Power Modules 分立半导体

分离式半导体类型

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选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS 产品类型 技术 安装风格 封装 / 箱体
Microchip Technology APTGX600U120D4G
Microchip Technology IGBT 模块 PM-IGBT-TFS-D4

IGBT Modules Si Screw Mount D4
Microchip Technology APTGX75A120T1G
Microchip Technology IGBT 模块 PM-IGBT-TFS-SP1F

IGBT Modules Si Screw Mount SP1F
Microchip Technology APTGX800U120D4G
Microchip Technology IGBT 模块 PM-IGBT-TFS-D4

IGBT Modules Si Screw Mount D4
GeneSiC Semiconductor MOSFET模块 2300V 5.8m Half-Bridge SiCPAK G+ SiC Power Module

MOSFET Modules
GeneSiC Semiconductor MOSFET模块 2300V 5.8m Half-Bridge SiCPAK G+ SiC Power Module, with Pre-Applied TIM

MOSFET Modules
GeneSiC Semiconductor MOSFET模块 2300V 8.0m Full-Bridge / Dual-Half-Bridge SiCPAK G+ SiC Power Module

MOSFET Modules SiCPAK G+
GeneSiC Semiconductor MOSFET模块 2300V 8.0m Full-Bridge / Dual-Half-Bridge SiCPAK G+ SiC Power Module, with Pre-Applied TIM

MOSFET Modules
GeneSiC Semiconductor G4H11MT23GB4
GeneSiC Semiconductor MOSFET模块 2300V 11.5m Full-Bridge / Dual-Half-Bridge SiCPAK G+ SiC Power Module

MOSFET Modules
GeneSiC Semiconductor G4H11MT23GB4-T
GeneSiC Semiconductor MOSFET模块 2300V 11.5m Full-Bridge / Dual-Half-Bridge SiCPAK G+ SiC Power Module, with Pre-Applied TIM

MOSFET Modules
GeneSiC Semiconductor G4H22MT33GB4
GeneSiC Semiconductor MOSFET模块 3300V 22.5m Full-Bridge / Dual-Half-Bridge SiCPAK G+ SiC Power Module

MOSFET Modules
GeneSiC Semiconductor G4H22MT33GB4-T
GeneSiC Semiconductor MOSFET模块 3300V 22.5m Full-Bridge / Dual-Half-Bridge SiCPAK G+ SiC Power Module, with Pre-Applied TIM

MOSFET Modules