92 多协议模块

结果: 1,637
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - 蜂窝、Nbiot、LTE 协议 - GPS、GLONASS 协议 - Sub GHz 协议 - WiFi - 802.11 协议 - ANT、Thread、Zigbee - 802.15.4 资格 封装
Espressif Systems 多协议模块 SMD module, ESP32-C3FH4X, Chip Revision v1.1 or above, PCB antenna, -40 C +85 C
10,392在途量
最低: 1
倍数: 1

Espressif Systems 多协议模块 SMD module, ESP32-S3R2 with 2 MB PSRAM die inside, 8 MB SPI flash, IPEX antenna connector.
6,201在途量
最低: 1
倍数: 1

2.4 GHz 20.5 dBm GPIO, I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 19.2 mm x 18 mm x 3.2 mm Bluetooth 5.0 802.11 b/g/n Bulk
u-blox 多协议模块 88W8987, 802.11ac+BT, 2 ant pins, -40 to +85C
2,000在途量
最低: 1
倍数: 1
: 500

2.4 GHz, 5 GHz 19 dBm GPIO, SDIO, UART 2.8 V 5.5 V - 40 C + 105 C RF 19.8 mm x 13.8 mm Bluetooth 5.2 802.11 a/b/g/n/ac Reel, Cut Tape
u-blox 多协议模块 M.2 card with JODY-W377, in tray
1,006在途量
最低: 1
倍数: 1
最大: 100

JODY-W3 2.4 GHz, 5 GHz 19 dBm I2S, PCIe, SDIO, UART 1.8 V 3.3 V - 40 C + 85 C u.FL 22 mm x 30 mm x 4.2 mm Bluetooth 5.3 Tray
u-blox 多协议模块 IW611, 802.11ax+BT, 1 PCB antenna or antenna pin
2,547在途量
最低: 1
倍数: 1
最大: 150
: 500

MAYA-W2 18 dBm SPI - 40 C + 85 C PCB Antenna 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
u-blox 多协议模块 ESP32, 802.11bgn+BT, metal antenna, open CPU
2,457在途量
最低: 1
倍数: 1
: 500

NINA-W10 2.4 GHz I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C 10 mm x 14 mm x 3.8 mm Reel, Cut Tape
STMicroelectronics 多协议模块 Ultra-low-power dual core MCU 64 MHz Cortex-M0+ 32MHz 1 Mbyte Bluetooth LE
18,248预期 2027/4/23
最低: 1
倍数: 1
: 1,800

STM32WB 2.4 GHz 6 dBm I2C, USART, USB 1.7 V 3.6 V - 40 C + 85 C Chip 7.3 mm x 11 mm x 1.34 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape, MouseReel

Texas Instruments 多协议模块 WL18xxMOD Dual-Band Ind Mod A 595-WL1837 A 595-WL1837MODGIMOCR
500预期 2026/8/26
最低: 1
倍数: 1
: 250

WL1837MOD 2.4 GHz, 5 GHz 17.3 dBm SDIO, UART 2.9 V 4.8 V - 40 C + 85 C RF 13.4 mm x 13.3 mm x 2 mm Bluetooth 5.1 802.11 a/b/g/n Reel, Cut Tape, MouseReel
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
8,000预期 2026/10/8
最低: 1
倍数: 1
: 1,000

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape, MouseReel
Telit Cinterion 多协议模块
540在途量
最低: 1
倍数: 1

I2C, SPI, UART 3.4 V 4.2 V - 40 C + 85 C 28.2 mm x 28.2 mm x 2.2 mm Bluetooth LTE WiFi Tray
Digi 多协议模块 Digi XBee 3 Low-Power LTE-M/NB-IoT, GNSS, Telit ME310G1-W1, No SIM
2,650在途量
最低: 1
倍数: 1

XBee 3 I2C, SPI, UART 3.3 V 4.3 V - 40 C + 85 C u.FL 24.38 mm x 32.94 mm
Digi 多协议模块 Digi XBee 3 Global LTE-M/NB-IoT, GNSS, 2G fallback, Telit ME310G1-WW, No SIM
5,390在途量
最低: 1
倍数: 1

XBee 3 I2C, SPI, UART 3.3 V 4.3 V - 40 C + 85 C u.FL 24.38 mm x 32.94 mm
Embedded Artists 多协议模块 1YN M.2 Wi-Fi 4 b/g/n, Bluetooth 5.2 with CYW43439 chipset and LBEE5KL1YN
750预期 2026/12/1
最低: 1
倍数: 1

