200-LPAM 板对板与夹层连接器

结果: 113
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 产品 位置数量 节距 排数 端接类型 安装角 叠放高度 电流额定值 电压额定值 最大数据速率 最小工作温度 最大工作温度 触点电镀 触点材料 外壳材料 系列 封装
Samtec 板对板与夹层连接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Reel
Samtec 板对板与夹层连接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel
Samtec 板对板与夹层连接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Reel
Samtec 板对板与夹层连接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Reel
Samtec 板对板与夹层连接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel
Samtec 板对板与夹层连接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Reel, Cut Tape
Samtec 板对板与夹层连接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel
Samtec 板对板与夹层连接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array

LPAM Reel
Samtec 板对板与夹层连接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Reel
Samtec 板对板与夹层连接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel
Samtec 板对板与夹层连接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Reel
Samtec 板对板与夹层连接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array

LPAM Reel
Samtec 板对板与夹层连接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec 板对板与夹层连接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array

LPAM Reel
Samtec 板对板与夹层连接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel
Samtec 板对板与夹层连接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Reel
Samtec 板对板与夹层连接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array

LPAM Reel
Samtec 板对板与夹层连接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array

LPAM Reel
Samtec 板对板与夹层连接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel
Samtec 板对板与夹层连接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Reel
Samtec 板对板与夹层连接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array

LPAM Reel
Samtec 板对板与夹层连接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array

LPAM Reel
Samtec 板对板与夹层连接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Reel
Samtec 板对板与夹层连接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel
Samtec 板对板与夹层连接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array

LPAM Reel