- 40 C SMD/SMT 多协议模块

结果: 257
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数量 RoHS ECAD模型 系列
频率
输出功率
接口类型
电源电压-最小
电源电压-最大
最小工作温度
最大工作温度
天线连接器类型
尺寸
协议 - 蓝牙、BLE - 802.15.1
协议 - 蜂窝、Nbiot、LTE
协议 - GPS、GLONASS
协议 - Sub GHz
协议 - WiFi - 802.11
协议 - ANT、Thread、Zigbee - 802.15.4
封装
Silicon Labs 多协议模块 SiWG917Y SoC Module Wi-Fi 6 2.4 GHz Bluetooth LE 5.4 No Antenna, 8MB Flash in IC package?
数据表

SIWG917Y I2C, SPI, UART, USART 1.71 V 3.63 V - 40 C + 85 C Reel
Silicon Labs 多协议模块 SiWG917Y SoC Module Wi-Fi 6 2.4 GHz Bluetooth LE 5.4 Integrated Antenna, 2MB PSRAM in IC package, 8MB Flash in module
数据表

SIWG917Y I2C, SPI, UART, USART 1.71 V 3.63 V - 40 C + 85 C Reel, Cut Tape
Silicon Labs 多协议模块 SiWN917Y NCP Module Wi-Fi 6 2.4 GHz Bluetooth LE 5.4 Integrated Antenna, 4MB Flash in IC package?
数据表

SIWG917Y I2C, SPI, UART, USART 1.71 V 3.63 V - 40 C + 85 C Reel
Silicon Labs 多协议模块 SiWN917Y NCP Module Wi-Fi 6 2.4 GHz Bluetooth LE 5.4 No Antenna, 4MB Flash in IC package?
数据表

SIWG917Y I2C, SPI, UART, USART 1.71 V 3.63 V - 40 C + 85 C Reel
NXP Semiconductors 多协议模块 IW610BHN/A1ZDI
数据表

IW610BHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Reel
NXP Semiconductors 多协议模块 IW610CHN/A1ZDI
数据表

IW610CHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Reel
NXP Semiconductors 多协议模块 IW610FHN/A1ZDI
数据表

IW610FHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Tray
NXP Semiconductors 多协议模块 IW610GHN/A1ZDI
数据表

IW610GHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Reel, Cut Tape
Murata Electronics 多协议模块
数据表

2.4 GHz, 5 GHz 19 dBm UART 1.71 V 4.8 V - 40 C + 85 C 7.9 mm x 7.3 mm x 1.1 mm Bluetooth WiFi Reel
Murata Electronics 多协议模块
数据表

2.4 GHz, 5 GHz, 6 GHz 8 dBm UART 1.71 V 4.8 V - 40 C + 85 C 12.5 mm x 9.4 mm x 1.2 mm Bluetooth WiFi Reel
Texas Instruments 多协议模块 SimpleLink Wi-Fi 6 c ompanion module
数据表
否
CC3300MOD 2.412 GHz to 2.472 GHz 18.4 dBm SPI, UART 1.62 V, 2.97 V 1.98 V, 3.63 V - 40 C + 85 C 11 mm x 11 mm Bluetooth Wi-Fi 6, 802.11ax Reel, Cut Tape, MouseReel
Texas Instruments 多协议模块 SimpleLink dual-band (2.4GHz and 5GHz) W
数据表
否
CC3351MOD 2.41 GHz to 2.47 GHz 18.3 dBm SPI - 40 C + 85 C 10.9 mm x 10.9 mm x 2.1 mm Bluetooth WiFi Reel, Cut Tape, MouseReel
Silicon Labs 多协议模块 SiWG917Y SoC Module Wi-Fi 6 2.4 GHz Bluetooth LE 5.4 No Antenna, 2MB PSRAM in package
数据表

SIWG917Y I2C, SPI, UART, USART 1.71 V 3.63 V - 40 C + 85 C Reel, Cut Tape
Silex Technology 多协议模块 Based on NXP's RW610, IM-100 is a small, stand-alone, dual-band Wi-Fi 6
数据表

260 MHz I2C, SPI, UART - 40 C + 85 C MHF 18 mm x 17 mm x 2.65 mm 802.11 a/b/g/n/ac/ax Reel
Silex Technology 多协议模块 IM-100 is a small, stand-alone, dual-band Wi-Fi 6 and Bluetooth Low Energy
数据表

