ACCESSORY CPU与芯片冷却器

结果: 302
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 高度 深度 宽度 工作电源电压 功率额定值 速度 气流 轴承类型 系列 特点
Rego Electronics CPU与芯片冷却器 Extruded Aluminum Radial fins Push PinFan 40x10 Axial w/ PWM

22.5 mm 49 mm
Rego Electronics CPU与芯片冷却器 Aluminum stacked fins w/ Copper base w/ heat pipesSystem Fan
64.5 mm 92.4 mm
Rego Electronics RGM5220
Rego Electronics CPU与芯片冷却器 Aluminum stacked fins w/ heat pipesFan 60x25 Axial w/ PWM

Rego Electronics RGE420
Rego Electronics CPU与芯片冷却器 Aluminum stacked fins w/ Copper base w/ heat pipesFan 92x25 Axial w/ PWM

JUMPtec CPU与芯片冷却器 COMe Active Uni Cooler2 (w/o HSP)

Advantech 1970004886N001
Advantech CPU与芯片冷却器 C.L. R2 I-TGL UP3-28W 84x55x34-SC 12V3C
congatec CPU与芯片冷却器 Passive cooling for SMARC 2.0 module conga-SA7* For modules with lidded Intel Atom processor* All stand-offs are with 2.7mm bore hole

conga-SA7 Intel Elkhart Lake
congatec conga-TC700/CSA-HP-T
congatec CPU与芯片冷却器 Standard active cooling solution for high performance COM Express module conga-TC700 with integrated heat pipes, 25.5mm height and integrated 12V fan. All standoffs are M2.5mm threaded.

congatec conga-HPC/mRLP-CSA-T
congatec CPU与芯片冷却器 Standard active cooling solution for COM-HPC module conga-HPC/mRLP with 25mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm threaded.

APC by Schneider Electric CPU与芯片冷却器 InRow RD 300mm Fluid Cooled208-230V
208 VAC to 230 VAC
congatec CPU与芯片冷却器 Passive cooling for Pico ITX module conga-PA7*For CPUs with standard silicone die*Four stand-offs M2.5 threaded
conga-PA7 Intel Elkhart Lake
congatec CPU与芯片冷却器 Passive cooling solution for COMe mini module conga-MA7 with lidded Intel Atom Exxx processor. All standoffs are M2.5 threaded

conga-MA7 Intel Elkhart Lake
IEI CPU与芯片冷却器 B645;COOLER MODULE;HEATSINK+BLOWER FAN:95*90*27.45mm;STANDARD;00;Q3,FOR LGA1700 SOCKET CPU;COPPER+SCREW SET*4+BACKPLATE+GREASE;DC FAN:12V,7000RPM,CONNECTOR:2.54-4PIN;DYNATRON;DB128015BU-B;CCL;RoHS

congatec CPU与芯片冷却器 Passive cooling solution for COM Express Compact module conga-TCA7 with lidded Intel Atom processor. bore hole
conga-TCA7 Intel Elkhart Lake
JUMPtec CPU与芯片冷却器 HSP COMe-bV26 Cu-core through

JUMPtec CPU与芯片冷却器 HSP COMe-bID7 (E2) Cu-core threaded

JUMPtec CPU与芯片冷却器 HSP COMe-bID7 (E2) Cu-core through

JUMPtec CPU与芯片冷却器 HSP COMe-bV26 Cu-core threaded

congatec CPU与芯片冷却器 Passive cooling solution for Qseven module conga-QA7with open-die Intel Pentium/Celeron J and N processors. All standoffs are with 2.7mm bore hole.
conga-QA7 Intel Elkhart Lake
JUMPtec CPU与芯片冷却器 HSP COMe-bTL6 Cu-core threaded

JUMPtec CPU与芯片冷却器 HSP COMe-bTL6 Cu-core through

JUMPtec CPU与芯片冷却器 COMh Size D Active Uni Cooler (w/o HSP)

JUMPtec CPU与芯片冷却器 HSP COMe-cAP6 Cu-core through

JUMPtec CPU与芯片冷却器 COMe Passive Uni Cooler2 (w/o HSP)

congatec CPU与芯片冷却器 Passive cooling solution for COM Express Compact module conga-TCA7 with open silicon Intel Pentium and Celeron processor. bore hole
conga-TCA7 Intel Elkhart Lake