GB - Consumer temperature range(EAU >2000pcs)
Multiprotocol Modules 802.11 a/b/g/n/ac, Bluetooth 4.2 2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 Bluetooth 4.2 802.11 a/b/g/n/ac
Quectel 多协议模块 Wi-Fi /BT variant. 2+16GB - Industrial temperature range(EAU >2000pcs)
Multiprotocol Modules 802.11 a/b/g/n/ac, Bluetooth 4.2 2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 Bluetooth 4.2 802.11 a/b/g/n/ac
Quectel 多协议模块 No connectivity. 4+32GB - Industrial temperature range(EAU >2000pcs)
Multiprotocol Modules 802.11 a/b/g/n/ac, Bluetooth 4.2 2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 Bluetooth 4.2 802.11 a/b/g/n/ac
Quectel 多协议模块 Wi-Fi /BT variant.4+32GB - Consumer temperature range(EAU >2000pcs)
Multiprotocol Modules 802.11 a/b/g/n/ac, Bluetooth 4.2 2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 Bluetooth 4.2 802.11 a/b/g/n/ac
Quectel 多协议模块 Wi-Fi /BT variant. 8+64GB - Consumer temperature range Do Not promote
Multiprotocol Modules 802.11 a/b/g/n/ac, Bluetooth 4.2 2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 Bluetooth 4.2 802.11 a/b/g/n/ac
Quectel 多协议模块 Wi-Fi /BT variant.2+32GB - Consumer temperature range(EAU >2000pcs)
Multiprotocol Modules 802.11 a/b/g/n/ac, Bluetooth 4.2 2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 Bluetooth 4.2 802.11 a/b/g/n/ac
Quectel 多协议模块 Wi-Fi /BT variant. 1+8GB - Industrial temperature range(EAU >2000pcs)
Multiprotocol Modules 802.11 a/b/g/n/ac, Bluetooth 4.2 2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 Bluetooth 4.2 802.11 a/b/g/n/ac
Arbor Technology HSUPA-1450 R1.0
Arbor Technology 蜂窝模块 Qulacom 3G module with one internal cable for ART for Euro, China

Cellular Modules
Quectel 多协议模块 No connectivity. 2+32GB variant. Consumer temperature range(EAU >2000pcs)
Multiprotocol Modules 802.11 a/b/g/n/ac, Bluetooth 4.2 2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 Bluetooth 4.2 802.11 a/b/g/n/ac
Quectel 多协议模块 cloud enabled, Cat M1/Cat NB2/EGPRS + GNSS (w/o WWAN concurrency), no VoLTE
Multiprotocol Modules EGPRS, GNSS, LTE CatM1, LTE Cat NB2 850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz ADC, GPIO, I2C, PCM, UART, USB 2.0 EGPRS, LTE Cat-M1, LTE Cat NB2 GNSS
Quectel 蓝牙模块 - 802.15.1 BLE 5.4 standalone module w/ chip antenna in LGA FF, 32 KB RAM, 512 KB flash, 18 GPIOs, transmit power = 8 dBm, -40 C to +85 C
Bluetooth Modules Bluetooth Modules I2C, SPI, USART Bluetooth LE
Quectel 多协议模块 cloud enabled, Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: PCB, extended temp -40 105C, 4MB flash
Multiprotocol Modules 802.11 b/g/n, BLE 5.2 2.4 GHz UART BLE 5.2 802.11 b/g/n
Quectel 蓝牙模块 - 802.15.1 BLE 5.3 standalone module, LCC pin antenna

Bluetooth Modules 2.4 GHz UART Bluetooth LE
Quectel 多协议模块 No connectivity. 4+32GB variant. Consumer temperature range(EAU >2000pcs)
Multiprotocol Modules 802.11 a/b/g/n/ac, Bluetooth 4.2 2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 Bluetooth 4.2 802.11 a/b/g/n/ac
Quectel 多协议模块 No connectivity. 1+8GB - Industrial temperature range(EAU >2000pcs)
Multiprotocol Modules 802.11 a/b/g/n/ac, Bluetooth 4.2 2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 Bluetooth 4.2 802.11 a/b/g/n/ac
Quectel 蓝牙模块 - 802.15.1 BT 5.4 & BLE Mesh, 10 dBm max TX power, ARM Cortex-M33 core, 80MHz, -40 ? to +105 ?, PCB antenna

Bluetooth Modules 2.4 GHz ADC, GPIO< I2C, I2S, JTAG, PWM, SPI, SWD, UART Bluetooth LE
Quectel 多协议模块 cloud enabled, Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: PCB, -40 85C, 2MB flash
Multiprotocol Modules 802.11 b/g/n, BLE 5.2 2.4 GHz UART BLE 5.2 802.11 b/g/n
Quectel 蓝牙模块 - 802.15.1 BLE 5.3 standalone module, IPEX-4 antenna connector

Bluetooth Modules 2.4 GHz UART Bluetooth LE
Quectel 蓝牙模块 - 802.15.1 BT 5.4 & BLE Mesh, 20 dBm max TX power, ARM Cortex-M33 core, 80MHz, -40 ? to +105 ?, PCB antenna

Bluetooth Modules 2.4 GHz ADC, GPIO< I2C, I2S, JTAG, PWM, SPI, SWD, UART Bluetooth LE
Quectel 蓝牙模块 - 802.15.1 BLE 5.3 standalone module, PCB antenna

Bluetooth Modules 2.4 GHz UART Bluetooth LE
Quectel 多协议模块 cloud enabled, Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: IPEX-4, 2MB flash
Multiprotocol Modules 802.11 b/g/n, BLE 5.2 2.4 GHz UART BLE 5.2 802.11 b/g/n
Quectel 多协议模块 Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM + 8MB PSRAM, 8MB Flash, Antenna: PCB, -40 85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm
Multiprotocol Modules Modules 2.4 GHz, 5 GHz GPIO, I2C, JTAG, SPI, UART, USB
Quectel 蓝牙模块 - 802.15.1 BT6.0, 1st generation RF coaxial connector*2,256KB SRAM,1MB internal flash,Tx power 10dBm,-40? +105?
Bluetooth Modules Bluetooth Modules 78 MHz I2C, SPI, UART Bluetooth
Quectel 蓝牙模块 - 802.15.1 BT 5.4 & BLE Mesh, 10 dBm max TX power, ARM Cortex-M33 core, 80MHz, -40 ? to +105 ?, PCB antenna
Bluetooth Modules Bluetooth Modules I2C, USART Bluetooth LE
Quectel 多协议模块 Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM, 8MB Flash, Antenna: 4th gen RF coax, -40 85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm
Multiprotocol Modules Modules 2.4 GHz, 5 GHz GPIO, I2C, JTAG, SPI, UART, USB 802.11a/b/g/n/ac/ax