MULTI TECH 多协议模块

结果: 107
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - 蜂窝、Nbiot、LTE 协议 - Sub GHz 协议 - WiFi - 802.11 协议 - ANT、Thread、Zigbee - 802.15.4 封装
M5Stack 多协议模块 a highly integrated embedded module based on the Espressif ESP32-S3FN8, equipped with a 240MHz Xtensa 32-bit LX7 dual-core processor, integrated 8MB Flash 18库存量
70在途量
最低: 1
倍数: 1

I2C 25.93 mm x 18 mm x 4.7 mm
M5Stack 多协议模块 M5stamps3A with 1.27 Header Pin 471库存量
180在途量
最低: 1
倍数: 1

2.4 GHz GPIO, I2C, I2S, SPI, UART 0 C + 40 C
M5Stack 多协议模块 M5stamp EsP32s3A Module 83库存量
230在途量
最低: 1
倍数: 1

Microchip Technology 多协议模块 ATWILC3000 802.11 b/g/n + Bluetooth 5 Module Chip Antenna 2,220库存量
最低: 1
倍数: 1

2.4 GHz 18.5 dBm SDIO, SPI, UART 1.62 V 3.6 V - 40 C + 85 C Chip 22.4 mm x 14.7 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
Microchip Technology 多协议模块 ATWINC3400 802.11 b/g/n + Bluetooth 5 Module U.FL Antenna 809库存量
最低: 1
倍数: 1
2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C u.FL 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 Tray
Microchip Technology 多协议模块 Wi-Fi + Bluetooth LE Module, Chip Antenna 500库存量
最低: 1
倍数: 1
: 500

2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Reel, Cut Tape
Silex Technology 多协议模块 [Sample Pack] The SX-SDMAX-M2 is an M.2 2230 card that implements the SX-SDMAX-2530S. It is a 2.4 GHz/5 GHz dual-band Wi-Fi 6 plus Bluetooth v5.3 BR/EDR/LE SDIO 3.0 module using the NXP IW611 chipset.It features an MHF-I connector as an interface fo 7库存量
最低: 1
倍数: 1

SX-SDMAX 2.4 GHz/5 GHz Bluetooth, WiFi, UART 3.14 V 3.46 V - 40 C + 85 C 22 mm x 4.45 mm x 30 mm Bulk
Microchip Technology 多协议模块 SMARTCONNECT WINC3400 WL MOD 767库存量
最低: 1
倍数: 1

ATWINC3400 2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
Microchip Technology 多协议模块 ATWINC3400 802.11 b/g/n + Bluetooth 5 Module Chip Antenna 130库存量
最低: 1
倍数: 1

ATWINC3400 2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
Silex Technology 多协议模块 [Sample Pack] Low power version SMT type 802.11ah SDIO Wi-Fi HaLow module using MM6108. 15库存量
最低: 1
倍数: 1

23 dBm SPI - 40 C + 85 C MHF1 18 mm x 17 mm x 2.65 mm 802.11 ah Cut Tape


ADLINK Technology 多协议模块 AMPAK AP12356 WIFI/BT KIT 2x2 Wi-Fi + Bluetooth4.1 Module with PCI-e Half-Mini CardIEEE802.11a/b/g/n/ac, PCI-e interfaceOperating Temperature: -10 70? Driver for Win/Linux/Android2pcs x Antenna + 2pcs x IPEX cable 2库存量
最低: 1
倍数: 1
2.4 GHz, 5 GHz 16 dBm PCIe, USB 3 V 3.6 V - 10 C + 70 C External Bluetooth 802.11 a/b/g/n/ac
Silex Technology 多协议模块 [Sample Pack] SX-SDMAX-2530C is a board-to-board connector type board implementing the SX-SDMAX-2530S. It is a 2.4 GHz/5 GHz dual-band Wi-Fi 6 plus Bluetooth v5.3 BR/EDR/LE SDIO 3.0 module using the NXP IW611 chipset.It includes an MHF-I connector f 10库存量
最低: 1
倍数: 1

SX-SDMAX 2.4 GHz/5 GHz Bluetooth, WiFi, UART 3.14 V 3.46 V - 40 C + 85 C 24 mm x 24 mm x 4.45 mm Bulk
Silex Technology 多协议模块 [Sample Pack] SX-PCEAX-SMT-SP is a sample pack SKU ideal for small quantities used for small pilot builds. SX-PCEAX-SMT-SP is a 2.4 GHz/5 GHz /6 GHz Tri-band IEEE802.11 ax WLAN, Bluetooth 5.2 BR/EDR/HS/LE module in an M.2 LGA Type 1418 Surface Mount 707库存量
最低: 1
倍数: 1

