25.4 mm 热管理产品

结果: 95
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS

Bergquist Company 导热接口产品 Insulator, 0.006" Thickness, 25.4x19.05mm, SIL PAD TSPK1300/K-10, IDH 2167649

Laird 导热接口产品 TO-247, 0.750X1.0 H.140,T-gard 5000-A0


Bergquist Company 导热接口产品 High Reliability Insulator, 0.015" Thickness, Sil-Pad TSP3500/2000, IDH 2191272


Bergquist Company 导热接口产品 SIL PAD, Low-Pressure, 0.009" Thickness, 25.4x19.05mm, TSP1600S/900S


Bergquist Company 导热接口产品 Sil-Pad, Medium Performance Kapton-Based Insulator, 0.006" Thickness

Bergquist Company 导热接口产品 Phase Change Material, 0.005" Thickness, 1 Side Adhesive, Hi-Flow THF 500/625

Advanced Thermal Solutions 散热片 BGA Heat Sink, High Performance, Stamped, No TIM, TO220, 25.4x39.4x9.5mm

Same Sky 散热片 heat sink, stamping, TO-218/TO-220, 24.4 x 25.4 x 12.7 mm, solder pin

Same Sky 散热片 25.4x41.6x25mm w/pin extrusion TO-218

Same Sky 散热片 42.5 x 24.2 x 25.4mm TO-220 bolt on/pin

Same Sky 散热片 20 x 25.9 x 7.1mm TO-220 clip

Laird 导热接口产品 Tgon 805 KIT 1.000x1.000in


Bergquist Company 导热接口产品 Polyimide-Based Insulator, 0.006" Thickness, Sil-Pad TSPK1300/K-10

Advanced Thermal Solutions ATS-PCBM1099
Advanced Thermal Solutions 散热片 Heat Sink, Board Level, No TIM, Aluminum, TO218/TO220/TO247, 25.4x46.1x25mm

Advanced Thermal Solutions ATS-PCBM1103
Advanced Thermal Solutions 散热片 Heat Sink, Board Level, No TIM, Aluminum, TO218/TO220/TO247, 25.4x42x25mm LxWxH

Bergquist Company 2197723
Bergquist Company 导热接口产品 GAP PAD, S-Class, 1x1", TGP5000/5000S35
Aavid 散热片 Channel Heat Sink w/2 Tab for TO220, Vertical, 13.6 C/W, Black, 3.10mm Hole

Wakefield Thermal 散热片 Unidirectional Fin, Vertical Mount Heat Sink for TO220, TO218, No Pin, 25.4mm H

Wakefield Thermal 散热片 Heat Sink for Vertical Mount for TO220/TO247/TO218/15-LEAD MULTIWATT, 25.4mm H

Wakefield Thermal 657-25ABPESC
Wakefield Thermal 散热片 High Performance Heat Sink for Vertical Board Mounting T0220, T0227, T0218