- 40 C SMD/SMT 蓝牙模块 - 802.15.1

结果: 290
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 协议 接口类型 输出功率 数据速率 接收器灵敏度 频率 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 封装
FCL Components MBH7BTZ39A-E3
FCL Components 蓝牙模块 - 802.15.1 BT iOS Module SMD type NO Antenna 无库存
最低: 1
倍数: 1

MBH7BTZ Bluetooth 2.1 + EDR Class 2 UART 4 dBm - 87 dBm 2.4 GHz 2.7 V 3.6 V - 40 C + 85 C
FCL Components MBH7BTZ42A-E2
FCL Components 蓝牙模块 - 802.15.1 BT iOS Module SMD type NO Antenna 无库存
最低: 1
倍数: 1

MBH7BTZ Bluetooth 2.1 + EDR Class 2 UART 4 dBm - 87 dBm 2.4 GHz 2.7 V 3.6 V - 40 C + 85 C
Panasonic Industry 蓝牙模块 - 802.15.1 PAN1783A, BLE Module with bottom-pad

PAN1783A GPIO, I2C, SPI, UART 3 dBm 2 Mb/s, 12 Mb/s - 98 dBm 1.7 V 5.5 V - 40 C + 85 C Reel, Cut Tape
Microchip Technology 蓝牙模块 - 802.15.1 Bluetooth Low Energy/15.4 Combo Module with PCB Antenna

ADC, DAC, GPIO, I2C, PWM, QSPI, RS485, SPI, USART 11 dBm 2 Mb/s 2.4 GHz 1.9 V 3.6 V - 40 C + 85 C Tray
Microchip Technology 蓝牙模块 - 802.15.1 Bluetooth Low Energy/15.4 Combo Module with u.FL Antenna

ADC, DAC, GPIO, I2C, PWM, QSPI, RS485, SPI, USART 11 dBm 2 Mb/s 2.4 GHz 1.9 V 3.6 V - 40 C + 85 C Tray
Infineon Technologies 蓝牙模块 - 802.15.1 EZ-BLE PRoC BT 4.2 Module

BLE, Bluetooth 4.2 I2C, SPI, UART 3 dBm 1 Mb/s - 89 dBm 2.4 GHz 1.71 V 5.5 V - 40 C + 85 C Reel, Cut Tape, MouseReel
Adafruit 蓝牙模块 - 802.15.1 nRF52832 Bluetooth Low Energy Module - MDBT42Q-512KV2

BLE, Bluetooth 5.0 I2C, I2S, PDM, SPI, UART 4 dBm - 96 dBm 2.4 GHz 1.7 V 3.6 V - 40 C + 85 C
u-blox 蓝牙模块 - 802.15.1 Bluetooth LE SiP module with open CPU and antenna pin for external antenna connection.

ANNA-B5 6.7 dBm - 103 dBm 1.7 V 3.6 V - 40 C + 85 C Reel, Cut Tape
u-blox 蓝牙模块 - 802.15.1 Bluetooth LE SiP module with open CPU and internal antenna

ANNA-B5 6.7 dBm - 103 dBm 1.7 V 3.6 V - 40 C + 85 C Reel, Cut Tape
u-blox 蓝牙模块 - 802.15.1 Bluetooth LE SiP module with uconnectXpress software and antenna pin for external antenna connection.

ANNA-B5 UART 8 dBm - 102 dBm 1.7 V 3.6 V - 40 C + 85 C Reel, Cut Tape
u-blox 蓝牙模块 - 802.15.1 Bluetooth LE SiP module with uconnectXpress software and internal antenna

ANNA-B5 UART 8 dBm - 102 dBm 1.7 V 3.6 V - 40 C + 85 C Reel, Cut Tape
Panasonic Industry 蓝牙模块 - 802.15.1 PAN B611 Chip Antenna Standard

PAN B611-1C Bluetooth 6.0, Bluetooth 802.15.4 GPIO, I2C, I2S, UART 8 dBm 1.7 V 3.6 V - 40 C + 85 C Reel, Cut Tape, MouseReel
Panasonic Industry 蓝牙模块 - 802.15.1 PAN B611 Chip Antenna Economy

PAN B611-1C Bluetooth 6.0, Bluetooth 802.15.4 GPIO, I2C, I2S, UART 8 dBm 1.7 V 3.6 V - 40 C + 85 C Reel, Cut Tape, MouseReel
Panasonic Industry 蓝牙模块 - 802.15.1 PAN B611 Bottom Pad Premium

