-ar 多协议模块

结果: 240
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描述 数据表 供货情况 单价（含13%增值税） 根据您的数量，按照单价筛选表格中的结果。
数量 RoHS ECAD模型 系列
频率
输出功率
接口类型
电源电压-最小
电源电压-最大
最小工作温度
最大工作温度
天线连接器类型
尺寸
协议 - 蓝牙、BLE - 802.15.1
协议 - 蜂窝、Nbiot、LTE
协议 - GPS、GLONASS
协议 - Sub GHz
协议 - WiFi - 802.11
协议 - ANT、Thread、Zigbee - 802.15.4
封装
Silicon Labs 多协议模块 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 4MB Flash, No Antenna, 32KHz XTAL Pins
数据表

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Silicon Labs 多协议模块 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 8MB Flash, 2MB PSRAM, No Antenna, 32KHz XTAL Pins, MVP
数据表

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Arduino 多协议模块 Portenta Proto Kit VE ABX00042; ASX00055; TPX00200; ABX00051; ABX00089

Portenta CAN, Ethernet, I2C, SPI, USB 7 VDC 30 VDC - 40 C + 85 C LTE Cat.4, 4G GNSS Bulk
Arduino 多协议模块 Portenta Proto Kit ME ABX00042; ASX00055; TPX00200; ABX00050
数据表

Portenta CAN, Ethernet, I2C, SPI, USB 7 VDC 30 VDC - 40 C + 85 C Bluetooth 5.0 LTE Cat.4, 4G GNSS Bulk
Espressif Systems 多协议模块 2.4 GHz Wi-Fi 6, Bluetooth 5.4 (LE), Bluetooth Classic, Zigbee and Thread (802.15.4) module Built around ESP32-S31 series of SoCs, RISC-V 32-bit dual-core microprocessor 54 GPIOs, rich set of peripherals On-board PCB antenna
数据表
更多信息可用

GPIO, SPI, USB 3 V 3.6 V - 40 C + 85 C Bluetooth 5.4 IEEE 802.11ax
Kaga FEI 多协议模块 WLAN + ARM M33 MCU module for NXP RW612. WiFi 6 1x1 dual band, BT, BLE 5.4.
数据表
更多信息可用

SDIO, UART 1.71 V 2.46 V - 40 C + 85 C 25 mm x 15.7 mm x 2.1 mm Bluetooth WiFi Tray
Ezurio 多协议模块 Module, Veda IF913, SIP, Tri Band, No Memory, RF Trace Pin, Cut Tape
数据表
更多信息可用
IF913 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Cut Tape
Ezurio 多协议模块 Module, Veda IF912, SIP, Dual Band, 8M PSRAM, 8M Flash, RF Trace Pin, Cut Tape
数据表
更多信息可用

IF912 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Cut Tape
u-blox 多协议模块 Dual-band Wi-Fi 6, BLE Stand-alone module, PCB antenna, Open CPU, 16MB, NXP RW610 chip
数据表
更多信息可用

IRIS-W10 2.4 GHz, 5 GHz 11 dBm GPIO, I2C, SPI, UART, USB 3.15 V 3.45 V - 40 C + 85 C U.FL 20.9 mm x 14.6 mm x 2.1 mm Bluetooth LE 802.11 a/b/g/n/ac/ax 802.15.4 Reel, Cut Tape
u-blox 多协议模块 Dual-band Wi-Fi 6, BLE Stand-alone module, antenna pin, Open CPU, 16MB, NXP RW610 chip
数据表
更多信息可用

IRIS-W10 2.4 GHz, 5 GHz 11 dBm GPIO, I2C, SPI, UART, USB 3.15 V 3.45 V - 40 C + 85 C U.FL 20.9 mm x 14.6 mm x 2.1 mm Bluetooth LE 802.11 a/b/g/n/ac/ax 802.15.4 Reel, Cut Tape
Murata Electronics 多协议模块 Type 2NR BLE Module
数据表
更多信息可用

