semic 多协议模块

结果: 40
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描述 数据表 供货情况 单价（含13%增值税） 根据您的数量，按照单价筛选表格中的结果。
数量 RoHS ECAD模型 系列
频率
输出功率
接口类型
电源电压-最小
电源电压-最大
最小工作温度
最大工作温度
天线连接器类型
尺寸
协议 - 蓝牙、BLE - 802.15.1
协议 - 蜂窝、Nbiot、LTE
协议 - GPS、GLONASS
协议 - WiFi - 802.11
协议 - ANT、Thread、Zigbee - 802.15.4
封装
NXP Semiconductors 多协议模块 IW610BHN/A1ZDI
数据表
更多信息可用

IW610BHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Tray
NXP Semiconductors 多协议模块 IW610CHN/A1ZDI
数据表
更多信息可用

IW610CHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Tray
NXP Semiconductors 多协议模块 IW610FHN/A1ZDI
数据表
更多信息可用

IW610FHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Reel, Cut Tape
NXP Semiconductors 多协议模块 IW610GHN/A1ZDI
数据表

IW610GHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Reel, Cut Tape
NXP Semiconductors 多协议模块 IW610BHN/A1ZDI
数据表

IW610BHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Reel
NXP Semiconductors 多协议模块 IW610CHN/A1ZDI
数据表

IW610CHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Reel
NXP Semiconductors 多协议模块 AW693PHNB/A1ZDB

2.4 GHz, 5 GHz to 7 GHz UART 11 mm x 11 mm x 0.85 mm Bluetooth 5.3 Wi-Fi 6/6E Tray
NXP Semiconductors 多协议模块 IW610FHN/A1ZDI
数据表

IW610FHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Tray
Nordic Semiconductor 多协议模块 Ultra Low Power Cellular IoT SIP, LTE-M,NB-IoT, GNSS WL modem

Reel
Telink 多协议模块 Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
数据表

ML7 2.4 GHz to 2.483 GHz 8.5 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 85 C 35.29 mm x 18 mm x 2.6 mm Reel
Renesas / Dialog 多协议模块 Wi-Fi4/BLE combo - Single band 2.4GHz, 802.11 b/g/n, 8Mbyte Flash, PCB trace antenna
数据表

RRQ61051 160 MHz GPIO, I2C, I2S, SPI, UART 1.8 V 3.6 V - 40 C + 85 C PCB Antenna 20 mm x 15 mm x 3 mm Bluetooth 5.1 802.11 b/g/n Reel
Renesas / Dialog 多协议模块 Wi-Fi6/BLE combo - Single band 2.4GHz, 802.11 b/g/n/ax, 8Mbyte Flash, PCB trace antenna
数据表

RRQ61051 160 MHz GPIO, I2C, I2S, SPI, UART 1.8 V 3.6 V - 40 C + 85 C PCB Antenna 20 mm x 15 mm x 3 mm Bluetooth 5.1 802.11 a/b/g/n/ax Reel
Renesas / Dialog 多协议模块 Wi-Fi/BLE combo module, Wi-Fi6 Dual Band 2.4/5GHz 802.11 a/b/g/n/ax, 8Mbyte Flash, u.FL connector
数据表

RRQ61051 160 MHz GPIO, I2C, I2S, SPI, UART 1.8 V 3.6 V - 40 C + 85 C u.FL 20 mm x 15 mm x 3 mm Bluetooth 5.1 802.11 a/b/g/n/ax Reel
Renesas / Dialog 多协议模块 Wi-Fi/BLE combo module, Wi-Fi6 Dual Band 2.4/5GHz 802.11 a/b/g/n/ax, 8Mbyte Flash, RF antenna pin
数据表

RRQ61051 160 MHz GPIO, I2C, I2S, SPI, UART 1.8 V 3.6 V - 40 C + 85 C RF 20 mm x 15 mm x 3 mm Bluetooth 5.1 802.11 a/b/g/n/ax Reel
Renesas / Dialog 多协议模块 Wi-Fi/BLE combo module, Wi-Fi6 Dual Band 2.4/5GHz 802.11 a/b/g/n/ax, 8Mbyte Flash, PCB trace antenna
数据表

RRQ61051 160 MHz GPIO, I2C, I2S, SPI, UART 1.8 V 3.6 V - 40 C + 85 C PCB Antenna 20 mm x 15 mm x 3 mm Bluetooth 5.1 802.11 a/b/g/n/ax Reel, Cut Tape