Amphenol FCI CompacLink™ Gen 5 Board-to-Board Connectors
Amphenol FCI CompacLink™ Gen 5 Board-to-Board Connectors are designed to link the system board and I/O boards via a bridge board or FPC in a notebook PC or industrial PC. These Gen 5 compression board-to-board connectors feature 1mm x 0.60mm pitch and 1.25mm low-profile height. The CompacLink connectors also feature high-density, high-speed interconnect solutions designed for board-to-board applications. The CompacLink board-to-board connectors can be secured with screws and provide flexibility for upgrading and repairing module designs in notebook PCs and industrial PCs.
Features
- Support faster data rates
- Low profile and small form factor
- Compression contacts
- No need for Ball Grid Array (BGA)
- Faster transition
- Saves system height space
- No insertion and withdrawal force issue
- No housing crack issue
- Support customized pin counts and form factors
- Facilitates good airflow
- Easier for upgrading and repairing
Applications
- Notebooks
- Laptops
- Industrial PCs
- Embedded systems
Specifications
- <30V DC operating voltage rating
- 1A (per contact) operating current
- -55°C to +85°C operating temperature range
- High-temperature thermoplastic (UL 94V-0) housing
- 50m maximum change after test contact resistance
- 1MΩ minimum insulation resistance
- 500V AC dielectric withstanding voltage
- 25 mating cycles durability
- 0.35N/pin maximum mating force
- 0.6N/pin minimum contact retention force
Related Products
Amphenol Commercial OSFP互连系统
具有八个高速通道，每端口具有60个触点，触点间距为0.6mm。
发布日期: 2026-10-06
| 更新日期: 2026-10-08