Reel 多协议模块

结果: 756
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - 蜂窝、Nbiot、LTE 协议 - GPS、GLONASS 协议 - Sub GHz 协议 - WiFi - 802.11 协议 - ANT、Thread、Zigbee - 802.15.4 资格 产品 封装
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
4,000预期 2027/1/22
最低: 1
倍数: 1
: 1,000

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Multiprotocol Wireless Module Reel, Cut Tape, MouseReel

Murata Electronics 多协议模块 Type 2AE Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 5.0
3,976在途量
最低: 1
倍数: 1
: 1,000

2AE 2.4 GHz, 5 GHz 17 dBm SDIO, UART, USB 1.62 V 3.63 V - 40 C + 85 C External 8 mm x 7.8 mm x 1.15 mm Bluetooth 5.2 802.11 a/b/g/n/ac Reel, Cut Tape
Nordic Semiconductor 多协议模块 Lower Power SIP for cellular IoT and DECT NR+
4,100在途量
最低: 1
倍数: 1
: 100

nRF91 23 dBm I2C, I2S, SPI, UART, USB 3 V 5.5 V - 40 C + 85 C Reel, Cut Tape
Nordic Semiconductor 多协议模块 Low Power Cellular IoT SIP, LTE-M, NB-IoT, GNSS wireless modem
2,500预期 2026/12/25
最低: 1
倍数: 1
: 2,500

700 MHz to 2.2 GHz 23 dBm I2C, I2S, SPI, UART 3 V 5.5 V - 40 C + 85 C 16 mm x 10.5 mm x 1.04 mm DECT NR+, LTE Cat-M1/NB1/NB2 GPS, QZSS DECT NR+, GPS, LTE CatM1/NB1/NB2, QZSS Reel, Cut Tape
Fanstel 多协议模块 Opensource remote USB dongle with BT840XE,ANT000, and an USB cable for remote mounting to avoid obstruction.
85预期 2026/10/13
最低: 1
倍数: 1
: 32

Reel, Cut Tape
Ezurio 多协议模块 Module, Sterling LWB5+, MHF4
700预期 2026/9/18
最低: 1
倍数: 1
: 1,000

Sterling-LWB5+ 2.4 GHz, 5 GHz UART, USB 3.3 V 3.3 V - 40 C + 85 C 12 mm x 17 mm x 2.2 mm Bluetooth 5.2, Bluetooth LE WiFi 5, 802.11 ac Reel, Cut Tape, MouseReel
Ezurio 多协议模块 Sterling LWB+, MHF4, Tape and Reel
1,500预期 2026/10/2
最低: 1
倍数: 1
: 800

Sterling-LWB+ 2.4 GHz SDIO, UART 3.3 V 3.3 V - 40 C + 85 C 21 mm x 15.5 mm x 4 mm Bluetooth 5.2 WiFi 4, 802.11 b/g/n Reel, Cut Tape
Ezurio 多协议模块 Module, BL54L15, Bluetooth LE, Chip Antenna, Tape and Reel
1,000预期 2026/12/31
最低: 1
倍数: 1
: 1,000
BL54L15u 8 dBm I2S, SPI, UART 1.7 V 3.6 V - 40 C + 105 C 7.9 mm x 6.3 mm x 1.75 mm Bluetooth LE 802.15.4 Multiprotocol Modules Reel, Cut Tape
u-blox 多协议模块 RW612, 802.11ax+BLE+802.15.4, ant pin, open CPU, 16MB
495预期 2027/1/18
最低: 1
倍数: 1
: 250

2.4 GHz, 5 GHz 11 dBm 3.15 V 3.45 V - 40 C + 85 C Antenna Pin Bluetooth LE/IEEE 802.15.4 802.11 a/b/g/n/ac/ax Reel, Cut Tape, MouseReel
u-blox 多协议模块 IW612, 802.11ax+BT+802.15.4, 1 PCB antenna or ant. pin
958在途量
最低: 1
倍数: 1
: 500

MAYA-W2 18 dBm SPI - 40 C + 85 C PCB Antenna 14.3 mm x 10.4 mm x 1.9 mm Multiprotocol Modules Reel, Cut Tape, MouseReel
u-blox 多协议模块 Host-based dual-band Wi-Fi 6 and Bluetooth LE module for IoT, 1 antenna pin
500预期 2026/12/31
最低: 1
倍数: 1
: 500

MAYA-W4 2.4 GHz, 5 GHz 15 dBm, 18 dBm SPI, UART, USB 3.13 VDC 3.46 VDC - 40 C + 85 C Pin 14.3 mm x 10.4 mm x 1.9 mm Bluetooth and Wi-Fi Modules Reel, Cut Tape
u-blox 多协议模块 ESP32, 802.11bgn+BT, PCB antenna, u-connectXpress
497预期 2026/11/19
最低: 1
倍数: 1
: 500

