ADLINK Technology 现场I/O

接口模块 1 PICMG, 4 PCI, ISA DOUBLESIDE BACKPLANE

接口模块 EXPAN KIT PCI / PXI PCIe-8560 / PXI-8565

接口模块 cPCI-R61004HP Rear I/O module with GbEx4,COM, USBx4,SATAx2,DVI,VGA,PS/2,CF,SD

接口模块 cBP-6402R6U CompactPCI 64-bit 2-slotCT backplane w/ P3, P5 RIO91-33616-003 REV:B4

接口模块 cBP-6413DR13-slot BP for 6U CPCI64-bit, Dual System, 8+5,H.100 bus, P3/P5 rearI/O 91-33621-001 Rev:B1

接口模块 cPCI-R3P00RRear Transition Module 8HP Rear I/O Module with GbEx2, COMx2, USBx2, SATAx3, VGA, 50mm Depth, reversed F/P for cBP-3213(R)

接口模块 cPCI-R3P00T,CC8 HP Rear I/O module for cPCI-3970 with GbE x2,COM x2, USB x2, SATA x3, VGA, 80mm depth, with conformal coating

I/O 模块 4-ch analog output, 4-ch digital input, RS-485, Modbus RTU and ASCII

接口模块 PCIe-PXIe-8565/1MPCIe Gen1 x1 (250MB/s) to PXIe chassis kit with 1 meter cablePCIe-8560, PXIe-8565, ACL-EXPRESS-1

接口模块 PCI-E x16 to 1 PC-E x16 & 2 PCIw/.Cable 150mm PCB (A):190.10 mm X 73.40 mm X 1.6 mm 4 layer PCB (B):115mmX18.64mmX1.6mm 4 layer PCB (C):89.25mmX12mmX1.6mm 4 layer

接口模块 2-CH PCI Express X 4 Gen2 GigE Grabber with total POE Power up to 60W, POE Protection, POE Power Management. New design

接口模块 M.2(B+M) to Single Channel CANbus ModulePower Consumption: MAX 1.485WDimension: 30 x 51 x 4 mmOperating Temperature: -40-85