dualFLOW™/quadFLOW™ CPU Coolers for Servers

Advanced Thermal Solutions dualFLOW™/quadFLOW™ CPU Coolers for Servers are designed for 1U and 2U applications where space and airflow are restricted. These heat sinks have a Pulse Width Modulation-enabled blower with 10.8VDC to 13.2VDC operating voltage. A vapor chamber base option improves heat spreading when the heat source is small or not uniform while an optional standard backing plate accommodates the cooling of any high-powered device. ATS dualFLOW/quadFLOW CPU Coolers offer at least 20% improvement over comparable products on the market. These devices have a nickel-plated finish.

结果: 6
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 产品 设计目的 安装风格 散热片材料 热阻 长度 宽度 高度
Advanced Thermal Solutions 散热片 Ultra Cool QuadFLOW Heat Sink, 1U, Cu Fins, Nickel Plate 20库存量
最低: 1
倍数: 1

Heat Sinks LGA2011, LGA2066 Screw Copper 0.2 C/W 92.38 mm 92.11 mm 29 mm
Advanced Thermal Solutions 散热片 Ultra Cool DualFLOW Heat Sink, 1U, Vapor Chamber 4库存量
最低: 1
倍数: 1

Heat Sinks LGA2011, LGA2066 Screw 0.2 C/W 92.38 mm 92.11 mm 29 mm
Advanced Thermal Solutions 散热片 Ultra Cool DualFLOW Heat Sink, 1U, Al Fins, Nickel Plate 39库存量
最低: 1
倍数: 1

Heat Sinks
Advanced Thermal Solutions 散热片 Ultra Cool QuadFLOW Heat Sink, 1U, Al Fins, Nickel Plate
100在途量
最低: 1
倍数: 1

Heat Sinks LGA2011, LGA2066 Screw Aluminum 0.21 C/W 92.38 mm 92.11 mm 29 mm
Advanced Thermal Solutions 散热片 Ultra Cool DualFLOW Heat Sink, 1U, Cu Fins, Nickel Plate 421工厂有库存
最低: 100
倍数: 5

Heat Sinks LGA2011, LGA2066 Screw 0.19 C/W 92.38 mm 92.11 mm 29 mm
Advanced Thermal Solutions 散热片 Ultra Cool QuadFLOW Heat Sink, 1U, Vapor Chamber 204工厂有库存
最低: 100
倍数: 5

Heat Sinks LGA2011, LGA2066 Screw Copper 0.2 C/W 92.38 mm 92.11 mm 29 mm