多协议模块

 多协议模块
Multiprotocol Modules are in stock with same-day shipping at Mouser from industry leading manufacturers. Mouser is an authorized distributor for many bluetooth module manufacturers including Espressif,  Ezurio, Intel, Murata, Nordic Semiconductor, Silicon Labs, STMicroelectronics, u-blox & more.
More...

Please view our large selection of Multiprotocol Modules below.
结果: 1,608
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - 蜂窝、Nbiot、LTE 协议 - GPS、GLONASS 协议 - Sub GHz 协议 - WiFi - 802.11 协议 - ANT、Thread、Zigbee - 802.15.4 资格 封装
Embedded Artists 多协议模块 1XL M.2 Wi-Fi6 a/b/g/n/ac/ax MU-MIMO, Bluetooth 5.3 with 88W9098 and LBEE5ZZ1XL
3在途量
最低: 1
倍数: 1

2.4 GHz, 5 GHz UART, USB 3.14 V 3.46 V - 40 C + 85 C u.FL 22 mm x 30 mm x 1.5 mm Bluetooth 5.3 802.11 a/b/g/n/ac/ax Bulk
Silicon Labs 多协议模块 802.11 b/g/n dual-band (2.4/5 GHz), dual-mode Bluetooth 5 Wi-Fi Modules
836预期 2026/8/4
最低: 1
倍数: 1

2.4 GHz, 5 GHz 18 dBm SDIO, UART, USB 3 V 3.63 V - 40 C + 85 C External 9.1 mm x 9.8 mm x 1.6 mm Bluetooth 5.0 Tray
u-blox 多协议模块 M.2 card with JODY-W377, single package
23预期 2026/7/23
最低: 1
倍数: 1

JODY-W3 2.4 GHz, 5 GHz 16 dBm, 19 dBm GPIO, UART 3.135 V 3.465 V - 40 C + 85 C 30 mm x 22 mm x 3.21 mm 802.11 a/b/g/n Tray
Insight SiP 多协议模块 Global Coverage Ultra Wide Band & Bluetooth 5.1 LE Smart Module Module w/ Built in Antenna
50预期 2026/11/27
最低: 1
倍数: 1

u-blox 多协议模块 M.2 card with MAYA-W271, single package
23在途量
最低: 1
倍数: 1

M2-MAYA-W2 2.4 GHz, 5 GHz 18 dBm, 20 dBm I2S, UART 1.8 V 3.3 V u.FL 22 mm x 30 mm x 2.8 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax
Microchip Technology 多协议模块 Bluetooth Low Energy/15.4 Combo Module with PCB Antenna and extended temperature
144预期 2026/9/24
最低: 1
倍数: 1

2.4 GHz 12 dBm 1.9 V 3.6 V - 40 C + 125 C 7 mm x 7 mm x 0.9 mm Bluetooth Zigbee Tray
Silicon Labs 多协议模块 MGM220P wireless gecko
188预期 2026/10/2
最低: 1
倍数: 1

2.4 GHz 8 dBm Bluetooth, GPIO, I2C, UART 1.8 V 3.8 V - 40 C + 105 C Built-In 15 mm x 12.9 mm Bluetooth 5.2, Bluetooth Mesh Zigbee Cut Tape
Silicon Labs 多协议模块 SiWN917Y NCP Module Wi-Fi 6 2.4 GHz Bluetooth LE 5.4 No Antenna, 4MB Flash in IC package?
100预期 2027/6/28
最低: 1
倍数: 1

SIWG917Y I2C, SPI, UART, USART 1.71 V 3.63 V - 40 C + 85 C Cut Tape
Murata Electronics 多协议模块 Shielded Small Wi-Fi 11a/b/g/n/ac/ax + Bluetooth 5.3 Module Type 2EL
3,988在途量
最低: 1
倍数: 1
: 1,000

2EL 2.4 GHz, 5.8 GHz 20 dBm SPI 1.71 V 3.46 V - 40 C + 85 C 8.8 mm x 7.7 mm x 1.3 mm Bluetooth 5.3 802.11 a/b/g/n/ac/ax Reel, Cut Tape, MouseReel
NXP Semiconductors IW611UK/A1IZ
NXP Semiconductors 多协议模块 IW611UK/A1I
25预期 2026/7/29
最低: 1
倍数: 1
: 2,000

IW611HN Reel, Cut Tape
NXP Semiconductors IW612UK/A1IZ
NXP Semiconductors 多协议模块 IW612UK/A1I
25预期 2026/7/29
最低: 1
倍数: 1
: 2,000

IW612HN Reel, Cut Tape
Murata Electronics 多协议模块 Type 1ZM Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 5.1
2,000预期 2027/1/21
最低: 1
倍数: 1
: 1,000

1ZM 2.4 GHz, 5 GHz 17 dBm SDIO, UART 1.62 V 1.92 V - 30 C + 85 C u.FL 10.2 mm x 9.3 mm x 1.3 mm Bluetooth 5.1 802.11 a/b/g/n/ac Reel, Cut Tape
Quectel 多协议模块 Cat M1/Cat NB2 - Standard version + GNSS (w/o WWAN concurrency)
1,000在途量
最低: 1
倍数: 1
: 500

