OSD32MP15x System-in-Package (SiP) Devices

Octavo Systems OSD32MP15x System-in-Package (SiP) Devices are based on the STMicroelectronics STM32MP1. The OSD32MP15x delivers all the power of a full microprocessor system in a package that feels like a microcontroller, with a footprint the same size as the ST32MP1 itself.

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数量 RoHS ECAD模型 系列
处理器品牌
处理器类型
频率
RAM最大容量
已安装RAM
工作电源电压
接口类型
最小工作温度
最大工作温度
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封装
Octavo Systems 模块化系统 - SOM System-in-Package: ST Micro STM32MP157C Dual ARM Cortex A7 + M4 Processor, 512MB DDR3L, STPMIC1A, 4KB EEPROM, 24MHz Oscillator, Passives - 18mm x 18mm 302 Ball BGA - 0 C to 85 C
数据表
81库存量
168预期 2026/5/15
最低： 1
倍数： 1
OSD32MP15x STMicroelectronics STM32MP157C 209 MHz, 650 MHz 1 GB 512 MB 2.8 V to 5.5 V Camera, CAN, I2C, SAI, SDIO, SPI, UART, USB 0 C + 85 C 18 mm x 18 mm Tray
Octavo Systems 模块化系统 - SOM System-in-Package: ST Micro STM32MP157C Dual ARM Cortex A7 + M4 Processor, 512MB DDR3L, STPMIC1A, 4KB EEPROM, 24MHz Oscillator, Passives - 18mm x 18mm 302 Ball BGA - -40 C to 85 C
数据表
236库存量
最低： 1
倍数： 1
OSD32MP15x STMicroelectronics STM32MP157C 209 MHz, 650 MHz 1 GB 512 MB 2.8 V to 5.5 V Camera, CAN, I2C, SAI, SDIO, SPI, UART, USB - 40 C + 85 C 18 mm x 18 mm Tray