结果: 262
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 协议 接口类型 输出功率 数据速率 接收器灵敏度 频率 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 封装
Panasonic ENW-89845A6KF
Panasonic 蓝牙模块 - 802.15.1 PANBRD2A-CC2564B+ MSP430 Dual Mode P&P 无库存交货期 32 周
最低: 500
倍数: 500
: 500

BRD2A Reel
Olimex Ltd. OLIMEXINO-NANO-BLE
Olimex Ltd. 蓝牙模块 - 802.15.1 无库存
最低: 1
倍数: 1
Panasonic ENW-89815A5KF
Panasonic 蓝牙模块 - 802.15.1 NRFND: 03/01/2018 无库存交货期 16 周
Bluetooth 2.0 + EDR Class 2 2.4 GHz
CEL 蓝牙模块 - 802.15.1 CSR1010 IC +8dBm Pout Trace Ant 无库存
最低: 600
倍数: 600
: 600

BLE, Bluetooth 4.0 Class 2 I2C, SPI, UART 8 dBm - 94 dBm 2.44 GHz 1.8 V 3.6 V - 30 C + 85 C Reel
CEL 蓝牙模块 - 802.15.1 Tx Pout 8dBm Ext Ant BLE Range 50-100m 无库存
最低: 600
倍数: 600
: 600

BLE, Bluetooth 4.0 Reel
CEL 蓝牙模块 - 802.15.1 CSR1010 IC +8dBm Pout Ext. Ant.

BLE, Bluetooth 4.0 Class 2 I2C, SPI, UART 8 dBm - 94 dBm 2.44 GHz 1.8 V 3.6 V - 30 C + 85 C Reel, Cut Tape, MouseReel
Digi 蓝牙模块 - 802.15.1 XBee 3 BLU, 2.4 GHz, Bluetooth Low Energy, RF Pad Antenna, MMT

SPI, UART 8 dBm 2 Mb/s - 97 dBm 2.4 GHz 1.71 V 3.8 V - 40 C + 85 C Tray
Panasonic 蓝牙模块 - 802.15.1 PAN1783A, BLE Module with bottom-pad

PAN1783A GPIO, I2C, SPI, UART 3 dBm 2 Mb/s, 12 Mb/s - 98 dBm 1.7 V 5.5 V - 40 C + 85 C Reel, Cut Tape
Digi 蓝牙模块 - 802.15.1 XBee 3 BLU, 2.4 GHz, Bluetooth Low Energy, U.FL, TH

Tray
Phoenix Contact 蓝牙模块 - 802.15.1 FL BT EPA 2

Bluetooth 2.1 Ethernet 10 dBm 2.4 GHz 9 V 30 V - 40 C + 65 C
Microchip Technology 蓝牙模块 - 802.15.1 Bluetooth Low Energy/15.4 Combo Module with PCB Antenna

ADC, DAC, GPIO, I2C, PWM, QSPI, RS485, SPI, USART 11 dBm 2 Mb/s 2.4 GHz 1.9 V 3.6 V - 40 C + 85 C Tray
Microchip Technology 蓝牙模块 - 802.15.1 Bluetooth Low Energy/15.4 Combo Module with u.FL Antenna

ADC, DAC, GPIO, I2C, PWM, QSPI, RS485, SPI, USART 11 dBm 2 Mb/s 2.4 GHz 1.9 V 3.6 V - 40 C + 85 C Tray
Panasonic 蓝牙模块 - 802.15.1 PAN B611 Chip Antenna Standard

PAN B611-1C Bluetooth 6.0, Bluetooth 802.15.4 GPIO, I2C, I2S, UART 8 dBm 1.7 V 3.6 V - 40 C + 85 C Reel, Cut Tape, MouseReel
Panasonic 蓝牙模块 - 802.15.1 PAN B611 Chip Antenna Economy

PAN B611-1C Bluetooth 6.0, Bluetooth 802.15.4 GPIO, I2C, I2S, UART 8 dBm 1.7 V 3.6 V - 40 C + 85 C Reel, Cut Tape, MouseReel
Panasonic 蓝牙模块 - 802.15.1 PAN B611 Bottom Pad Premium

PAN B611-1B Bluetooth 6.0, Bluetooth 802.15.4 GPIO, I2C, I2S, UART 8 dBm 1.7 V 3.6 V - 40 C + 85 C Reel, Cut Tape, MouseReel
Panasonic 蓝牙模块 - 802.15.1 PAN B611 Bottom Pad Economy

