WIRE PRO RF片上系统 - SoC

结果: 167
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 类型 核心 工作频率 最大数据速率 输出功率 灵敏度 电源电压-最小 电源电压-最大 接收供电电流 传输供电电流 程序存储器大小 最小工作温度 最大工作温度 封装 / 箱体 封装
Telink RF片上系统 - SoC BLE 5.2 + 15.4 SoC, 1MB Flash, temp -40C to 85C, 48 Pin 无库存
最低: 3,000
倍数: 3,000
RISC-V 2.4 GHz 2 Mbps 10 dBm - 95.5 dBm 1.8 V 4.3 V 6.1 mA 6.6 mA 1 MB - 40 C + 85 C QFN-48
Nordic Semiconductor RF片上系统 - SoC Bluetooth 4.2 & 5 NFC tag QFN 48 无库存交货期 16 周
最低: 1
倍数: 1

Bluetooth ARM Cortex M4 2.4 GHz 2 Mbps 4 dBm - 96 dBm 1.7 V 3.6 V 5.4 mA 5.3 mA 256 kB - 40 C + 85 C QFN-48 Tray
Nordic Semiconductor RF片上系统 - SoC 256KB Flash 16KB RAM 2.4G Multi protocol 无库存交货期 20 周
最低: 7,000
倍数: 7,000
: 7,000

4 dBm WLCSP-62 Reel
STMicroelectronics RF片上系统 - SoC Programmable power-line communication modem system-on-chip 无库存交货期 52 周

BLE ARM Cortex M4F 25 MHz 50 Mbps 1.1 V 1.1 V - 40 C + 105 C QFN-56 Tray

STMicroelectronics RF片上系统 - SoC Programmable Bluetooth LE 5.2 Wireless SoC 2,645库存量
最低: 1
倍数: 1

Bluetooth ARM Cortex M0 2.4 GHz 2 Mbps 8 dBm - 88 dBm 1.7 V 3.6 V 7.7 mA 15.1 mA 256 kB - 40 C + 105 C QFN-48 Reel, Cut Tape
Microchip Technology RF片上系统 - SoC External Antenna SiP Module 470库存量
最低: 1
倍数: 1

Bluetooth ARM Cortex M0 2.4 GHz 1 Mbps 3.5 dBm - 93 dBm 2.3 V 3.6 V 5 mA 3.2 mA 256 kB - 40 C + 85 C
STMicroelectronics RF片上系统 - SoC Programmable Bluetooth LE 5.2 Wireless SoC 783库存量
最低: 1
倍数: 1

Bluetooth ARM Cortex M0 2.4 GHz 2 Mbps 8 dBm - 88 dBm 1.7 V 3.6 V 7.7 mA 15.1 mA 256 kB - 40 C + 105 C QFN-32 Reel, Cut Tape, MouseReel
STMicroelectronics RF片上系统 - SoC Programmable Bluetooth LE 5.2 Wireless SoC 2,303库存量
最低: 1
倍数: 1

Bluetooth ARM Cortex M0 2.4 GHz 2 Mbps 8 dBm - 88 dBm 1.7 V 3.6 V 7.7 mA 15.1 mA 160 kB - 40 C + 105 C QFN-32 Reel, Cut Tape, MouseReel
Silicon Labs RF片上系统 - SoC Blue Gecko SoC, 2.4 GHz/sub-GHz, 256 kB flash, 32 kB RAM, +20 dBm, QFN-48, BLE, proprietary 7库存量
最低: 1
倍数: 1

Sub-GHz ARM Cortex M4 2.4 GHz 1 Mbps 19.5 dBm, 20 dBm - 92.5 dBm 1.85 V 3.8 V 7.6 mA, 8.7 mA 8.2 mA, 34.5 mA 256 kB - 40 C + 85 C QFN-48 Tray
Atmosic Technologies RF片上系统 - SoC ATM34 SoC, 4x4 BGA,93balls, 2.5M NVM SR (Small Reel)
Low Power Bluetooth ARM Cortex M33F 2.402 GHz to 2.48 GHz 2 Mb/s 10 dBm 1.7 V 3.465 V 1.5 mA 12.5 mA - 40 C + 85 C BGA-93 Reel, Cut Tape
Analog Devices RF片上系统 - SoC SmartMesh IP Wireless 802.15.4e S-on-Chi

Wi-Fi ARM Cortex M3 2.4 GHz 250 kbps 8 dBm - 93 dBm 2.1 V 3.76 V 4.5 mA 9.7 mA 72 kB, 512 kB - 40 C + 85 C QFN-72 Tray
Analog Devices RF片上系统 - SoC SmartMesh WirelessHART Mote-on-Chip

