Parker Chomerics THERM-A-GAP™ GEL Thermally Conductive Gels
Parker Chomerics THERM-A-GAP™ GEL Thermally Conductive Gels are single-component, dispensable thermal gap fillers that are fully cured or require no curing. These gels can be dispensed over a heat-generating component for effective cooling. The gels eliminate multiple thermal gap-filler pad sizes, and their crosslinked gel structure delivers superior long-term thermal stability and performance. The highly conformable gel structure also offers much lower mechanical stress on delicate components than even the softest gap-filling pads. Parker Chomerics THERM-A-GAP GEL Thermally Conductive Gels feature low thermal impedance like greases, but the gels are designed to prevent the pump-out and dry-out issues associated with grease. The gel products are suitable for filling variable thickness gaps in a single application and require only a low compression force.
Features
- Fully cured or require no curing
- Requires no refrigeration, mixing, or additional curing
- One-component, dispensable design
- Proven long-term reliability and superior performance
- No settling occurs in storage
- Highly conformable at low pressures
Applications
- Automotive electronic control units (ECUs)
- Engine, transmission, and braking/ traction controls
- Power conversion equipment
- Power supplies and uninterruptible power supplies (UPS)
- Power semiconductors
- MOSFET arrays with common heat sinks
- Televisions and consumer electronics
Dispense Patterns
Featured Gels
Parker Chomerics THERM-A-GAP™ GEL 30 3.5W/m-K Dispensable Gels
No mixing or curing for superior design flexibility and meets Telcordia silicone standards.
Parker Chomerics THERM-A-GAP™ GEL 37 3.7W/m-K Dispensable Gels
High-performance, single-component, thermal interface material with 3.7W/m-K thermal conductivity.
Parker Chomerics THERM-A-GAP™ GEL 45 4.5W/m-K Dispensable Gels
One-component, silicone-based TIM that is fully cured and offers 4.5W/m-K thermal conductivity.
Parker Chomerics THERM-A-GAP® GEL 50TBL 5W/m-K Thin Bond Line Gels
Single-component, fully cured, dispensable gels with 0.002" (0.05mm) minimum bond-line thickness.
Parker Chomerics THERM-A-GAP™ GEL 75 7.5W/m-K Dispensable Gels
High-performance, single-component, thermal interface material with 7.5W/m-K thermal conductivity.