Heat Sinks for AMD Kria™ K26 SOMs

Advanced Thermal Solutions Heat Sinks for AMD Kria™ K26 SOMs are designed to fit the K26 System-On-Module (SOM). These heatsinks are engineered to mount seamlessly to the K26 SOM’s standard heat spreader plate. These heat sinks include high-performance Thermal Interface Material (TIM) and necessary hardware and maximize heat dissipation to keep the device below critical thermal thresholds. These modules are used with AMD’s two starter kits (Robotics and Vision AI). Typical applications include robotics, industrial communications and control, retail analytics, security, smart cameras, and machine vision.

结果: 6
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 产品 长度 宽度 高度
Advanced Thermal Solutions 散热片 Heat Sink for AMD Xilinx Kria K26 SoM Device, Active, Straight, 54x68x20mm 158库存量
最低: 1
倍数: 1

Advanced Thermal Solutions 散热片 Heat Sink for AMD Xilinx Kria K26 SoM Device, Active, Straight, 54x68x10mm 352库存量
最低: 1
倍数: 1

BGA Heat Sink 54 mm 68 mm 20 mm
Advanced Thermal Solutions 散热片 maxiFLOW Heat Sink for AMD Xilinx Kria K26 SoM Device, Passive, 54x68x9.76mm 93库存量
最低: 1
倍数: 1

Advanced Thermal Solutions 散热片 maxiFLOW Heat Sink for AMD Xilinx Kria K26 SoM Device, Passive, 54x68x25mm 104库存量
最低: 1
倍数: 1

Advanced Thermal Solutions 散热片 Heat Sink for AMD Xilinx Kria K26 SoM Device, Passive, Straight, 54x68x10mm 86库存量
最低: 1
倍数: 1

Advanced Thermal Solutions 散热片 Heat Sink for AMD Xilinx Kria K26 SoM Device, Passive, Straight, 54x68x20mm 29库存量
100预期 2026/3/27
最低: 1
倍数: 1