Wi-Fi ARM Cortex M3 2.4 GHz 250 kbps 8 dBm - 93 dBm 2.1 V 3.76 V 4.5 mA 9.7 mA 72 kB, 512 kB - 40 C + 85 C QFN-72 Tray
STMicroelectronics RF片上系统 - SoC Programmable Bluetooth LE 5.3 Wireless SoC

Reel
STMicroelectronics RF片上系统 - SoC Programmable Bluetooth LE 5.3 Wireless SoC

Reel, Cut Tape, MouseReel
Silicon Labs RF片上系统 - SoC Flex Gecko, QFN32, 2.4G, 6dB, Proprietary, 512kB, 32kB(RAM), 18 GPIO

ARM Cortex M33 2 Mbps 6 dBm - 96.2 dBm 1.71 V 3.8 V 3.6 mA 8.2 mA 512 kB - 40 C + 125 C QFN-32 Reel
Silicon Labs RF片上系统 - SoC Flex Gecko, QFN40, 2.4G, 6dB, Proprietary, 512kB, 32kB(RAM), 26 GPIO

ARM Cortex M33 2 Mbps 6 dBm - 96.2 dBm 1.71 V 3.8 V 3.6 mA 8.2 mA 512 kB - 40 C + 125 C QFN-40 Reel
Analog Devices RF片上系统 - SoC SmartMesh WirelessHART Mote-on-Chip

Wi-Fi ARM Cortex M3 2.4 GHz 250 kbps 8 dBm - 93 dBm 3.6 V 3.6 V 4.7 mA 9.9 mA - 55 C + 105 C QFN-72 Tray
Analog Devices RF片上系统 - SoC SmartMesh IP Wireless 802.15.4e S-on-Chi

Wi-Fi ARM Cortex M3 2.4 GHz 250 kbps 8 dBm - 93 dBm 2.1 V 3.76 V 4.7 mA 9.7 mA 72 kB, 512 kB - 55 C + 105 C QFN-72 Tray
STMicroelectronics RF片上系统 - SoC Ultra-low-power, 2.4 GHz network processor, Bluetooth LE 5.4 certified

Bluetooth LE 5.4 ARM Cortex M0+ 2.4 GHz 2 Mbps 8 dBm - 104 dBm 1.7 V 3.6 V 3.4 mA 4.3 mA - 40 C + 105 C WLCSP-36 Reel
STMicroelectronics RF片上系统 - SoC Ultra-low-power, 2.4 GHz network processor, Bluetooth LE 5.4 certified

Bluetooth LE 5.4 ARM Cortex M0+ 2.4 GHz 2 Mbps 8 dBm - 104 dBm 1.7 V 3.6 V 3.4 mA 4.3 mA - 40 C + 105 C VFQFPN-32 Reel, Cut Tape, MouseReel

Telink RF片上系统 - SoC BLE 5.0 + 2.4G Proprietary SoC,512KB Flash,temp -40C to 85C, 40 pin
RISC 2.4 GHz to 2.483 GHz 2 Mbps 10 dBm - 97 dBm 1.8 V 3.6 V 9.1 mA 9.5 mA 512 kB - 40 C + 85 C QFN-40
Telink RF片上系统 - SoC BLE 5.0 + 2.4G Proprietary SoC,128KB Flash,temp -40C to 85C, 16 pin
RISC 2.4 GHz to 2.483 GHz 2 Mbps 10 dBm - 97 dBm 1.8 V 3.6 V 9.1 mA 9.5 mA 128 kB - 40 C + 85 C SOP-16
Telink RF片上系统 - SoC BLE 5.0 + 2.4G Proprietary SoC,128KB Flash,temp -40C to 85C, 24 pin
RISC 2.4 GHz to 2.483 GHz 2 Mbps 10 dBm - 97 dBm 1.8 V 3.6 V 9.1 mA 9.5 mA 128 kB - 40 C + 85 C QFN-24
Renesas / Dialog DA14708-00000HZ2
Renesas / Dialog RF片上系统 - SoC Multi-core wireless MCU for Bluetooth 5.2 and proprietary 2G4 protocols

Bluetooth 5.2 ARM Cortex M33 2.4 GHz 2 Mbps 6 dBm - 97 dBm 2.9 V 4.75 V 1.85 mA 3 mA 4 kB - 40 C + 85 C VFBGA-142 Reel
Renesas / Dialog DA14701-00000HZ2
Renesas / Dialog RF片上系统 - SoC Multi-core wireless MCU for Bluetooth 5.2 and proprietary 2G4 protocols

Bluetooth 5.2 ARM Cortex M33 2.4 GHz 2 Mbps 6 dBm - 97 dBm 2.9 V 4.75 V 1.85 mA 3 mA 4 kB - 40 C + 85 C VFBGA-142 Reel