2.48 GHz 8 dBm I2C, SPI 1.7 V 3.4 V - 40 C + 105 C U.FL 7.4 mm x 7 mm x 1.4 mm Bluetooth Reel, Cut Tape
Quectel 多协议模块 cloud enabled, Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: PCB, 2MB flash
更多信息可用
2.4 GHz UART 3 V 3.6 V - 40 C + 85 C PCB 20 mm x 18 mm x 2.6 mm BLE 5.2 802.11 b/g/n Reel, Cut Tape
Quectel 多协议模块 Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM, 8MB Flash, Antenna: PCB, -40 85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm
数据表
更多信息可用
2.4 GHz, 5 GHz GPIO, I2C, JTAG, SPI, UART, USB 3.14 V 3.46 V - 40 C + 85 C PCB Antenna 25.5 mm x 18 mm x 3.16 mm Reel, Cut Tape
Silicon Labs 多协议模块 SiWG917Y SoC Module Wi-Fi 6 2.4 GHz Bluetooth LE 5.4 Integrated Antenna, 2MB PSRAM in IC package, 8MB Flash in module
数据表

SIWG917Y I2C, SPI, UART, USART 1.71 V 3.63 V - 40 C + 85 C Reel, Cut Tape
Silicon Labs 多协议模块 SiWG917Y SoC Module Wi-Fi 6 2.4 GHz Bluetooth LE 5.4 No Antenna, 8MB Flash in IC package?
数据表

SIWG917Y I2C, SPI, UART, USART 1.71 V 3.63 V - 40 C + 85 C Reel

Embedded Artists 多协议模块 1LV M.2 Wi-Fi 4 a/b/g/n/ac, Bluetooth 5.0 with CYW43012 chipset and LBEE59B1LV
数据表

EA M.2 Modules 2.4 GHz, 5 GHz 4-Wire UART, SDIO 3 V 3.6 V - 20 C + 70 C Integrated 22 mm x 44 mm Bluetooth 5.2 802.11 a/b/g/n/ac Bulk
Ezurio 多协议模块 Module, BL54L15, Bluetooth LE, Trace Pin, Tape and Reel
数据表
BL54L15u 8 dBm I2S, SPI, UART 1.7 V 3.6 V - 40 C + 105 C 7.9 mm x 6.3 mm x 1.75 mm Bluetooth LE 802.15.4 Reel, Cut Tape
Inventek 多协议模块
数据表

2.4 GHz 17 dBm I2S, SPI, UART 2 V 3.6 V - 40 C + 85 C u.FL 10 mm x 10 mm BLE, Bluetooth 5.1 802.11 b/g/n Reel
Ezurio 多协议模块 Module, BL54L10, Bluetooth LE, Trace ANT, Tape and Reel
数据表
BL54L10 2.402 GHz to 2.48 GHz 8 dBm I2S, SPI, UART 1.7 V 2.7 V - 40 C + 105 C Trace 14 mm x 10 mm x 1.6 mm Bluetooth LE 802.15.4 Reel, Cut Tape
Silicon Labs 多协议模块 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 4MB Flash, No Antenna, 32KHz XTAL Pins
数据表

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Ezurio 多协议模块 Module, BL54L10, Bluetooth LE, MHF4, Tape and Reel
数据表
BL54L10 2.402 GHz to 2.48 GHz 8 dBm I2S, SPI, UART 1.7 V 2.7 V - 40 C + 105 C MHF4 14 mm x 10 mm x 1.6 mm Bluetooth LE 802.15.4 Reel
Silicon Labs 多协议模块 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 8MB Flash, 2MB PSRAM, Integrated Antenna, 32KHz XTAL Pins, MVP
数据表

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Silicon Labs 多协议模块 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 8MB Flash, Integrated Antenna, 32KHz XTAL Pins, MVP
数据表

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Silicon Labs 多协议模块 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 4MB Flash, Integrated Antenna, 32KHz XTAL Pins
数据表

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Silicon Labs 多协议模块 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 8MB Flash, No Antenna, 32KHz XTAL Pins, MVP
数据表

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi