- 20 C 无线和射频集成电路

结果: 1,232
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS 产品类型 类型 安装风格 封装 / 箱体
Mini-Circuits 射频放大器 Connectorized SMA, High Power Amplifier, 20 MHz to 2700 MHz, 50ohm

RF Amplifier Power Amplifiers Screw
Mini-Circuits 射频放大器 High Power Amplifier, 20 - 1000 MHz, 50ohm

RF Amplifier Power Amplifiers SMD/SMT
Mini-Circuits RF 开关 IC Absorptive SPDT, Solid State Switch, DC - 5000 MHz, 50ohm

RF Switch ICs SMD/SMT 31.75 mm x 31.75 mm
Ambiq RF片上系统 - SoC Cortex-M55 250MHz, 2MB MRAM, 2MB SRAM, -20 to +70 C, CSP

RF System on a Chip - SoC SMD/SMT
Ambiq RF片上系统 - SoC Cortex-M55 250MHz, 2.5D GPU, 2MB MRAM, 2MB SRAM, -20 to +70 C, BGA

RF System on a Chip - SoC SMD/SMT
Ambiq RF片上系统 - SoC Cortex-M55 250MHz, 2.5D GPU, 2MB MRAM, 2MB SRAM, -20 to +70 C, CSP

RF System on a Chip - SoC SMD/SMT
Lantronix RF片上系统 - SoC Open-Q 4290CS SIP, 2GB LPDDR4, 16G eMMC, Wi-Fi, BT, Android 12 Go

RF System on a Chip - SoC Bluetooth, Wi-Fi SMD/SMT
Lantronix RF片上系统 - SoC Open-Q 4290CS SIP, 4GB LPDDR4, 64G eMMC, Wi-Fi, BT, Android 12

RF System on a Chip - SoC Bluetooth, Wi-Fi SMD/SMT
Silicon Labs RF片上系统 - SoC BG29, 1024kB Flash, 256kB RAM, +4 dBm, DCDC Boost, +55C, 19 GPIO, WLCSP45

RF System on a Chip - SoC SMD/SMT WLCSP-45
Silicon Labs RF片上系统 - SoC BG29, 1024kB Flash, 256kB RAM, +6 dBm, DCDC Boost, +55C, 25 GPIO, QFN40

RF System on a Chip - SoC SMD/SMT QFN-40
Silicon Labs RF片上系统 - SoC BG29, 1024kB Flash, 256kB RAM, +6 dBm, DCDC Boost, +55C, 25 GPIO, QFN40

RF System on a Chip - SoC SMD/SMT QFN-40
Silicon Labs RF片上系统 - SoC MG29, 1024kB Flash, 256kB RAM, +6 dBm, DCDC Boost, +55C, 25 GPIO, QFN40

RF System on a Chip - SoC SMD/SMT QFN-40
Silicon Labs RF片上系统 - SoC MG29, 1024kB Flash, 256kB RAM, +6 dBm, DCDC Boost, +55C, 25 GPIO, QFN40

RF System on a Chip - SoC SMD/SMT QFN-40
Infineon Technologies RF片上系统 - SoC WIFI IOT COMBO

RF System on a Chip - SoC SMD/SMT WLBGA-106
Infineon Technologies RF片上系统 - SoC WIFI IOT COMBO

RF System on a Chip - SoC SMD/SMT WLCSP-251
Ambiq RF片上系统 - SoC Cortex-M4F 192MHz, 2.5D GPU, 2MB MRAM, 1.8MB SRAM, BLE5.4, -20 to +60 C, 131-pin BGA, B2

RF System on a Chip - SoC Apollo4 Blue SoC SMD/SMT BGA-131
Ambiq RF片上系统 - SoC Cortex-M4F 192MHz, 2.5D GPU, 2MB MRAM, 1.8MB SRAM, -20 to +60 C, 146-pin BGA, B2

RF System on a Chip - SoC Apollo4 SoC SMD/SMT BGA-146
Lantronix QC-SIP-4290CS-C
Lantronix RF片上系统 - SoC Open-Q? 4290CS SIP (4GB/256GB), based on Qualcomm QCS4290 processor
RF System on a Chip - SoC Bluetooth, Wi-Fi, Android SMD/SMT
DiTom 射频隔离器 1.20 - 1.40 GHz Isolator

RF Isolators Single Junction 1.25 in x 0.73 in x 1.25 in
DiTom 射频隔离器 1.20 - 1.40 GHz Isolator

RF Isolators Single Junction 1.25 in x 0.73 in x 1.25 in
DiTom 射频隔离器 1.40 - 1.60 GHz Isolator

RF Isolators Single Junction 1.25 in x 0.73 in x 1.25 in
DiTom 射频隔离器 1.40 - 1.60 GHz Isolator

RF Isolators Single Junction 1.25 in x 0.73 in x 1.25 in
DiTom 射频隔离器 1.40 - 1.60 GHz Isolator

RF Isolators Single Junction 1.25 in x 0.73 in x 1.25 in
DiTom 射频隔离器 1.60 - 1.80 GHz Isolator

RF Isolators Single Junction 1.25 in x 0.73 in x 1.25 in
DiTom 射频隔离器 1.60 - 1.80 GHz Isolator

RF Isolators Single Junction 1.25 in x 0.73 in x 1.25 in