260 MHz I2C, SPI, UART - 40 C + 85 C MHF 18 mm x 17 mm x 2.65 mm 802.11 a/b/g/n/ac/ax Cut Tape
Silex Technology 多协议模块 the option to attach an antenna via a trace. does not include the u.Fl connector
数据表

260 MHz I2C, SPI, UART - 40 C + 85 C 18 mm x 17 mm x 2.65 mm 802.11 a/b/g/n/ac/ax Reel
Silex Technology 多协议模块 the option to attach an antenna via a trace does not include the u.Fl connector
数据表

260 MHz I2C, SPI, UART - 40 C + 85 C 18 mm x 17 mm x 2.65 mm 802.11 a/b/g/n/ac/ax Cut Tape
Quectel 多协议模块 Wi-Fi 6 and Bluetooth 5.4, Max data rate 600.5Mbps, LCC form factor, -40C to +85C
数据表

FCS960K 2.4 GHz, 5 GHz 4 dBm, 18 dBm UART, USB 3 V 3.6 V - 40 C + 85 C 12 mm x 12 mm x 2 mm Bluetooth Wi-Fi Reel
Quectel 多协议模块 Wi-Fi 6, dual band (2.4 GHz/5 GHz) + Zigbee/Thread + BLE 5.3, ARM Cortex-M33, 260MHz, 8MB Flash, 1.2MB RAM, Antenna: PCB, -40 85C, ultra-compact LCC
数据表
2.4 GHz, 5 GHz I2C, SPI 3.14 V 3.46 V - 40 C + 85 C 25.5 mm x 18 mm x 3.16 mm Reel
Quectel 多协议模块 Dual-band Wi-Fi 6e module, supporting Bluetooth 5.4,2.4 GHz + 5 GHz + 6 GHz,-45 C +85 C
数据表

FCS963N-LP 2.4 GHz, 5 GHz 7.5 dBm, 19 dBm UART 3 V 4.8 V - 40 C + 85 C 12 mm x 12 mm x 1.55 mm Bluetooth Wi-Fi Reel
Quectel 多协议模块 Wi-Fi 6 (2.4GHz/5GHz), IEEE 802.11a/b/g/n/ac/ax, BLE 5.4, Thread 802.15.4, Antenna 1 1 (1T1R), 2 antennas, Wi-Fi & Bluetooth application: USB 2.0, -40C +85C
数据表
2.4 GHz, 5 GHz SPI, UART, USB 3.14 V 3.46 V - 40 C + 85 C PCB Antenna 23 mm x 14 mm x 2.2 mm BLE 5.4 802.11 a/b/g/n/ac/ax Reel
Quectel 多协议模块 Wi-Fi 6, 802.11a/ b/ g/ n/ ac/ ax, 2 2 (2T2R), 2.4/ 5 GHz dual-band, PCIe interface, 2 antennas (BT 5.2 shares 1 Wi-Fi antenna), -40 C to +85 C, M.2 FF
数据表
2.4 GHz, 5 GHz PCIe, UART 3 V 3.6 V - 40 C + 85 C 22 mm x 30 mm x 2.85 mm Bluetooth 5.2 802.11a/b/g/n/ac/ax Tray
Quectel 多协议模块 Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 768 KB Flash, 64 KB SRAM, up to 20dBm, Antenna: PCB
数据表
80 MHz 20 dBm I2C, I2S, SPI, UART 1.71 V 3.8 V - 40 C + 85 C RF Coaxial Connector 20 mm x 12 mm x 2.2 mm BLE 5.3 Zigbee 3.0 Reel
Quectel 多协议模块 Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 768 KB Flash, 64 KB SRAM, up to 20dBm, Antenna: 1st gen RF coax
数据表
80 MHz 20 dBm I2C, I2S, SPI, UART 1.71 V 3.8 V - 40 C + 85 C PCB Antenna 20 mm x 12 mm x 2.2 mm BLE 5.3 Zigbee 3.0 Reel
Quectel 多协议模块 Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 1024 KB Flash, 96 KB SRAM, up to 20dBm, Antenna: PCB
数据表
80 MHz 20 dBm I2C, I2S, SPI, UART 1.71 V 3.8 V - 40 C + 85 C RF Coaxial Connector 20 mm x 12 mm x 2.2 mm BLE 5.3 Zigbee 3.0 Reel