POS 多协议模块

结果: 132
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - 蜂窝、Nbiot、LTE 协议 - GPS、GLONASS 协议 - Sub GHz 协议 - WiFi - 802.11 协议 - ANT、Thread、Zigbee - 802.15.4 封装
u-blox 多协议模块 Wi-Fi 6 Dual-Band, BLE 5.4, 802.15.4, host-based module, 2 ant pins

MAYA-W4 2 dB SPI, UART 1.71 V 3.46 V - 40 C + 85 C 14.3 mm x 10.4 mm x 2 mm Bluetooth WiFi Reel, Cut Tape
Ezurio 多协议模块 Module, Veda IF912, SIP, Dual Band, 8M PSRAM, 8M Flash, RF Trace Pin, Cut Tape

IF912 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Cut Tape
u-blox 多协议模块 Dual-band Wi-Fi 6, BLE Stand-alone module, antenna pin, Open CPU, 16MB, NXP RW610 chip

IRIS-W10 2.4 GHz, 5 GHz 11 dBm GPIO, I2C, SPI, UART, USB 3.15 V 3.45 V - 40 C + 85 C U.FL 20.9 mm x 14.6 mm x 2.1 mm Bluetooth LE 802.11 a/b/g/n/ac/ax 802.15.4 Reel, Cut Tape
Quectel 多协议模块 Wi-Fi 6 & Bluetooth 5.2, dual band 2.4/5GHz, 1x antenna, -20 C to +70 C, compact LCC package, USB 2.0 interface only, antenna pin interface
2.4 GHz, 5 GHz USB 3 V 3.6 V - 20 C + 70 C 15 mm x 13 mm x 2 mm IEEE 802.11a/b/g/n/ac/ax Reel, Cut Tape
Quectel 多协议模块 Wi-Fi 4 & Bluetooth 5.2, dual band 2.4/5GHz, 1x antenna, -20 C to +70 C, ultra-compact LCC package, USB 2.0 interface only, antenna pin interface

2.4 GHz, 5 GHz USB 3 V 3.6 V - 20 C + 70 C 13 mm x 12.2 mm x 2 mm Bluetooth 5.2 Wi-Fi 4, IEEE 802.11a/b/g/n Reel, Cut Tape
Ezurio 多协议模块 Module, Vela IF310, Trace Pin, Tape and Reel
Vela IF310 2.402 GHz to 2.48 GHz 10 dBm UART 3 V 4.8 V - 40 C + 85 C 16 mm x 12 mm x 2 mm Bluetooth Reel
Ezurio 多协议模块 Module, BL54L15, Bluetooth LE, Trace Pin, Tape and Reel
BL54L15u 8 dBm I2S, SPI, UART 1.7 V 3.6 V - 40 C + 105 C 7.9 mm x 6.3 mm x 1.75 mm Bluetooth LE 802.15.4 Reel, Cut Tape
Ezurio 多协议模块 Module, Veda IF913, SIP, Tri Band, No Memory, RF Trace Pin, Tape and Reel
IF913 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Reel
Ezurio 多协议模块 Module, Veda IF912, SIP, Dual Band, No Memory, RF Trace Pin, Tape and Reel
IF912 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Reel
Ezurio 多协议模块 Module, Veda IF912, SIP, Dual Band, 8M PSRAM, 8M Flash, RF Trace Pin, Tape and Reel
IF912 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Reel
Ezurio 多协议模块 Module, Veda IF913, SIP, Tri Band, 8M PSRAM, 8M Flash, RF Trace Pin, Tape and Reel
IF913 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Reel
u-blox JODY-W683-00B
u-blox 多协议模块 AW693, 802.11ax 2x2+BT/LE 5.3, 3 antenna pins

Reel
u-blox JODY-W263-01B
u-blox 多协议模块 88W8987, 802.11ac+BT, 2 ant pins, -40 to +85C, LTE filter

Reel
Silicon Labs 多协议模块 917 Wi-Fi 6 2.4 GHz Module (RCP), Bluetooth LE, 672KB RAM, 0MB Flash, No Antenna, 32KHz XTAL Pins

2.4 GHz SDIO 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm Bluetooth WiFi
Silicon Labs 多协议模块 917 Wi-Fi 6 2.4 GHz Module (NCP), Bluetooth LE, 672KB RAM, 4MB Flash, No Antenna, 32KHz XTAL Pins

2.4 GHz SPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm Bluetooth WiFi
Silicon Labs 多协议模块 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 4MB Flash, No Antenna, 32KHz XTAL Pins

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Silicon Labs 多协议模块 917 Wi-Fi 6 2.4 GHz Module (RCP), Bluetooth LE, 672KB RAM, 0MB Flash, Integrated Antenna, 32KHz XTAL Pins

2.4 GHz SDIO 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm Bluetooth WiFi
Silicon Labs 多协议模块 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 4MB Flash, Integrated Antenna, 32KHz XTAL Pins

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Silicon Labs 多协议模块 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 8MB Flash, No Antenna, 32KHz XTAL Pins, MVP

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Silicon Labs 多协议模块 917 Wi-Fi 6 2.4 GHz Module (NCP), Bluetooth LE, 672KB RAM, 4MB Flash, Integrated Antenna, 32KHz XTAL Pins

2.4 GHz SPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm Bluetooth WiFi
Silicon Labs 多协议模块 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 8MB Flash, Integrated Antenna, 32KHz XTAL Pins, MVP

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Silicon Labs 多协议模块 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 8MB Flash, 2MB PSRAM, No Antenna, 32KHz XTAL Pins, MVP

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Espressif Systems 多协议模块 Built-in ESP32-S31 series chip. featuring a RISC-V 32-bit dual-core microprocessor. Main pin compatible with ESP32-S3-WROOM-1. Suitable for embedded systems, smart home, wearable electronic devices, and other loT scenarios.

320 MHz GPIO, SPI, USB 3 V 3.6 V - 40 C + 85 C Bluetooth 5.4 IEEE 802.11ax, WiFi Thread, Zigbee
Silicon Labs 多协议模块 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 8MB Flash, 2MB PSRAM, Integrated Antenna, 32KHz XTAL Pins, MVP

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Renesas / Dialog 多协议模块 Wi-Fi/BLE combo module, Wi-Fi6 Dual Band 2.4/5GHz 802.11 a/b/g/n/ax, 8Mbyte Flash, RF antenna pin

RRQ61051 160 MHz GPIO, I2C, I2S, SPI, UART 1.8 V 3.6 V - 40 C + 85 C RF 20 mm x 15 mm x 3 mm Bluetooth 5.1 802.11 a/b/g/n/ax Reel