PAN B611-1B Bluetooth 6.0, Bluetooth 802.15.4 GPIO, I2C, I2S, UART 8 dBm 1.7 V 3.6 V - 40 C + 85 C Reel, Cut Tape, MouseReel
Panasonic Industry 蓝牙模块 - 802.15.1 PAN B611 Bottom Pad Economy

PAN B611-1B Bluetooth 6.0, Bluetooth 802.15.4 GPIO, I2C, I2S, UART 8 dBm 1.7 V 3.6 V - 40 C + 85 C Reel, Cut Tape, MouseReel
Microchip Technology 蓝牙模块 - 802.15.1 SmartConnect WINC3400-MR210CA Module

I2C, SPI, UART 18.3 dBm 1 Mb/s, 2 Mb/s, 5.5 Mb/s, 11 Mb/s, 6 Mb/s, 9 Mb/s, 12 Mb/s, 18 Mb/s, 24 Mb/s, 36 Mb/s, 48 Mb/s, 54 Mb/s 2.4 GHz 2.7 V 3.6 V - 40 C + 85 C
Microchip Technology 蓝牙模块 - 802.15.1 SmartConnect WINC3400-MR210CA Module Tape and Reel

I2C, SPI, UART 18.3 dBm 1 Mb/s, 2 Mb/s, 5.5 Mb/s, 11 Mb/s, 6 Mb/s, 9 Mb/s, 12 Mb/s, 18 Mb/s, 24 Mb/s, 36 Mb/s, 48 Mb/s, 54 Mb/s 2.4 GHz 2.7 V 3.6 V - 40 C + 85 C
Microchip Technology 蓝牙模块 - 802.15.1 SmartConnect WINC3400-MR210UA Module

I2C, SPI, UART 18.3 dBm 1 Mb/s, 2 Mb/s, 5.5 Mb/s, 11 Mb/s, 6 Mb/s, 9 Mb/s, 12 Mb/s, 18 Mb/s, 24 Mb/s, 36 Mb/s, 48 Mb/s, 54 Mb/s 2.4 GHz 2.7 V 3.6 V - 40 C + 85 C
Microchip Technology 蓝牙模块 - 802.15.1 SmartConnect WINC3400-MR210UA Module Tape and Reel

I2C, SPI, UART 18.3 dBm 1 Mb/s, 2 Mb/s, 5.5 Mb/s, 11 Mb/s, 6 Mb/s, 9 Mb/s, 12 Mb/s, 18 Mb/s, 24 Mb/s, 36 Mb/s, 48 Mb/s, 54 Mb/s 2.4 GHz 2.7 V 3.6 V - 40 C + 85 C
Microchip Technology 蓝牙模块 - 802.15.1 Bluetooth Low Energy/15.4 Combo Module with PCB Antenna

ADC, GPIO, I2C, PWM, QSPI, RS485, SPI, USART 5 dBm 2 Mb/s 2.4 GHz 1.9 V 3.6 V - 40 C + 85 C Tray
Microchip Technology 蓝牙模块 - 802.15.1 Bluetooth Low Energy/15.4 Combo Module with u.FL Antenna

ADC, GPIO, I2C, PWM, QSPI, RS485, SPI, USART 5 dBm 2 Mb/s 2.4 GHz 1.9 V 3.6 V - 40 C + 85 C Tray
Silicon Labs 蓝牙模块 - 802.15.1 Low Energy 5.4 Wireless Gecko Bluetooth Module

BGM260P Bluetooth v5.4 Class 2 ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 10 dBm 2 Mb/s 2.4 GHz 1.8 V 3.8 V - 40 C + 125 C Reel
Silicon Labs 蓝牙模块 - 802.15.1 Low Energy 5.4 Wireless Gecko Bluetooth Module

BGM260P Bluetooth v5.4 Class 2 ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 19.5 dBm 2 Mb/s 2.4 GHz 1.8 V 3.8 V - 40 C + 125 C Reel, Cut Tape
Panasonic Industry 蓝牙模块 - 802.15.1 PAN1326 CC2564 HCI BT+BLE Antenna +85 (Texas Instruments CC2560)
无库存交货期 18 周
最低: 1
倍数: 1
: 500

PAN1326 BLE, Bluetooth 4.0 + EDR I2C, UART 10 dBm 2.178 Mb/s - 93 dBm 2.44 GHz 1.7 V 4.8 V - 40 C + 85 C Reel, Cut Tape, MouseReel
Infineon Technologies 蓝牙模块 - 802.15.1 BTBLE IOT BLE

BLE, Bluetooth 5.0 I2C, SPI, UART 4 dBm 2 Mb/s - 101 dBm 2.4 GHz to 2.5 GHz 1.7 V 3.3 V - 40 C + 85 C Reel