结果: 305
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - 蜂窝、Nbiot、LTE 协议 - GPS、GLONASS 协议 - Sub GHz 协议 - WiFi - 802.11 协议 - ANT、Thread、Zigbee - 802.15.4 产品 封装
CEL 多协议模块 WiFi bgn BT5 BT Mesh PCB Antenna BULK 20库存量
最低: 1
倍数: 1

CMP4010 2.4 GHz 18 dBm GPIO, I2C, I2S, SDIO, SPI, UART, USB 3.3 V 3.3 V PCB 16.7 mm x 26.3 mm Bluetooth 5.0 Mesh 802.11 b/g/n Bulk
CEL 多协议模块 WiFi bgn BT5 BT Mesh RF Connector BULK 20库存量
最低: 1
倍数: 1

CMP4010 2.4 GHz 18 dBm GPIO, I2C, I2S, SDIO, SPI, UART, USB 3.3 V 3.3 V PCB 16.7 mm x 26.3 mm Bluetooth 5.0 Mesh 802.11 b/g/n Bulk
CEL 多协议模块 RTL8721, Dual Band, WiFi+BLE, MFH4, BULK 5库存量
最低: 1
倍数: 1

CMP4020 2.4 GHz, 5 GHz 18 dBm GPIO, I2C, I2S, SDIO, SPI, UART, USB 3 V 3.6 V - 40 C + 85 C Bluetooth 5.1 Bulk
CEL 多协议模块 CMP4020-2 BULK 20库存量
最低: 1
倍数: 1

CMP4020 2.4 GHz, 5 GHz 18 dBm GPIO, I2C, I2S, SDIO, SPI, UART, USB 3 V 3.6 V - 40 C + 85 C Bluetooth 5.1 Bulk
CEL 多协议模块 ZB/Thread/BT, +20dBm, 1.64Mb, Antenna BULK 3库存量
最低: 1
倍数: 1

2.4 GHz 20 dBm ADC, GPIO, I2C, QSPI, SPI, UART, USB 3.3 V 3.3 V - 40 C + 85 C PCB 16.7 mm x 26.3 mm Bluetooth 5.0 Thread, Zigbee Bulk
CEL 多协议模块 Wi-Fi 6 BT/BLE5.2 SDIO I-Temp PCB Antenna 39库存量
最低: 1
倍数: 1

CMP961X 2.4 GHz, 5 GHz SPI, UART Bluetooth Bulk
Texas Instruments 多协议模块 SimpleLink multipro tocol 2.4-GHz wirele
1,900预期 2026/9/18
最低: 1
倍数: 1
: 2,000

CC2651R3SIPA 2.4 GHz 5 dBm I2C, I2S, SPI, SSI, UART 1.8 V 3.8 V - 40 C + 105 C External, Integrated 7 mm x 7 mm BLE Thread, Zigbee Multiprotocol Modules Reel, Cut Tape, MouseReel
Silicon Labs 多协议模块 Wireless gecko multi-protocol module, +20 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, built-in antenna, certified.
1,000在途量
最低: 1
倍数: 1

MGM210P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Bluetooth Modules Cut Tape
Silicon Labs 多协议模块 MGM210P Wireless Gecko Multiprotocol Module, PCB, Secure Vault, +20 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin
800预期 2026/11/6
最低: 1
倍数: 1

2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Bluetooth Modules Cut Tape
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
998预期 2026/9/18
最低: 1
倍数: 1
: 1,000

MGM240P 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Multiprotocol Wireless Module Reel, Cut Tape
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
1,000预期 2026/9/25
最低: 1
倍数: 1
: 1,000

MGM240P 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Multiprotocol Wireless Module Reel, Cut Tape
Silicon Labs 多协议模块 SiWN917Y NCP Module Wi-Fi 6 2.4 GHz Bluetooth LE 5.4 No Antenna, 4MB Flash in IC package?
200在途量
最低: 1
倍数: 1

SIWG917Y I2C, SPI, UART, USART 1.71 V 3.63 V - 40 C + 85 C Cut Tape
Digi 多协议模块 Digi XBee 3 Global LTE-M/NB-IoT, GNSS, 2G fallback, Telit ME310G1-WW, AT&T SIM
25预期 2027/2/19
最低: 1
倍数: 1

