92 多协议模块

结果: 1,632
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - 蜂窝、Nbiot、LTE 协议 - GPS、GLONASS 协议 - Sub GHz 协议 - WiFi - 802.11 协议 - ANT、Thread、Zigbee - 802.15.4 资格 封装
Quectel SC686AWFPA-E61-UGADA
Quectel 多协议模块 无库存
最低: 3,000
倍数: 200
: 200

Reel
Quectel SC200EGLNA-E55-UGNDA
Quectel 多协议模块 无库存
最低: 3,000
倍数: 200
: 200

Reel
Quectel SC200KWFNA-E55-UGNNA
Quectel 多协议模块 无库存
最低: 3,000
倍数: 200
: 200

Reel
Quectel SC200KWFNA-E56-UGNNA
Quectel 多协议模块 WiFi/BT only variant. -EU does not exists. -CE variant exists, pricing available on request. 无库存交货期 16 周
最低: 3,000
倍数: 200
: 200

Reel
Quectel SG560DEUPA-U60-TA0AA
Quectel 多协议模块 无库存
最低: 1
倍数: 1

Quectel SG560DEUPA-U65-TA0AA
Quectel 多协议模块 无库存
最低: 1
倍数: 1

Quectel SG560DWFPA-U61-UGADA
Quectel 多协议模块 NRE may apply, please contact sales 无库存
最低: 3,000
倍数: 200
: 200

Reel
Quectel SG150HCNPA-M21-UGNSA
Quectel 多协议模块 SG150H-CN 256MB+512MB 无库存
最低: 3,000
倍数: 200
: 200

Reel
Silicon Labs 多协议模块 917 Wi-Fi 6 2.4 GHz Module (RCP), Bluetooth LE, 672KB RAM, 0MB Flash, Integrated Antenna, 32KHz XTAL Pins

2.4 GHz SDIO 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm Bluetooth WiFi
Silicon Labs 多协议模块 917 Wi-Fi 6 2.4 GHz Module (RCP), Bluetooth LE, 672KB RAM, 0MB Flash, No Antenna, 32KHz XTAL Pins

2.4 GHz SDIO 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm Bluetooth WiFi
NXP Semiconductors 多协议模块 IW610GUK/A1ZDI

IW610GUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Reel, Cut Tape
NXP Semiconductors 多协议模块 IW610BUK/A1ZDI

IW610BUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Reel, Cut Tape
CEL 多协议模块 CMP9670 Tri-Band Wi-Fi 6e 2x2 MU-MIMO DBS BT5.2 Half-size Mini-PCIe Card

CMP9670 PCIe, USB Bluetooth Bulk
Seeed Studio 多协议模块 SenseCAP Solar Node P1-Pro for Meshtastic
Silicon Labs 多协议模块 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 4MB Flash, No Antenna, 32KHz XTAL Pins

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Silicon Labs 多协议模块 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 8MB Flash, No Antenna, 32KHz XTAL Pins, MVP

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Silicon Labs 多协议模块 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 8MB Flash, 2MB PSRAM, No Antenna, 32KHz XTAL Pins, MVP

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Silicon Labs 多协议模块 917 Wi-Fi 6 2.4 GHz Module (NCP), Bluetooth LE, 672KB RAM, 4MB Flash, Integrated Antenna, 32KHz XTAL Pins

2.4 GHz SPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm Bluetooth WiFi
Silicon Labs 多协议模块 917 Wi-Fi 6 2.4 GHz Module (NCP), Bluetooth LE, 672KB RAM, 4MB Flash, No Antenna, 32KHz XTAL Pins

2.4 GHz SPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm Bluetooth WiFi
Arduino 多协议模块 Portenta Proto Kit ME ABX00042; ASX00055; TPX00200; ABX00050

Portenta CAN, Ethernet, I2C, SPI, USB 7 VDC 30 VDC - 40 C + 85 C Bluetooth 5.0 LTE Cat.4, 4G GNSS Bulk
Arduino 多协议模块 Portenta Proto Kit VE ABX00042; ASX00055; TPX00200; ABX00051; ABX00089

Portenta CAN, Ethernet, I2C, SPI, USB 7 VDC 30 VDC - 40 C + 85 C LTE Cat.4, 4G GNSS Bulk
NXP Semiconductors 多协议模块 IW610CUK/A1ZDI

IW610CUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Reel, Cut Tape
Seeed Studio 多协议模块 Seeed Studio XIAO ESP32C3

2.4 GHz I2C, SPI, UART - 40 C + 85 C 21 mm x 17.5 mm 802.11 b/g/n
Phoenix Contact 多协议模块 FL EPA 2

9 V 30 V - 40 C + 65 C M12 67.8 mm x 92.7 mm x 33.2 mm Bluetooth IEEE 802.11
Ezurio 多协议模块 Module, Sona NX611, 2 x RF Trace, MIMO, SIP, Cut Tape

Sona NX611 2.4 GHz, 5 GHz UART 1.8 V 3.3 V - 40 C + 85 C MHF4 Bluetooth 5.4, Bluetooth LE WiFi 6 Cut Tape