AirBorn D-Sub后壳

结果: 59
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 类型 外壳大小 电缆引入角 电缆引入数量 外壳材质 外壳电镀 位置数量
Molex / AirBorn D-Sub后壳 Rugged Backshell 4 Row NIC 8库存量
最低: 1
倍数: 1

EMI/RFI Backshell Straight 1 Entry Aluminum Nickel 100 Position
Molex / AirBorn D-Sub后壳 Rugged Backshell 3 Row NIC 4库存量
最低: 1
倍数: 1

EMI/RFI Backshell 51 Straight 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub后壳 Rugged Backshell 2 Row NIC 6库存量
最低: 1
倍数: 1
EMI/RFI Backshell 9 Straight 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub后壳 BACKSHELL, M SERIES 5库存量
最低: 1
倍数: 1

EMI/RFI Backshell 31 Straight 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub后壳 Rugged Backshell 2 Row NIC 1库存量
最低: 1
倍数: 1

EMI/RFI Backshell 15 45 deg 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub后壳 Rugged Backshell 4 Row NIC 1库存量
最低: 1
倍数: 1

EMI/RFI Backshell 100 Straight 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub后壳 Rugged Backshell 2 Row NIC 1库存量
最低: 1
倍数: 1

EMI/RFI Backshell 25 Straight 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub后壳 Rugged Backshell 2 Row NIC 8库存量
最低: 1
倍数: 1

EMI/RFI Backshell 21 Straight 1 Entry Aluminum Nickel 21 Position
Molex / AirBorn D-Sub后壳 Micro-D, Metal, EMI/RFI Backshells, Straight Cable Exit, 2 Row, Aluminum w/ nickel plating, 15 Pos 5库存量
最低: 1
倍数: 1

Molex / AirBorn D-Sub后壳 Rugged Backshell 3 Row NIC 7库存量
最低: 1
倍数: 1

EMI/RFI Backshell 51 45 deg 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub后壳 Rugged Backshell 2 Row NIC 1库存量
最低: 1
倍数: 1
EMI/RFI Backshell 21 45 deg 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub后壳 Rugged Backshell 2 Row CAD 6库存量
最低: 1
倍数: 1
EMI/RFI Backshell 9 Straight 1 Entry Aluminum Cadmium
Molex / AirBorn D-Sub后壳 Rugged Backshell 4 Row CAD 1库存量
最低: 1
倍数: 1
EMI/RFI Backshell 100 Straight 1 Entry Aluminum Cadmium
Molex / AirBorn D-Sub后壳 Rugged Backshell 2 Row NIC 无库存交货期 5 周
最低: 1
倍数: 1

EMI/RFI Backshell 37 Straight 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub后壳 .050" Rugged Metal I/O Connector, 2 Row, Str RECPT, Sz 9 无库存交货期 20 周
最低: 1
倍数: 1

EMI/RFI Backshell 9 Straight 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub后壳 Rugged Backshell 2 Row NIC 无库存交货期 20 周
最低: 1
倍数: 1

EMI/RFI Backshell 37 45 deg 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub后壳 Rugged Backshell 2 Row NIC 无库存
最低: 10
倍数: 1

EMI/RFI Backshell 9 Straight 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub后壳 Rugged Backshell 2 Row NIC 无库存
最低: 10
倍数: 1

EMI/RFI Backshell 4 (C) Straight 1 Entry Aluminum Nickel 37 Position
Molex / AirBorn D-Sub后壳 Microminiature Series .050 无库存
最低: 1
倍数: 1

EMI/RFI Backshell Straight 1 Entry Aluminum Nickel 21 Position
Molex / AirBorn D-Sub后壳 Micro-D, Metal, Board Mount, Right Angle Receptacle, Compressed Footprint 无库存
最低: 10
倍数: 1

Molex / AirBorn D-Sub后壳 .050" Low Profile Backshell Metal 无库存
最低: 10
倍数: 1

EMI/RFI Backshell 21 Straight 1 Entry Aluminum Nickel 21 Position
Molex / AirBorn D-Sub后壳 CONNECTOR, M SERIES 无库存
最低: 10
倍数: 1

EMI/RFI Backshell Straight 1 Entry Aluminum Electroless Nickel 25 Position
Molex / AirBorn D-Sub后壳 EMI/RFI Backshell 无库存交货期 21 周
最低: 1
倍数: 1

EMI/RFI Backshell 2 (A) Straight 1 Entry Aluminum 15 Position
Molex / AirBorn D-Sub后壳 Rugged Backshell 2 Row CAD 无库存
最低: 10
倍数: 1
EMI/RFI Backshell 21 45 deg 1 Entry Aluminum Cadmium 21 Position
Molex / AirBorn D-Sub后壳 Rugged Backshell 2 Row CAD 无库存
最低: 10
倍数: 1
EMI/RFI Backshell 31 45 deg 1 Entry Aluminum Cadmium 31 Position