XBee 3 I2C, SPI, UART 3.3 V 4.3 V - 40 C + 85 C u.FL 24.38 mm x 32.94 mm
Silicon Labs 多协议模块 802.11 b/g/n dual-band (2.4/5 GHz), dual-mode Bluetooth 5 Wi-Fi Modules
99预期 2027/11/30
最低: 1
倍数: 1

2.4 GHz, 5.8 GHz Bluetooth 5.0 802.11 a/b/g/n WiFi Modules Tray
Silicon Labs 多协议模块 MGM220P wireless gecko
188预期 2026/9/18
最低: 1
倍数: 1

2.4 GHz 8 dBm Bluetooth, GPIO, I2C, UART 1.8 V 3.8 V - 40 C + 105 C Built-In 15 mm x 12.9 mm Bluetooth 5.2, Bluetooth Mesh Zigbee Bluetooth 5.4, Bluetooth Mesh, Zigbee Cut Tape
Silicon Labs 多协议模块 Multiprotocol module, 2,4 GHz w/PCB antenna, +10 dBm, 1.5MB Flash, 192kB RAM, Secure Vault Mid, Certified
99预期 2026/9/17
最低: 1
倍数: 1

MGM240L 2.4 GHz Cut Tape
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 98库存量
200预期 2026/10/2
最低: 1
倍数: 1

MGM240P 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Multiprotocol Wireless Module Cut Tape
NXP Semiconductors 多协议模块 IW611HN/A1C
25预期 2026/10/29
最低: 1
倍数: 1
: 2,000

IW611HN GPIO, I2S, SDIO, UART - 40 C + 85 C Bluetooth 5.2 802.11 az Bluetooth Modules Reel, Cut Tape
NXP Semiconductors 多协议模块 IW612HN/A1I
100预期 2026/10/29
最低: 1
倍数: 1
: 2,000

IW612HN 2.4 GHz, 5 GHz I2S Bluetooth 5.2 Bluetooth Modules Reel, Cut Tape
Silex Technology 多协议模块 [Sample SKU] SX-PCEAC2 is a 2.4 GHz / 5GHz dual band IEEE802.11 a/b/g/n/ac WLAN, Bluetooth 5.0 BR/EDR/LE module based and Low power PCI express interface on Qualcomm QCA6174A-5 chipset. This SKU is the M.2 1630 PCI-E card type. Ideal for low quantity
128预期 2027/4/29
最低: 1
倍数: 1

SX-PCEAC2 2.4 GHz, 5 GHz PCIe, USB 3.135 V 3.465 V - 20 C + 70 C MHF4 30 mm x 16.5 mm x 2.34 mm Bluetooth 5.0 802.11 a/b/g/n/ac Bulk
Silex Technology 多协议模块 Wi-Fi+BLE Mod 2 ufl connect SamPck
173在途量
最低: 1
倍数: 1

SX-SDMAC 2.4 GHz, 5 GHz Bluetooth 5.0 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, Bluetooth 5.0 Cut Tape
Lantronix 多协议模块 TRACKER FOX3-4G-C1-EU-BLE-EUROPE - 4G CAT1 20, 3, 7 -2G FB BAND 8, 3 - GNSS - ACCELEROMETER, INT & EXT ANT - BT LE 4.1 - MINI SIM - 2 X RS232 - 3 I/O - I2C - RTC - 1 WIRE - MINI USB - AVL SOFTWARE 无库存交货期 8 周
最低: 1
倍数: 1

FOX 3 Bulk
Microchip Technology 多协议模块 Wi-Fi + Bluetooth LE Module, Chip Antenna 交货期 20 周
最低: 1
倍数: 1

2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
Texas Instruments 多协议模块 TI WiLink8 SGL-Band Combo Mod A 595-WL18 A 595-WL1801MODGBMOCT 无库存交货期 26 周
最低: 1,200
倍数: 1,200
: 1,200

WL1801MOD 2.4 GHz - 20 C + 70 C BLE, Bluetooth 5.1 802.11 b/g/n WiFi Modules Reel
Texas Instruments 多协议模块 TI WiLink8 SGL-Band Combo Mod A 595-WL18 A 595-WL1805MODGBMOCT 无库存交货期 26 周
最低: 1,200
倍数: 1,200
: 1,200

WL1805MOD 2.4 GHz - 20 C + 70 C BLE, Bluetooth 5.1 802.11 b/g/n WiFi Modules Reel