- 40 C 多协议模块

结果: 702
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - 蜂窝、Nbiot、LTE 协议 - GPS、GLONASS 协议 - Sub GHz 协议 - WiFi - 802.11 协议 - ANT、Thread、Zigbee - 802.15.4 资格 封装
Espressif Systems 多协议模块 SMD module, ESP32-S3R2 with 2 MB PSRAM die inside, 8 MB SPI flash, IPEX antenna connector.
6,226预期 2026/8/11
最低: 1
倍数: 1

2.4 GHz 20.5 dBm GPIO, I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 19.2 mm x 18 mm x 3.2 mm Bluetooth 5.0 802.11 b/g/n Bulk
Espressif Systems 多协议模块 SMD Module ESP32-WROOM-32E, ESP32-D0WD-V3, 8 MB SPI flash, PCB antenna
18,829预期 2026/9/14
最低: 1
倍数: 1
: 650

ESP32-WROOM 2.4 GHz 19.5 dBm I2C, I2S, PWM, SDIO, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 18 mm x 25.5 mm x 3.1 mm BLE, Bluetooth 4.2 802.11 b/g/n Reel, Cut Tape, MouseReel
u-blox 多协议模块 nRF52840, U.FL+antenna pin, PA, LNA, open CPU
5,243在途量
最低: 1
倍数: 1
: 1,000

BMD-340 2.36 GHz to 2.5 GHz 18 dBm GPIO, I2C, I2S, UART, USB 2 V 3.6 V - 40 C + 85 C Bluetooth 5.0 802.15.4 Reel, Cut Tape
u-blox 多协议模块 88W8987, 802.11ac+BT, 2 ant pins, -40 to +85C
2,000在途量
最低: 1
倍数: 1
: 500

2.4 GHz, 5 GHz 19 dBm GPIO, SDIO, UART 2.8 V 5.5 V - 40 C + 105 C RF 19.8 mm x 13.8 mm Bluetooth 5.2 802.11 a/b/g/n/ac Reel, Cut Tape
u-blox 多协议模块 M.2 card with JODY-W377, in tray
1,093在途量
最低: 1
倍数: 1

JODY-W3 2.4 GHz, 5 GHz 19 dBm I2S, PCIe, SDIO, UART 1.8 V 3.3 V - 40 C + 85 C u.FL 22 mm x 30 mm x 4.2 mm Bluetooth 5.3 Tray
u-blox 多协议模块 IW611, 802.11ax+BT, 1 PCB antenna or antenna pin
2,612在途量
最低: 1
倍数: 1
: 500

MAYA-W2 18 dBm SPI - 40 C + 85 C PCB Antenna 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
u-blox 多协议模块 ESP32, 802.11bgn+BT, metal antenna, open CPU
2,457在途量
最低: 1
倍数: 1
: 500

NINA-W10 2.4 GHz I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C 10 mm x 14 mm x 3.8 mm Reel, Cut Tape
u-blox 多协议模块 ESP32, 802.11bgn+BT, metal antenna, u-connectXpress
3,840在途量
最低: 1
倍数: 1
: 500

NINA-W15 2.4 GHz 8 dBm, 18 dBm GPIO, I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C u.FL Bluetooth 802.11 b/g/n Reel, Cut Tape
STMicroelectronics 多协议模块 Ultra-low-power dual core MCU 64 MHz Cortex-M0+ 32MHz 1 Mbyte Bluetooth LE
19,800预期 2027/2/12
最低: 1
倍数: 1
: 1,800

STM32WB 2.4 GHz 6 dBm I2C, USART, USB 1.7 V 3.6 V - 40 C + 85 C Chip 7.3 mm x 11 mm x 1.34 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape, MouseReel

Texas Instruments 多协议模块 WL18xxMOD Dual-Band Ind Mod A 595-WL1837 A 595-WL1837MODGIMOCR
500预期 2026/11/5
最低: 1
倍数: 1
: 250

WL1837MOD 2.4 GHz, 5 GHz 17.3 dBm SDIO, UART 2.9 V 4.8 V - 40 C + 85 C RF 13.4 mm x 13.3 mm x 2 mm Bluetooth 5.1 802.11 a/b/g/n Reel, Cut Tape, MouseReel
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
8,000预期 2026/10/8
最低: 1
倍数: 1
: 1,000

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape, MouseReel
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
3,000预期 2026/9/4
最低: 1
倍数: 1
: 1,000

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape

Murata Electronics 多协议模块 Type 2AE Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 5.0
1,913在途量
最低: 1
倍数: 1
: 1,000

2AE 2.4 GHz, 5 GHz 17 dBm SDIO, UART, USB 1.62 V 3.63 V - 40 C + 85 C External 8 mm x 7.8 mm x 1.15 mm Bluetooth 5.2 802.11 a/b/g/n/ac Reel, Cut Tape
Telit Cinterion 多协议模块
329在途量
最低: 1
倍数: 1