2.4 GHz 4-Wire UART, SDIO 3 V 3.5 V - 30 C + 85 C u.FL 22 mm x 44 mm Bluetooth 5.2 802.11 a/b/g/n Bulk
Embedded Artists 多协议模块 2EL M.2 Wi-Fi 6 a/b/g/n/ac/ax, Bluetooth 5.3 with IW612 chipset and LBES5PL2EL
323预期 2027/2/26
最低: 1
倍数: 1

2.4 GHz to 2.484 GHz 2.6 dBm SPI - 40 C + 85 C 802.11 a/b/g/n/ac/ax Bulk
Sierra Wireless 多协议模块 5G RedCap module, industrial grade, LTE and GNSS based on Qualcomm's SDX35
1,000预期 2026/11/2
最低: 1
倍数: 1

USB 3.135 V 4.4 V Tray
Nordic Semiconductor 多协议模块 Low Power Cellular IoT SIP, LTE-M, NB-IoT, GNSS wireless modem
2,500预期 2026/12/25
最低: 1
倍数: 1
: 2,500

700 MHz to 2.2 GHz 23 dBm I2C, I2S, SPI, UART 3 V 5.5 V - 40 C + 85 C 16 mm x 10.5 mm x 1.04 mm DECT NR+, LTE Cat-M1/NB1/NB2 GPS, QZSS Reel, Cut Tape
Fanstel 多协议模块 Opensource remote USB dongle with BT840XE,ANT000, and an USB cable for remote mounting to avoid obstruction.
96预期 2026/10/13
最低: 1
倍数: 1
: 32

Reel, Cut Tape
Seeed Studio 多协议模块 Seeed Studio XIAO ESP32-C5
298在途量
最低: 1
倍数: 1

Insight SiP 多协议模块 nRF52832 LoRa Transceiver & BLE 5 Module EU
2,622在途量
最低: 1
倍数: 1
ISP4520 863 MHz to 870 MHz, 2.4 GHz 14 dBm SPI 1.8 V 3.6 V - 30 C + 85 C External 9.8 mm x 17.2 mm x 1.7 mm Bluetooth 5.0 Tray
Insight SiP 多协议模块 nRF52832 LoRa Transceiver & BLE 5 Module US
1,742在途量
最低: 1
倍数: 1
902 MHz to 928 MHz, 2.4 GHz 22 dBm SPI 1.8 V 3.6 V - 30 C + 85 C External 9.8 mm x 17.2 mm x 1.7 mm Bluetooth 5.0
CEL 多协议模块 WiFi bgn BT5 BT Mesh PCB Antenna BULK 20库存量
最低: 1
倍数: 1

CMP4010 2.4 GHz 18 dBm GPIO, I2C, I2S, SDIO, SPI, UART, USB 3.3 V 3.3 V PCB 16.7 mm x 26.3 mm Bluetooth 5.0 Mesh 802.11 b/g/n Bulk
CEL 多协议模块 WiFi bgn BT5 BT Mesh RF Connector BULK 20库存量
最低: 1
倍数: 1

CMP4010 2.4 GHz 18 dBm GPIO, I2C, I2S, SDIO, SPI, UART, USB 3.3 V 3.3 V PCB 16.7 mm x 26.3 mm Bluetooth 5.0 Mesh 802.11 b/g/n Bulk
CEL 多协议模块 RTL8721, Dual Band, WiFi+BLE, MFH4, BULK 5库存量
最低: 1
倍数: 1

CMP4020 2.4 GHz, 5 GHz 18 dBm GPIO, I2C, I2S, SDIO, SPI, UART, USB 3 V 3.6 V - 40 C + 85 C Bluetooth 5.1 Bulk
CEL 多协议模块 CMP4020-2 BULK 20库存量
最低: 1
倍数: 1

CMP4020 2.4 GHz, 5 GHz 18 dBm GPIO, I2C, I2S, SDIO, SPI, UART, USB 3 V 3.6 V - 40 C + 85 C Bluetooth 5.1 Bulk
CEL 多协议模块 ZB/Thread/BT, +20dBm, 1.64Mb, Antenna BULK 3库存量
最低: 1
倍数: 1

2.4 GHz 20 dBm ADC, GPIO, I2C, QSPI, SPI, UART, USB 3.3 V 3.3 V - 40 C + 85 C PCB 16.7 mm x 26.3 mm Bluetooth 5.0 Thread, Zigbee Bulk