SX-PCEAX 2.4 GHz, 5 GHz, 6 GHz PCIe, USB 3.135 V 3.465 V - 20 C + 65 C MHF4 14 mm x 18 mm x 1.9 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax Bulk
ADLINK Technology Wi-Fi 6 / BT M.2 Type 2230 Combo Module
ADLINK Technology 多协议模块 Wireless: IEEE 802.11a/b/g/n/ac/ax (2Tx2R) Bluetooth: V5.2 / V4.2 / V4.1 / V4.0 LE / V3.0 / V2.1+EDR Frequency Range: 2.402 2.480 GHz Antenna: Dual MHF4 Antenna Connectors 2库存量
最低: 1
倍数: 1
2.402 GHz to 2.48 GHz MHF4 Bluetooth 5.2 802.11 a/b/g/n/ac/ax
Silex Technology 多协议模块 2x2 Dual Band 802.11 ac WLAN+BT PCIe 85库存量
最低: 1
倍数: 1

SX-PCEAC2 2.4 GHz, 5 GHz PCIe, USB 3.135 V 3.465 V - 20 C + 70 C MHF4 30 mm x 26.8 mm x 3.4 mm Bluetooth 5.0 802.11 a/b/g/n/ac Bulk
TechNexion 多协议模块 CLIX MODULE WITH QCA9377 WIFI 802.11AC (SDIO) + BLUETOOTH (UART) MODULE 43库存量
最低: 1
倍数: 1
UART 3.3 V 3.3 V - 40 C + 85 C MHF4 25 mm x 20 mm x 5 mm Bluetooth 802.11 a/b/g/n/ac
Jorjin 多协议模块 Based on STM BlueNRG-1 + S2-LP and supports Sigfox and BLE4.2 1,650库存量
最低: 1
倍数: 1
: 550

902 MHz, 920 MHz 8 dBm, 16 dBm I2C, SPI, UART 2 V 3.6 V - 40 C + 85 C u.FL 22 mm x 24 mm x 2.8 mm Bluetooth 4.2 Sub GHz Reel, Cut Tape, MouseReel
Silex Technology 多协议模块 [Sample Pack] SX-PCEAX-M2-SP is a sample pack SKU ideal for small quantities used for evaluation and small pilot builds. SX-PCEAX-M2-SP is a 2.4 GHz/5 GHz /6 GHz Tri-band IEEE802.11 ax WLAN, Bluetooth 5.2 BR/EDR/HS/LE module in an M.2 Card Type 2230 87库存量
106预期 2026/9/2
最低: 1
倍数: 1

SX-PCEAX 2.4 GHz, 5 GHz, 6 GHz PCIe, USB 3.135 V 3.465 V - 20 C + 65 C MHF4 22 mm x 30 mm x 2.7 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax Bulk
Jorjin 多协议模块 Based on STM BlueNRG-1 + S2-LP and supports Sigfox and BLE4.2 2,143库存量
最低: 1
倍数: 1
: 550

860 MHz to 943 MHz 8 dBm, 16 dBm I2C, SPI, UART 1.8 V 3.6 V - 40 C + 85 C u.FL 22 mm x 24 mm x 2.8 mm Bluetooth 4.2 Sub GHz Reel, Cut Tape, MouseReel
Jorjin 多协议模块 Based on STM BlueNRG-2 + S2-LP and supports Sigfox and BLE5.0 1,623库存量
最低: 1
倍数: 1
: 550

860 MHz to 943 MHz, 2.4 GHz 8 dBm, 27 dBm I2C, SPI, UART 1.8 V 3.6 V - 40 C + 85 C 22 mm x 22 mm x 2.8 mm Bluetooth Sub GHz Reel, Cut Tape, MouseReel
Microchip Technology 多协议模块 ATWINC3400 802.11 b/g/n + Bluetooth 5 Module U.FL Antenna 65库存量
最低: 1
倍数: 1
2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C u.FL 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 Tray
Silex Technology 多协议模块 Type A USB Connector Sample Piece 13库存量
最低: 1
倍数: 1

SX-USBAC 2.4 GHz, 5 GHz USB 3.135 V 3.465 V - 20 C + 85 C MHF1 22 mm x 21 mm x 2.75 mm 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac Bulk
Jorjin 多协议模块 Based on TI WL1831 and supports 802.11b/g/n & BT/BLE 4.2 111库存量
最低: 1
倍数: 1
: 1,800

2.4 GHz 17 dBm SDIO, UART 2.9 V 4.8 V - 20 C + 75 C 12.8 mm x 12 mm x 1.7 mm Bluetooth 802.11 b/g/n Reel, Cut Tape, MouseReel
Microchip Technology 多协议模块 ATWILC3000 802.11 b/g/n + Bluetooth 5 Module U.FL Antenna 27库存量
最低: 1
倍数: 1

2.4 GHz 18.5 dBm SDIO, SPI, UART 1.62 V 3.6 V - 40 C + 85 C u.FL 22.4 mm x 14.7 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
Microchip Technology 多协议模块 b/g/n + Bluetooth 4 Module U.FL Antenna 46库存量
最低: 1
倍数: 1

ATWINC3400 2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C u.FL 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray