SOC 无线与射频模块

结果: 81
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS 产品类型 产品 频率 接口类型 协议 - 蓝牙、BLE - 802.15.1 协议 - 蜂窝、Nbiot、LTE 协议 - WiFi - 802.11 协议 - ANT、Thread、Zigbee - 802.15.4 协议 - Sub GHz
Silicon Labs 多协议模块 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 8MB Flash, 2MB PSRAM, No Antenna, 32KHz XTAL Pins, MVP

Multiprotocol Modules Wireless Modules 2.4 GHz I2C, SPI, QSPI, UART WiFi
Silicon Labs 多协议模块 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 8MB Flash, Integrated Antenna, 32KHz XTAL Pins, MVP

Multiprotocol Modules Wireless Modules 2.4 GHz I2C, SPI, QSPI, UART WiFi
Broadcom / Avago BCM6755A1KFEBG
Broadcom / Avago WiFi模块 - 802.11 Quad Core A7, Dual 2x2 11ax WiFi SoC

WiFi Modules
Silicon Labs 多协议模块 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 8MB Flash, 2MB PSRAM, Integrated Antenna, 32KHz XTAL Pins, MVP

Multiprotocol Modules Wireless Modules 2.4 GHz I2C, SPI, QSPI, UART WiFi
Silicon Labs 多协议模块 SiWG917Y SoC Module Wi-Fi 6 2.4 GHz Bluetooth LE 5.4 No Antenna, 2MB PSRAM in package

Multiprotocol Modules I2C, SPI, UART, USART
Telink 多协议模块 Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this

Multiprotocol Modules Wireless Modules 2.4 GHz to 2.483 GHz I2C, SPI, UART