NINA-W15 2.4 GHz 8 dBm, 18 dBm GPIO, I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C u.FL Bluetooth 802.11 b/g/n WiFi, BLE Modules Reel, Cut Tape
Texas Instruments 多协议模块 SimpleLink multipro tocol 2.4-GHz wirele
1,900预期 2026/9/18
最低: 1
倍数: 1
: 2,000

CC2651R3SIPA 2.4 GHz 5 dBm I2C, I2S, SPI, SSI, UART 1.8 V 3.8 V - 40 C + 105 C External, Integrated 7 mm x 7 mm BLE Thread, Zigbee Multiprotocol Modules Reel, Cut Tape, MouseReel
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
998预期 2026/9/18
最低: 1
倍数: 1
: 1,000

MGM240P 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Multiprotocol Wireless Module Reel, Cut Tape
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
1,000预期 2026/9/25
最低: 1
倍数: 1
: 1,000

MGM240P 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Multiprotocol Wireless Module Reel, Cut Tape
Murata Electronics 多协议模块 Type 1SJ Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 6.2
999预期 2027/12/8
最低: 1
倍数: 1
: 1,000

1SJ 868 MHz, 915 MHz 21.5 dBm UART - 40 C + 85 C 10 mm x 8 mm x 1.6 mm LoRa/LoRaWAN LoRa/LoRaWAN Reel, Cut Tape
NXP Semiconductors 多协议模块 IW611HN/A1C
25预期 2026/10/29
最低: 1
倍数: 1
: 2,000

IW611HN GPIO, I2S, SDIO, UART - 40 C + 85 C Bluetooth 5.2 802.11 az Bluetooth Modules Reel, Cut Tape
NXP Semiconductors 多协议模块 IW612HN/A1I
100预期 2026/10/29
最低: 1
倍数: 1
: 2,000

IW612HN 2.4 GHz, 5 GHz I2S Bluetooth 5.2 Bluetooth Modules Reel, Cut Tape
Murata Electronics 多协议模块 Type 2DL-921, Shielded Small Wi-Fi 11a/b/g/n/ac/ax + Bluetooth 5.3 Module
2,675在途量
最低: 1
倍数: 1
: 1,000

2DL 2.4 GHz, 5 GHz 18 dBm UART 1.71 V 3.46 V - 40 C + 85 C u.FL 8.8 mm x 7.7 mm x 1.3 mm Bluetooth 5.3 Bluetooth Modules Reel, Cut Tape, MouseReel
Murata Electronics 多协议模块 Type 1MW Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 5.0 Combo
2,000预期 2026/12/31
最低: 1
倍数: 1
: 1,000

MW 2.4 GHz, 5 GHz 17 dBm I2S, SDIO, UART 1.62 V 3.63 V - 30 C + 85 C External 7.9 mm x 7.3 mm x 1.1 mm Bluetooth 5.0 802.11 a/b/g/n/ac Reel, Cut Tape, MouseReel
Quectel 多协议模块 Cat 4 + 3G + 2G, 4Gbit ROM+2Gbit RAM, Support B5, EMEA, South Korea, Thailand, India
250在途量
最低: 1
倍数: 1
: 250

700 MHz to 960 MHz 33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.8 V 3.8 V - 35 C + 75 C External 32 mm x 29 mm x 2.4 mm LTE Cat 4 GNSS GNSS, LTE Cat 4 Reel, Cut Tape
Quectel 多协议模块 Cat 4 + 3G + 2G module, mPCIe form factor, EMEA, South Korea, Thailand, India
375在途量
最低: 1
倍数: 1
: 100

698 MHz to 960 MHz, 1.561 GHz, 1.575 GHz, 1.7 GHz to 2.7 GHz, 2.4 GHz to 2.5 GHz I2C, PCIe, PCM, UART, USB 2.0 3 V 3.6 V - 35 C + 75 C External 30 mm x 51 mm x 4.9 mm LTE Cat 4 GNSS GNSS, LTE Cat 4 Reel, Cut Tape
Quectel 多协议模块 Cat 1 + 3G + 2G, 1Gbit ROM+1Gbit RAM, Global
250在途量
最低: 1
倍数: 1
: 250

33 dBm ADC, I2C, PCM, SD Card, SGMII, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 GNSS GNSS, LTE Cat 1 Reel, Cut Tape
Quectel 多协议模块 Cat 4 + 3G + 2G, 1Gbit ROM+1Gbit RAM, EMEA only
743在途量
最低: 1
倍数: 1
: 250

ADC, I2C, PCM, SPI, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C 29 mm x 25 mm x 2.3 mm LTE Cat 4 GNSS GNSS, LTE Cat 4 Reel, Cut Tape
Murata Electronics 多协议模块 Type 1LV Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 5.0
1,000预期 2027/6/9
最低: 1
倍数: 1
: 1,000

1LV 2.4 GHz, 5 GHz 17 dBm SDIO, UART 1.62 V 1.98 V - 20 C + 70 C External 10 mm x 7.2 mm x 1.4 mm Bluetooth 5.0 802.11 a/b/g/n Reel, Cut Tape, MouseReel