所有结果 (704)

congatec Standard passive cooling solution for COM-HPC module conga-HPC/mPTL with 24mm overall heat sink height. All standoffs are M2.5 threaded.

congatec Standard heatspreader for COM-HPC module conga-HPC/mPTL. All standoffs are M2.5 threaded.

模块化计算机 - COM COM-HPC Client module based on Intel Core i9-14900 LGA 1700 processor with 8 P-cores 2.0GHz up to 5.4GHz Turbo and 16 E-cores 1.5GHz up to 4.3GHz Turbo 36MB Intel Smart Cache Intel UHD Graphics 770 with 32EUs Dual channel DDR5 memory interf

congatec COM-HPC Client module based on Intel Core 5 Processor 211E with 6P-cores 2.7GHz up to 4.9GHz Turbo and 4 E-cores 2.0GHz up to 3.7GHz Turbo 20MB Intel Smart Cache Intel UHD Graphics 770 with 24EUs Dual channelDDR5 memory interface Chipset R

congatec COM-HPC Client module based on Intel Core 9 Processor 273PE with 12 P-cores 2.3GHz up to 5.7GHz Turbo 36MB Intel Smart Cache 32EUs Dual channel DDR5 memory interface Chipset R680E Intel code name: Bartlett Lake S

congatec COM-HPC Client module based on Intel Core 5 Processor 213PE with 8 P-cores 2.7GHz up to 5.2GHz Turbo 24MB Intel Smart Cache 24EUs Dual channel DDR5 memory interface Chipset R680EE Intel code name: Bartlett Lake S

congatec COM Express Mini module based on Intel Core Ultra 9 386H processor with 4 P-cores, 8 E-cores and 4 LPE-cores Integrated NPU 18MB Intel Smart Cache LLC Intel Graphics with 4X cores LPDDR5x memorymodule with up to 8533 MT/s and up to 32 GB system memo

congatec COM Express Mini module based on Intel Core Ultra 5 336H processor with 4 P-cores, 4 E-cores and 4 LPE-cores Integrated NPU 18MB Intel Smart Cache LLC Intel Graphics with 4X cores LPDDR5x memorymodule with up to 8533 MT/s and up to 32 GB system memo

congatec Standard heatspreader for high performance COM Express module conga-MC1000 with H484. All standoffs are with 2.7mm bore hole.

congatec Standard heatspreader for high performance COM Express module conga-MC1000 with H404. All standoffs are with 2.7mm bore hole.

congatec SMARC 2.1 module with Intel Atom x6425RE quad core processor with 1.9GHz core frequency, 1.5MB cache, 16GB 3200MT/s LPDDR4x onboard memory and 64GB eMMC onboard flash. Industrial grade temperature range from -40 C to 85 C.

模块化计算机 - COM SMARC 2.0 module with advanced low-power 14nm NXP i.MX 8M Mini Quad processor. Features 4x ARM Cortex-A53 @1.8GHz and 1x ARM Cortex-M4, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Commercial temperature range.