21 dBm ADC, GPIO, I2C, PCM, USB 2.0, UART 2.6 V 4.8 V - 35 C + 75 C RP-SMA 14.9 mm x 12.9 mm x 1.7 mm LTE Cat-M1/NB2 GLONASS, GPS Reel, Cut Tape, MouseReel
Quectel 多协议模块 Cat 4 + 3G, 4Gbit ROM+2Gbit RAM, North America, mPCIe form factor
494在途量
最低: 1
倍数: 1
: 100

700 MHz to 5 GHz I2C, PCIe, PCM, UART, USB 2.0 3 V 3.6 V - 35 C + 75 C SMA 51 mm x 30 mm x 4.9 mm LTE Cat 4 GNSS Reel, Cut Tape
Quectel 多协议模块 Cat 4 + 3G + 2G module, mPCIe form factor, EMEA, South Korea, Thailand, India
385在途量
最低: 1
倍数: 1
: 100

698 MHz to 960 MHz, 1.561 GHz, 1.575 GHz, 1.7 GHz to 2.7 GHz, 2.4 GHz to 2.5 GHz I2C, PCIe, PCM, UART, USB 2.0 3 V 3.6 V - 35 C + 75 C External 30 mm x 51 mm x 4.9 mm LTE Cat 4 GNSS Reel, Cut Tape
Quectel 多协议模块 Cat 4 + 3G + 2G module, mPCIe form factor, EMEA, Thailand
265在途量
最低: 1
倍数: 1
: 100

1.16 GHz to 1.27 GHz, 1.56 GHz to 1.605 GHz I2C, PCIe, PCM, UART, USB 2.0 3 V 3.6 V - 35 C + 75 C 30 mm x 51 mm x 4.9 mm LTE Cat 4 GNSS Reel, Cut Tape
Quectel 多协议模块 Cat 1 + 3G + 2G, mPCIe form factor, Global
294在途量
最低: 1
倍数: 1
: 100

33 dBm I2C, PCIe, PCM, UART, USB 2.0 3 V 3.6 V - 35 C + 75 C 51 mm x 30 mm x 4.9 mm LTE Cat 1 GNSS Reel, Cut Tape
Quectel 多协议模块 Cat 4 + 3G + 2G, 1Gbit ROM+1Gbit RAM, EMEA only
743在途量
最低: 1
倍数: 1
: 250

ADC, I2C, PCM, SPI, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C 29 mm x 25 mm x 2.3 mm LTE Cat 4 GNSS Reel, Cut Tape
Silex Technology 多协议模块 Wi-Fi+BLE Mod 2 ufl connect SamPck
88预期 2027/2/2
最低: 1
倍数: 1

SX-SDMAC 2.4 GHz, 5 GHz Bluetooth 5.0 802.11 a/b/g/n/ac Cut Tape
Murata Electronics 多协议模块 BT 5.4/WIFI 6
1,000预期 2026/10/20
最低: 1
倍数: 1
: 1,000

17 dBm SPI 1.71 V 3.46 V - 40 C + 85 C 8.8 mm x 7.7 mm x 1.3 mm 802.11 a/b/g/n/ac/ax Reel, Cut Tape
Murata Electronics 多协议模块 Type 1LV Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 5.0
996预期 2027/6/9
最低: 1
倍数: 1
: 1,000

1LV 2.4 GHz, 5 GHz 17 dBm SDIO, UART 1.62 V 1.98 V - 20 C + 70 C External 10 mm x 7.2 mm x 1.4 mm Bluetooth 5.0 802.11 a/b/g/n Reel, Cut Tape, MouseReel
Murata Electronics 多协议模块 Type 2FY Infineon CYW55513 ShieldedSmall WiFi 11a/b/g/n/ac/ax SISO+BT 5.4 Module
958预期 2026/8/12
最低: 1
倍数: 1
: 1,000

2FY 2.4 GHz, 5 GHz, 6 GHz GPIO, UART 3 V 4.8 V - 40 C + 85 C 7.9 mm x 7.3 mm x 1.1 mm Bluetooth WiFi - 802.11 Reel, Cut Tape
Murata Electronics 多协议模块 Type 2DL-921, Shielded Small Wi-Fi 11a/b/g/n/ac/ax + Bluetooth 5.3 Module
700预期 2026/11/12
最低: 1
倍数: 1
: 1,000

2DL 2.4 GHz, 5 GHz 18 dBm UART 1.71 V 3.46 V - 40 C + 85 C u.FL 8.8 mm x 7.7 mm x 1.3 mm Bluetooth 5.3 Reel, Cut Tape, MouseReel
Murata Electronics 多协议模块 Type 2FR module
975预期 2026/11/3
最低: 1
倍数: 1
: 1,000

2FR 2.484 GHz 18 dBm SPI 3.14 V 3.46 V - 40 C + 85 C 12 mm x 11 mm x 1.5 mm Reel, Cut Tape
Murata Electronics 多协议模块 RF TXRX MODULE 5.4/WIFI 6
1,000预期 2026/12/22
最低: 1
倍数: 1
: 1,000

17 dBm SPI 1.71 V 3.46 V - 40 C + 85 C 8.8 mm x 7.7 mm x 1.3 mm 802.11 a/b/g/n/ac/ax Reel, Cut Tape