Pin Fin Value-Line Heat Sinks

Advanced Thermal Solutions Pin Fin Value-Line Heat Sinks are engineered with thin and dense fields of pin-shaped cooling fins. These heat sinks are fabricated from extruded aluminum to minimize thermal resistance from the base to the fins. This process reduces weight and keeps the cost low. These heat sinks are available for component sizes 10mm x 10mm to 60mm x 60mm, and height ranges from 2mm to 25mm with 1mm increments. The pin fin heat sinks feature large surface areas that increase heat sink performance and provide high-efficiency and low-pressure drop characteristics. These heat sinks can be attached to the devices with double-sided thermal adhesive, Z-clip, or maxiGRIP™ technologies. The custom pin fin design offers an excellent cooling solution for spatially constrained PCB layouts when the airflow direction near the device is ambiguous.

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Advanced Thermal Solutions 散热片 BGA Heat Sink, High Aspect Ratio Extrusion, Pin Fin, No TIM, 44.5x43.2x8.9mm
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Heat Sinks BGA PCB Aluminum Omnidirectional Fin 8.4 C/W 44.5 mm 43.2 mm 8.9 mm
Advanced Thermal Solutions 散热片 BGA Heat Sink, Pin Fin, No TIM, Black Anodized, 44.5x43.2x10.2mm (LxWxH)
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Heat Sinks BGA PCB Aluminum Omnidirectional Fin 5 C/W 44.5 mm 43.2 mm 10.2 mm
Advanced Thermal Solutions 散热片 BGA Heat Sink, High Aspect Ratio Extrusion, Pin Fin, No TIM, 43.5x43.5x3.8mm
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Heat Sinks BGA PCB Aluminum Omnidirectional Fin 8 C/W 43.5 mm 43.5 mm 3.8 mm
Advanced Thermal Solutions 散热片 BGA Heat Sink, High Aspect Ratio Extrusion, Pin Fin, No TIM, 53.3x53.3x10.2mm
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Heat Sinks BGA PCB Aluminum Omnidirectional Fin 6.5 C/W 53.3 mm 53.3 mm 10.2 mm
Advanced Thermal Solutions 散热片 BGA Heat Sink, High Aspect Ratio Extrusion, Cross Cut, No TIM, 60x60x15mm
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Heat Sinks BGA PCB Aluminum Omnidirectional Fin 2.77 C/W 60 mm 60 mm 15 mm
Advanced Thermal Solutions 散热片 BGA Heat Sink, High Aspect Ratio Extrusion, Cross Cut, No TIM, 24x24x4mm
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Heat Sinks BGA PCB Aluminum Omnidirectional Fin 32.87 C/W 24 mm 24 mm 4 mm
Advanced Thermal Solutions 散热片 BGA Heat Sink, Pin Fin, No TIM, Black Anodized, 31x31x8mm (LxWxH)
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Heat Sinks BGA Pin Fin
Advanced Thermal Solutions 散热片 BGA Heat Sink, Pin Fin, No TIM, Black Anodized, 40x40x10mm (LxWxH)
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Heat Sinks BGA Aluminum Straight Fin 6.37 C/W 40 mm 40 mm 10 mm
Advanced Thermal Solutions 散热片 BGA Heat Sink, Pin Fin, No TIM, Black Anodized, 21x21x8.9mm (LxWxH)
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Heat Sinks BGA PCB Aluminum Omnidirectional Fin 19 C/W 21 mm 21 mm 8.9 mm
Advanced Thermal Solutions 散热片 BGA Heat Sink, Pin Fin, No TIM, Black Anodized, 25x25x15.2mm (LxWxH)
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Heat Sinks BGA PCB Aluminum Omnidirectional Fin 8 C/W 25 mm 25 mm 15.2 mm
Advanced Thermal Solutions 散热片 BGA Heat Sink, Pin Fin, No TIM, Black Anodized, 35x35x8.9mm (LxWxH)
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Heat Sinks BGA PCB Aluminum Omnidirectional Fin 7.5 C/W 35 mm 35 mm 8.9 mm
Advanced Thermal Solutions 散热片 BGA Heat Sink, High Aspect Ratio Extrusion, Pin Fin, No TIM, 35x35x11.4mm
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Heat Sinks BGA PCB Aluminum Omnidirectional Fin 5.5 C/W 35 mm 35 mm 11.4 mm
Advanced Thermal Solutions 散热片 BGA Heat Sink, High Aspect Ratio Extrusion, Pin Fin, No TIM, 35x35x15.2mm
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Heat Sinks BGA PCB Aluminum Omnidirectional Fin 3.8 C/W 35 mm 35 mm 15.2 mm
Advanced Thermal Solutions 散热片 BGA Heat Sink, Pin Fin, No TIM, Black Anodized, 40.6x40.6x6.6mm (LxWxH)
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Heat Sinks BGA PCB Aluminum Omnidirectional Fin 5.5 C/W 40.6 mm 40.6 mm 6.6 mm
Advanced Thermal Solutions 散热片 BGA Heat Sink, Pin Fin, No TIM, Black Anodized, 53.3x47.2x10.2mm (LxWxH)
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Heat Sinks BGA PCB Aluminum Omnidirectional Fin 7 C/W 53.3 mm 47.2 mm 10.2 mm
Advanced Thermal Solutions 散热片 BGA Heat Sink, High Aspect Ratio Extrusion, Pin Fin, No TIM, 53.3x53.3x25.4mm
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Heat Sinks BGA PCB Aluminum Omnidirectional Fin 1.6 C/W 53.3 mm 53.3 mm 25.4 mm
Advanced Thermal Solutions 散热片 BGA Heat Sink, High Aspect Ratio, Pin Fin, No TIM, 10x10x10mm
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