conga-TC700/HSP-HP-B

congatec
787-045754
conga-TC700/HSP-HP-B

制造商:

说明:
散热片 Standard heatspreader for high performance COM Express module conga-TC700 with integrated heat pipes, 11mm height. All standoffs are with 2.7mm bore hole.

寿命周期:
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产品属性 属性值 选择属性
congatec
产品种类: 散热片
发货限制:
 Mouser 目前在您所在地区不销售该产品。
RoHS:  
商标: congatec
封装: Bulk
产品类型: Heat Sinks
工厂包装数量: 1
子类别: Heat Sinks
零件号别名: 045754
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合规代码
USHTS:
8473305100
MXHTS:
8473300002
ECCN:
EAR99
原产地分类
原产国:
不可用
组装原产国/地区:
不可用
扩散国家:
不可用
发货时,国家/地区可能会发生变化。

conga-TC700 COM Express Compact Type 6 CoM

congatec conga-TC700 COM Express Compact Type 6 Computer on Module (CoM) is based on Intel® Core™ Ultra processors and offers Intel performance hybrid architecture with up to 14 cores and 22 threads. This module can be used to integrate AI workloads with lower system complexity, and the Intel Core Ultra processors are x86 client SoCs with up to 6 P cores and up to 8 E cores, supporting up to 20 threads. The conga-TC700 COM includes an SoC-integrated Intel Arc GPU with up to 8 Xe cores and up to 128 execution units to handle graphics up to 2x 8K resolution and quick GPGPU-based vision data (pre)processing. High data throughput and low latency are achieved via the 96GB DDR SO-DIMM with in-band ECC at 5600MTps. congatec conga-TC700 COM Express Compact Type 6 COM is suitable for real-time computing and AI in surgery robots, medical imaging, diagnostic systems, and industrial applications, including inspection systems, stationary robotic arms, and autonomous guided vehicles (AGVs).

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