+ 105 C 多协议模块

结果: 99
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - Sub GHz 协议 - WiFi - 802.11 协议 - ANT、Thread、Zigbee - 802.15.4 封装
Espressif Systems 多协议模块 SMD module, ESP32-C3FH4, PCB antenna, -40C - +105C 30库存量
最低: 1
倍数: 1

2.4 GHz 20.5 dBm GPIO, I2C, I2S, SPI, UART 2.7 V 3.6 V - 40 C + 105 C PCB 13.2 mm x 16.6 mm x 2.4 mm Bluetooth 802.11 b/g/n Reel, Cut Tape
Ezurio 多协议模块 BL5340 series - Multi-Core / Protocol Bluetooth + 802.15.4 + NFC Module (Nordic nRF52340) - Integrated Antenna (Tape/Reel)
5,000在途量
最低: 1
倍数: 1
: 1,000

BL5340 2.4 GHz 3 dBm ADC, GPIO, I2C, I2S, SPM, UART, USB 1.7 V 5.5 V - 40 C + 105 C Integrated 15 mm x 10 mm x 2 mm Bluetooth LE NFC 802.15.4 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
8,000预期 2026/10/8
最低: 1
倍数: 1
: 1,000

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape, MouseReel
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
2,995预期 2026/9/4
最低: 1
倍数: 1
: 1,000

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape
Espressif Systems 多协议模块 SMD Module, ESP32-H2FH4S, Chip revision v1.2 and above, 4 MB SPI flash, PCB antenna, -40 C +105 C. Required ESP-IDF version: v5.1.6 and v5.2.5, v5.3.3 (expected on 3/27), v5.4.1 (expected on 4/4), and above
5,200在途量
最低: 1
倍数: 1

2.402 GHz to 2.48 GHz 20 dBm SPI 3 V 3.6 V - 40 C + 105 C 16.6 mm x 13.2 mm x 2.4 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee)
Ezurio 多协议模块 Module, BL54H20, Bluetooth LE, Chip Antenna, Tape and Reel
984预期 2026/7/21
最低: 1
倍数: 1
: 1,000

BL54H20 UART 1.71 V 1.98 V - 40 C + 105 C Chip 13.5 mm x 10 mm x 1.8 mm Bluetooth 5.4 802.15.4 Reel, Cut Tape
Ezurio 多协议模块 Module, BL54H20, Bluetooth LE, MHF4, Tape and Reel
986预期 2026/7/21
最低: 1
倍数: 1
: 1,000

BL54H20 UART 1.71 V 1.98 V - 40 C + 105 C MHF4 13.5 mm x 10 mm x 1.8 mm Bluetooth 5.4 802.15.4 Reel, Cut Tape
Ezurio 多协议模块 Module, BL54L15, Bluetooth LE, Chip Antenna, Cut Tape
1,544预期 2026/12/2
最低: 1
倍数: 1

BL54L15u 8 dBm I2S, SPI, UART 1.7 V 3.6 V - 40 C + 105 C 7.9 mm x 6.3 mm x 1.75 mm Bluetooth LE 802.15.4 Cut Tape
Espressif Systems 多协议模块 ESP32-C3-MINI-1 and ESP32-C3-MINI-1U are two general-purpose Wi-Fi and Bluetooth LE modules. The rich set of peripherals and a small size make the two modules an ideal choice for smart homes, industrial automation, health care, consumer electronics, 7,135库存量
6,500预期 2026/9/29
最低: 1
倍数: 1

2.4 GHz 20.5 dBm I2C, SPI, UART 3 V 3.6 V - 40 C + 105 C PCB 13.2 mm x 16.6 mm x 2.4 mm Bluetooth 5.0 802.11 b/g/n
u-blox 多协议模块 88W8987, 802.11ac+BT, 2 ant pins, -40 to +85C
500预期 2026/11/2
最低: 1
倍数: 1
: 500

2.4 GHz, 5 GHz 19 dBm GPIO, SDIO, UART 2.8 V 5.5 V - 40 C + 105 C RF 19.8 mm x 13.8 mm Bluetooth 5.2 802.11 a/b/g/n/ac Reel, Cut Tape
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
1,070预期 2026/9/4
最低: 1
倍数: 1

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Cut Tape

Silicon Labs 多协议模块 Wireless bluetooth SiP module, Secure Boot with Root of Trust and Secure Loader(RTSL), 78 MHz, 10 dBm
1,300预期 2026/8/13
最低: 1
倍数: 1

xGM240S 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C Built-In, RF 7 mm x 7 mm x 1.18 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Tray
Silicon Labs 多协议模块 MGM220P wireless gecko
188预期 2026/10/2
最低: 1
倍数: 1

