Knowles 2225封装MLC电容器
Knowles 2225封装MLC电容器具有C0G/NP0特性，最小额定电容为6.2nF。这些电容器采用非磁性设计，可提供更高的电容范围及其他高Q值规格。2225封装电容器符合J-STD-020标准，可承受高达+260°C的高温回流焊工艺。Knowles 2225封装MLC电容器采用FlexiCap™端接，专为非磁性应用设计。
特性
- 非磁性设计
- 符合J-STD-020标准，适用于+260°C回流焊工艺
- 烧结端接
- FlexiCap端接
- 适用于非磁性应用
尺寸
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发布日期: 2026-03-31
| 更新日期: 2026-05-04