I2C, SPI, UART 3.4 V 4.2 V - 40 C + 85 C 28.2 mm x 28.2 mm x 2.2 mm Bluetooth LTE WiFi Tray
Sierra Wireless 多协议模块 Reliable Cat-1 LTE connectivity for European 4G networks with 3G fallback
500预期 2026/11/23
最低: 1
倍数: 1
: 500

RC Series 900 MHz, 1.8 GHz GPIO, I2C, UART, USB - 40 C + 85 C 22 mm x 23 mm x 2.5 mm 4G, 3G, 2G BeiDou, Galileo, Glonass, GPS, QZSS Reel, Cut Tape
Nordic Semiconductor 多协议模块 Lower Power SIP for cellular IoT and DECT NR+
25,886在途量
最低: 1
倍数: 1
: 2,000

nRF91 23 dBm I2C, I2S, SPI, UART, USB 3 V 5.5 V - 40 C + 85 C Reel, Cut Tape, MouseReel
Nordic Semiconductor 多协议模块 Lower Power SIP for cellular IoT and DECT NR+
1,890在途量
最低: 1
倍数: 1
: 100

nRF91 23 dBm I2C, I2S, SPI, UART, USB 3 V 5.5 V - 40 C + 85 C Reel, Cut Tape
Nordic Semiconductor 多协议模块 Low Power Cellular IoT SIP, LTE-M, NB-IoT, GNSS wireless modem
2,500预期 2026/12/25
最低: 1
倍数: 1
: 2,500

700 MHz to 2.2 GHz 23 dBm I2C, I2S, SPI, UART 3 V 5.5 V - 40 C + 85 C 16 mm x 10.5 mm x 1.04 mm DECT NR+, LTE Cat-M1/NB1/NB2 GPS, QZSS Reel, Cut Tape
Espressif Systems 多协议模块 ESP32-C5-WROOM-1 and ESP32-C5-WROOM-1U are two general-purpose 2.4 and 5 GHz dual-band Wi-Fi 6(802.11ax), Bluetooth 5 (LE), Zigbee, and Thread (802.15.4) modules.
1,930预期 2026/8/17
最低: 1
倍数: 1

2.4 GHz, 5 GHz GPIO, I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 27.5 mm x 18 mm x 3.3 mm Bluetooth WiFi Thread, Zigbee
Embedded Artists 多协议模块 2EL M.2 Wi-Fi 6 a/b/g/n/ac/ax, Bluetooth 5.3 with IW612 chipset and LBES5PL2EL
225在途量
最低: 1
倍数: 1

2.4 GHz to 2.484 GHz 2.6 dBm SPI - 40 C + 85 C 802.11 a/b/g/n/ac/ax Bulk
CEL 多协议模块 RTL8721, Dual Band, WiFi+BLE, MFH4, BULK 5库存量
最低: 1
倍数: 1

CMP4020 2.4 GHz, 5 GHz 18 dBm GPIO, I2C, I2S, SDIO, SPI, UART, USB 3 V 3.6 V - 40 C + 85 C Bluetooth 5.1 Bulk
CEL 多协议模块 CMP4020-2 BULK 20库存量
最低: 1
倍数: 1

CMP4020 2.4 GHz, 5 GHz 18 dBm GPIO, I2C, I2S, SDIO, SPI, UART, USB 3 V 3.6 V - 40 C + 85 C Bluetooth 5.1 Bulk
CEL 多协议模块 CMP4020-3 BULK 50库存量
最低: 1
倍数: 1

CMP4020 2.4 GHz, 5 GHz 18 dBm GPIO, I2C, I2S, SDIO, SPI, UART, USB 3 V 3.6 V - 40 C + 85 C Bluetooth 5.1 Bulk
CEL 多协议模块 ZB/Thread/BT, +20dBm, 1.64Mb, Antenna BULK 3库存量
最低: 1
倍数: 1

2.4 GHz 20 dBm ADC, GPIO, I2C, QSPI, SPI, UART, USB 3.3 V 3.3 V - 40 C + 85 C PCB 16.7 mm x 26.3 mm Bluetooth 5.0 Thread, Zigbee Bulk
Silicon Labs 多协议模块 802.11 b/g/n dual-band (2.4/5 GHz), dual-mode Bluetooth 5 Wi-Fi Modules
2,357预期 2026/10/16
最低: 1
倍数: 1

2.4 GHz, 5 GHz 18 dBm SDIO, UART, USB 1.85 V 3.3 V - 40 C + 85 C External 9.8 mm x 9.1 mm x 1.6 mm Bluetooth 5.0 802.11 a/b/g/n Tray