2.4 GHz 8 dBm Bluetooth, GPIO, I2C, UART 1.8 V 3.8 V - 40 C + 105 C Built-In 15 mm x 12.9 mm Bluetooth 5.2, Bluetooth Mesh Zigbee Cut Tape
u-blox 多协议模块 Automotive grade host-based Wi-Fi 5 and Bluetooth 5.2 module, -40 C to +105 C 无库存交货期 26 周
最低: 500
倍数: 100

JODY-W2 2.4 GHz, 5 GHz 19 dBm GPIO, SDIO, UART 2.8 V 5.5 V - 40 C + 105 C RF 19.8 mm x 13.8 mm Bluetooth 5.2 Reel
u-blox 多协议模块 RTL8720DF, 802.11abgn+BLE, PCB antenna, open CPU 无库存交货期 18 周
最低: 1
倍数: 1
: 500

NORA-W30 32.768 kHz 3 V 3.6 V - 40 C + 105 C PCB Antenna 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
Texas Instruments 多协议模块 SimpleLink multipro tocol 2.4-GHz wirele 无库存交货期 26 周
最低: 1
倍数: 1
: 2,000

CC2651R3SIPA 2.4 GHz 5 dBm I2C, I2S, SPI, SSI, UART 1.8 V 3.8 V - 40 C + 105 C External, Integrated 7 mm x 7 mm BLE Thread, Zigbee Reel, Cut Tape, MouseReel
Silicon Labs 多协议模块 MGM220P wireless gecko 无库存交货期 20 周
最低: 1,000
倍数: 1,000
: 1,000

2.4 GHz 8 dBm Bluetooth, GPIO, I2C, UART 1.8 V 3.8 V - 40 C + 105 C Built-In 15 mm x 12.9 mm Bluetooth 5.2, Bluetooth Mesh Zigbee Reel
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 无库存交货期 20 周
最低: 1
倍数: 1

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Silicon Labs 多协议模块 802.15.4 Module, SiP, Secure Boot with Root of Trust and Secure Loader (RTSL), +6.5 dBm, 2.4 GHz, 768kB flash, 64kB RAM, -40 to +105 C, 26 GPIO, Certified 无库存交货期 20 周
最低: 2,500
倍数: 2,500
: 2,500

MGM270S 76.8 MHz - 40 C + 105 C 6.5 mm x 6.5 mm x 1.3 mm Bluetooth Reel
Quectel 多协议模块 Wi-Fi 4, 2.4GHz, BLE5.2, QuecOpen for Matter (pin compatible w/ TUYA LC9), 2MB Flash, Ceramic antenna, -40 105C 无库存交货期 8 周
最低: 500
倍数: 500
: 500

2.4 GHz ADC, GPIO, PWM 3 V 3.6 V - 40 C + 105 C 16.8 mm x 15 mm x 1.85 mm Bluetooth 5.2 802.11 b/g/n Reel
Quectel 多协议模块 Wi-Fi 4, 2.4GHz, BLE5.2, QuecOpen for Matter (pin compatible w/ TUYA LC9), 4MB Flash, Ceramic antenna, -40 105C 无库存交货期 8 周
最低: 500
倍数: 500
: 500

2.4 GHz ADC, GPIO, PWM 3 V 3.6 V - 40 C + 105 C 16.8 mm x 15 mm x 1.85 mm Bluetooth 5.2 802.11 b/g/n Reel
Quectel 多协议模块 无库存交货期 5 周
最低: 1
倍数: 1

2.4 GHz ADC, GPIO, PWM 3 V 3.6 V - 40 C + 105 C 16.8 mm x 15 mm x 1.85 mm Bluetooth 5.2 802.11 b/g/n
Quectel 多协议模块 Wi-Fi 4, 2.4GHz, BLE5.2, QuecOpen for Matter, 2MB Flash, PCB antenna 无库存交货期 8 周
最低: 500
倍数: 500
: 500

2.4 GHz ADC, GPIO, PWM 3 V 3.6 V - 40 C + 105 C 17.3 mm x 15 mm x 2.8 mm Bluetooth 5.2 802.11 b/g/n Reel
Quectel 多协议模块 Wi-Fi 4, 2.4GHz, BLE5.2, QuecOpen for Matter, 4MB Flash, PCB antenna 无库存交货期 8 周
最低: 500
倍数: 500
: 500

2.4 GHz ADC, GPIO, PWM 3 V 3.6 V - 40 C + 105 C 17.3 mm x 15 mm x 2.8 mm Bluetooth 5.2 802.11 b/g/n Reel
Quectel 多协议模块 无库存交货期 5 周
最低: 1
倍数: 1

2.4 GHz ADC, GPIO, PWM 3 V 3.6 V - 40 C + 105 C 17.3 mm x 15 mm x 2.8 mm Bluetooth 5.2 802.11 b/g/n