|
|
IGBT 模块 HybridPACK Drive G2 CoolSiC: Compact 750 V/600 A B6-bridge power module optimized for inverter various power classes
- FS01M3R08A7MA2BHPSA1
- Infineon Technologies
-
1:
¥5,635.9428
-
3库存量
-
新产品
|
Mouser 零件编号
726-FS01M3R08A7MA2BH
新产品
|
Infineon Technologies
|
IGBT 模块 HybridPACK Drive G2 CoolSiC: Compact 750 V/600 A B6-bridge power module optimized for inverter various power classes
|
|
3库存量
|
|
最低： 1
倍数： 1
|
|
IGBT Modules
|
Si
|
Press Fit
|
|
|
|
|
分立半导体模块 HybridPACK Drive G2 module with SiC MOSFET
- FS01M3R08A8MA2CHPSA1
- Infineon Technologies
-
1:
¥5,677.1313
-
3库存量
-
新产品
|
Mouser 零件编号
726-FS01M3R08A8MA2CH
新产品
|
Infineon Technologies
|
分立半导体模块 HybridPACK Drive G2 module with SiC MOSFET
|
|
3库存量
|
|
最低： 1
倍数： 1
|
|
Discrete Semiconductor Modules
|
SiC
|
Press Fit
|
HybridPACK
|
|
|
|
IGBT 模块 HybridPACK Drive G2 CoolSiC: Compact 750 V/500 A B6-bridge power module optimized for inverter various power classes
- FS02MR08A7MA2BHPSA1
- Infineon Technologies
-
1:
¥6,307.5922
-
3库存量
-
新产品
|
Mouser 零件编号
726-FS02MR08A7MA2BHP
新产品
|
Infineon Technologies
|
IGBT 模块 HybridPACK Drive G2 CoolSiC: Compact 750 V/500 A B6-bridge power module optimized for inverter various power classes
|
|
3库存量
|
|
|
¥6,307.5922
|
|
|
¥4,975.1188
|
|
最低： 1
倍数： 1
|
|
IGBT Modules
|
SiC
|
Press Fit
|
|
|
|
|
IGBT 模块 HybridPACK Drive G2 CoolSiC: Compact 1200 V/300 A B6-bridge power module optimized for inverter various power classes
- FS03M1R12A7MA2BHPSA1
- Infineon Technologies
-
1:
¥4,300.4071
-
4库存量
-
6预期 2026/10/22
-
新产品
|
Mouser 零件编号
726-FS03M1R12A7MA2BH
新产品
|
Infineon Technologies
|
IGBT 模块 HybridPACK Drive G2 CoolSiC: Compact 1200 V/300 A B6-bridge power module optimized for inverter various power classes
|
|
4库存量
6预期 2026/10/22
|
|
最低： 1
倍数： 1
|
|
IGBT Modules
|
SiC
|
Press Fit
|
|
|
|
|
IGBT 模块 HybridPACK Drive G2 module : compact six-pack power module (1200V/520A) with enhanced package optimized for hybrid and electric vehicles
- FS520R12A8P1BHPSA1
- Infineon Technologies
-
1:
¥4,162.7618
-
3库存量
-
新产品
|
Mouser 零件编号
726-FS520R12A8P1BHPS
新产品
|
Infineon Technologies
|
IGBT 模块 HybridPACK Drive G2 module : compact six-pack power module (1200V/520A) with enhanced package optimized for hybrid and electric vehicles
|
|
3库存量
|
|
|
¥4,162.7618
|
|
|
¥3,091.8382
|
|
最低： 1
倍数： 1
|
|
IGBT Modules
|
Si
|
Press Fit
|
|
|
|
|
MOSFET模块 HybridPACK Drive G2 with Si/SiC Fusion switch: Compact 750V B6-bridge power module optimized for traction inverter applications
- FS980R08A7F32BHPSA1
- Infineon Technologies
-
1:
¥4,629.949
-
3库存量
-
新产品
|
Mouser 零件编号
726-FS980R08A7F32BHP
新产品
|
Infineon Technologies
|
MOSFET模块 HybridPACK Drive G2 with Si/SiC Fusion switch: Compact 750V B6-bridge power module optimized for traction inverter applications
|
|
3库存量
|
|
|
¥4,629.949
|
|
|
¥3,551.4996
|
|
最低： 1
倍数： 1
|
|
MOSFET Modules
|
Si, SiC
|