PAN B611-1B Bluetooth 6.0, Bluetooth 802.15.4 GPIO, I2C, I2S, UART 8 dBm 1.7 V 3.6 V - 40 C + 85 C Reel, Cut Tape, MouseReel
Microchip Technology 蓝牙模块 - 802.15.1 Bluetooth 5 Dual Mode with Shield, Antenna Module with ASCII Interface and MFI support FW 1.13 直接发货交货期 17 周
最低: 88
倍数: 88

RN4678 BLE, Bluetooth 5.0, BR/EDR Class 2 UART 1.5 dBm 1 Mb/s - 90 dBm, - 92 dBm 2.44 GHz 3.3 V 4.2 V - 20 C + 70 C Tray
Microchip Technology RN4678APL-V/RM120
Microchip Technology 蓝牙模块 - 802.15.1 Bluetooth 5 Dual Mode with Shield, Antenna Module with ASCII Interface and MFI support FW 1.20 直接发货交货期 17 周
最低: 88
倍数: 88

BLE, Bluetooth 5.0, BR/EDR UART 1.5 dBm - 90 dBm, - 92 dBm 2.44 GHz Tray
Microchip Technology 蓝牙模块 - 802.15.1 SmartConnect WINC3400-MR210CA Module

I2C, SPI, UART 18.3 dBm 1 Mb/s, 2 Mb/s, 5.5 Mb/s, 11 Mb/s, 6 Mb/s, 9 Mb/s, 12 Mb/s, 18 Mb/s, 24 Mb/s, 36 Mb/s, 48 Mb/s, 54 Mb/s 2.4 GHz 2.7 V 3.6 V - 40 C + 85 C
Microchip Technology 蓝牙模块 - 802.15.1 SmartConnect WINC3400-MR210CA Module Tape and Reel

I2C, SPI, UART 18.3 dBm 1 Mb/s, 2 Mb/s, 5.5 Mb/s, 11 Mb/s, 6 Mb/s, 9 Mb/s, 12 Mb/s, 18 Mb/s, 24 Mb/s, 36 Mb/s, 48 Mb/s, 54 Mb/s 2.4 GHz 2.7 V 3.6 V - 40 C + 85 C
Microchip Technology 蓝牙模块 - 802.15.1 SmartConnect WINC3400-MR210UA Module

I2C, SPI, UART 18.3 dBm 1 Mb/s, 2 Mb/s, 5.5 Mb/s, 11 Mb/s, 6 Mb/s, 9 Mb/s, 12 Mb/s, 18 Mb/s, 24 Mb/s, 36 Mb/s, 48 Mb/s, 54 Mb/s 2.4 GHz 2.7 V 3.6 V - 40 C + 85 C
Microchip Technology 蓝牙模块 - 802.15.1 SmartConnect WINC3400-MR210UA Module Tape and Reel

I2C, SPI, UART 18.3 dBm 1 Mb/s, 2 Mb/s, 5.5 Mb/s, 11 Mb/s, 6 Mb/s, 9 Mb/s, 12 Mb/s, 18 Mb/s, 24 Mb/s, 36 Mb/s, 48 Mb/s, 54 Mb/s 2.4 GHz 2.7 V 3.6 V - 40 C + 85 C
Microchip Technology 蓝牙模块 - 802.15.1 Certified Dual Mode Bluetooth Module with ASCII Interface used with Apple MFI
Bluetooth v5.0, BR/EDR/LE Class 2 UART 1.5 dBm 1 Mb/s - 90 dBm, - 92 dBm 2.48 GHz 3.3 V 4.2 V - 20 C + 70 C Tray
Microchip Technology 蓝牙模块 - 802.15.1 Bluetooth 4.2 dual mode (BR/EDR/LE) module; ASCII, w/ shield, w/ antenna
Bluetooth v5.0, BR/EDR/LE Class 2 UART 1.5 dBm 1 Mb/s - 90 dBm, - 92 dBm 2.48 GHz 3.3 V 4.2 V - 20 C + 70 C Tray
Microchip Technology 蓝牙模块 - 802.15.1 Bluetooth Low Energy/15.4 Combo Module with PCB Antenna

ADC, GPIO, I2C, PWM, QSPI, RS485, SPI, USART 5 dBm 2 Mb/s 2.4 GHz 1.9 V 3.6 V - 40 C + 85 C Tray