- 主页
- 新品速递
- 制造商新动向
- Wakefield Thermal
- SKV High Power Skived Fin Heat Sinks - Wakefield Thermal
Wakefield Thermal SKV High Power Skived Fin Heat Sinks
Wakefield Thermal SKV Skived Fin Heat Sinks are an alternative to extruded heat sinks considering the fin density, which extrusion technology cannot achieve. The SKV Skived heat sinks are manufactured using copper or aluminum with 0.5mm thick fins. These fins are produced from a bar of material, approximately 16ft in length, and then cut to length as required by the final application. The SKV series from Wakefield Thermal offers standard off-the-shelf solutions for applications and custom solutions utilizing a plastic pin attachment.
Features
- Plastic push pin attachment for easy insertion
- Plastic pins ensure the integrity of the PCB board
- High fin densities in comparison to extrusion
- No interface between fins and base
- Improved thermal performance
- Minimal tooling cost for non-standards
Related Heat Sinks
Wakefield Thermal Heat Sink Extrusions & Profiles
Available in 1- and 3-foot lengths, manufactured by pushing hot aluminum billets through steel die.
Wakefield Thermal DC/DC Power Brick Heat Sinks
Available in various fin heights and orientations.
Wakefield Thermal RAPID CPU Coolers
Designed to draw heat away from the system CPU and other components in an enclosure.
Wakefield Thermal 690 Extruded Heat Sinks for TO Devices with Clip
Aluminum extruded heat sinks designed for TO-126, TO-220, and TO-247 devices.
Wakefield Thermal omniKlip™ Heat Sinks with Clips
Configurable, high-performance, compact solution for TO-220, TO-247, TO-264, and similar packages.
Wakefield Thermal 960 Series Push-Pin Heat Sinks
Feature pre-assembled plastic push pins with a flexible barb that engage precisely with PCB holes.
Related Heat Sink Accessories
Wakefield Thermal 960 Series Push Pins for Heat Sinks
Designed to work with the 960 series heat sinks and offers an overheight range of 17.6mm to 22.1mm.
Related Thermal Interface Materials
Wakefield Thermal 127-12 Extreme Performance Sil-Free Thermal Grease
Feature extreme performance, phase change, and non-silicone with 12W/m-K thermal conductivity.
Wakefield Thermal DST Double-Sided Adhesive Thermal Tapes
Widely used to bond heat sinks to microprocessors and other power-consuming semiconductors.
Wakefield Thermal BondaTherm™ Equalizer Kits
Eliminates improper ratios and mixing errors commonly found with other epoxy combinations
Wakefield Thermal ulTIMiFlux Thermal Gap Filling Pads
A variety of sizes, thicknesses, conductivities, and durometers for a custom thermal solution.
Wakefield Thermal PL ulTIMiFlux™ Thermal Gap Fillers
Designed to remain where it is dispensed, conform to the surface, and cure in place.
Wakefield Thermal ulTIMiFlux Thermal Material
Excellent replacement for thermal greases designed to improve thermal transfer to the heat sink
Wakefield Thermal PLK ulTIMiFlux™ Gap Pad Evaluation Kits
Features excellent flame retardance and includes 9 varieties of thermal interface materials (TIMs).
Wakefield Thermal ulTIMiFlux Dielectric Phase Change TIM
Thermally conductive electrical insulators for semiconductor-to-heat sink interfaces
Related Heat Transfer Components
Wakefield Thermal 导热管
热性能高,设计用于在一个区域和另一个区域之间或在材料上进行热传递。
Wakefield Thermal Ultra-Thin Heat Pipes
Features a flattened thickness of 1mm or 1.5mm with a 5mm or 6mm diameter and 100mm length.
Wakefield Thermal VC Series Vapor Chambers
Used to transport heat to a large area from a small source or a collection of small sources.
Related CPU Coolers
Wakefield Thermal RAPID CPU Liquid Coolers
Designed to draw heat away from the system CPU and other components in an enclosure.
Additional Resources
- Wakefield Thermal