Screw Mount
|
|
|
|
|
分立半导体模块 HybridPACK Drive G2 module with SiC MOSFET
- FS01MR08A8MA2CHPSA1
- Infineon Technologies
-
1:
¥7,138.4699
-
6库存量
-
新产品
|
Mouser 零件编号
726-FS01MR08A8MA2CHP
新产品
|
Infineon Technologies
|
分立半导体模块 HybridPACK Drive G2 module with SiC MOSFET
|
|
6库存量
|
|
最低： 1
倍数： 1
|
|
Discrete Semiconductor Modules
|
SiC
|
Press Fit
|
|
|
|
|
MOSFET模块 HybridPACK Drive G2 module
- FS410R12A7P1BHPSA1
- Infineon Technologies
-
1:
¥3,385.7286
-
17库存量
-
新产品
|
Mouser 零件编号
726-FS410R12A7P1BHPS
新产品
|
Infineon Technologies
|
MOSFET模块 HybridPACK Drive G2 module
|
|
17库存量
|
|
最低： 1
倍数： 1
|
|
MOSFET Modules
|
|
Screw Mount
|
HybridPACK
|
|
|
|
MOSFET模块 HybridPACK Drive G2 module
- FS1000R08A7P3BHPSA1
- Infineon Technologies
-
1:
¥3,257.8578
-
3库存量
-
新产品
|
Mouser 零件编号
726-FS1000R08A7P3BHP
新产品
|
Infineon Technologies
|
MOSFET模块 HybridPACK Drive G2 module
|
|
3库存量
|
|
最低： 1
倍数： 1
|
|
MOSFET Modules
|
Si
|
Screw Mount
|
HybridPACK
|
|
|
|
分立半导体模块 HybridPACK Drive G2 module
- FS1150R08A8P3CHPSA1
- Infineon Technologies
-
1:
¥3,996.2563
-
3库存量
-
新产品
|
Mouser 零件编号
726-FS1150R08A8P3CHP
新产品
|
Infineon Technologies
|
分立半导体模块 HybridPACK Drive G2 module
|
|
3库存量
|
|
|
¥3,996.2563
|
|
|
¥3,206.6462
|
|
最低： 1
倍数： 1
|
|
Discrete Semiconductor Modules
|
SiC
|
Press Fit
|
DIP-7
|
|
|
|
IGBT 模块 HYBRID PACK DRIVE G2 SI
- FS520R12A8P1LBHPSA1
- Infineon Technologies
-
1:
¥3,400.7011
-
25库存量
|
Mouser 零件编号
726-FS520R12A8P1LBHP
|
Infineon Technologies
|
IGBT 模块 HYBRID PACK DRIVE G2 SI
|
|
25库存量
|
|
最低： 1
倍数： 1
|
|
IGBT Modules
|
Si
|
Press Fit
|
|
|
|
|
分立半导体模块 HYBRID PACK DRIVE G2 SI
- FS1150R08A8P3LMCHPSA1
- Infineon Technologies
-
1:
¥3,019.5521
-
8库存量
|
Mouser 零件编号
726-FS1150R08A8P3LMC
|
Infineon Technologies
|
分立半导体模块 HYBRID PACK DRIVE G2 SI
|
|
8库存量
|
|
|
¥3,019.5521
|
|
|
¥2,897.6251
|
|
最低： 1
倍数： 1
|
|
Discrete Semiconductor Modules
|
Si
|
|
|
|
|
|
分立半导体模块 HYBRID PACK DRIVE G2 SIC
- FS01MR08A8MA2LBCHPSA1
- Infineon Technologies
-
1:
¥7,138.4699
-
5库存量
|
Mouser 零件编号
726-FS01MR08A8MA2LBC
|
Infineon Technologies
|
分立半导体模块 HYBRID PACK DRIVE G2 SIC
|
|
5库存量
|
|
|
¥7,138.4699
|
|
|
¥7,138.3908
|
|
最低： 1
倍数： 1
|
|
Discrete Semiconductor Modules
|
SiC
|
|
|
|
|
|
分立半导体模块 HYBRID PACK DRIVE G2 SI
- FS1150R08A8P3LBCHPSA1
- Infineon Technologies
-
1:
¥3,200.6911
-
8库存量
|
Mouser 零件编号
726-FS1150R08A8P3LBC
|
Infineon Technologies
|
分立半导体模块 HYBRID PACK DRIVE G2 SI
|
|
8库存量
|
|
|
¥3,200.6911
|
|
|
¥3,049.079
|
|
最低： 1
倍数： 1
|
|
Discrete Semiconductor Modules
|
Si
|
|
|
|
|
|
分立半导体模块 HybridPACK Drive G2 module with SiC MOSFET
- FS01M5R12A7MA2BHPSA1
- Infineon Technologies
-
1:
¥7,746.9297
-
6预期 2026/10/15
-
新产品
|
Mouser 零件编号
726-FS01M5R12A7MA2BH
新产品
|
Infineon Technologies
|
分立半导体模块 HybridPACK Drive G2 module with SiC MOSFET
|
|
6预期 2026/10/15
|
|
最低： 1
倍数： 1
|
|
Discrete Semiconductor Modules
|
SiC
|
Press Fit
|
HybridPACK
|
|
