+ 85 C Tray 模块化系统 - SOM

结果: 54
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 外观尺寸 处理器品牌 处理器类型 频率 RAM最大容量 已安装RAM 工作电源电压 接口类型 最小工作温度 最大工作温度 尺寸 封装
Microchip Technology 模块化系统 - SOM SAMA5D2 + WILC3000 SOM
683预期 2026/7/24
最低: 1
倍数: 1

SAMA5D27 Microchip Technology SAMA5D27 500 MHz 256 MB 256 MB 3.3 V CAN, I2S, QSPI, SSC, SPI, TWI, UART - 40 C + 85 C 40 mm x 38 mm Tray

GHI Electronics 模块化系统 - SOM SITCore SCM20260E SoM
240预期 2026/6/4
最低: 1
倍数: 1

SMD GHI Electronics SC202060B 480 MHz 32 MB 32 MB 3.3 V Ethernet, CAN, GPIO, I2C, PWM, SPI, UART, USB - 40 C + 85 C 1.8 in x 1.55 in Tray
Octavo Systems 模块化系统 - SOM System-in-Package: ST Micro STM32MP157C Dual ARM Cortex A7 + M4 Processor, 512MB DDR3L, STPMIC1A, 4KB EEPROM, 24MHz Oscillator, Passives - 18mm x 18mm 302 Ball BGA - 0 C to 85 C
336在途量
最低: 1
倍数: 1

OSD32MP15x STMicroelectronics STM32MP157C 209 MHz, 650 MHz 1 GB 512 MB 2.8 V to 5.5 V Camera, CAN, I2C, SAI, SDIO, SPI, UART, USB 0 C + 85 C 18 mm x 18 mm Tray
Octavo Systems 模块化系统 - SOM System-in-Package: Texas Instruments AM3358 ARM Cortex A8 Processor, 1GBB DDR3, TPS65217C PMIC, TL5209 LDO, 4KB EEPROM, Passives - 21mm X 21mm 256 Ball BGA - -40 C to 85 C
400预期 2026/7/10
最低: 1
倍数: 1

Texas Instruments AM3358 1 GHz 1 GB 1 GB 1.1 V CAN, Ethernet, GPIO, I2C, SPI, UART, USB 0 C + 85 C 27 mm x 27 mm Tray
Octavo Systems 模块化系统 - SOM AM3358 512MB DDR3 System-In-Package
420预期 2026/7/10
最低: 1
倍数: 1

OSD3358 Texas Instruments AM3358 1 GHz 512 MB 512 MB 1.1 V CAN, Ethernet, GPIO, I2C, SPI, UART, USB 0 C + 85 C 21 mm x 21 mm Tray
Octavo Systems 模块化系统 - SOM System-in-Package: Texas Instruments AM3358 ARM Cortex A8 Processor, 512MB DDR3, TPS65217C PMIC, TL5209 LDO, 4KB EEPROM, Passives - 21mm X 21mm 256 Ball BGA - -40 C to 85 C
2,873在途量
最低: 1
倍数: 1

OSD3358 Texas Instruments AM3358 1 GHz 512 MB 512 MB 1.1 V CAN, Ethernet, GPIO, I2C, SPI, UART, USB - 40 C + 85 C 21 mm x 21 mm Tray
Ezurio 模块化系统 - SOM Nitrogen93 SMARC SOM: i.MX 93 Dual / 2GB / 16GB eMMC / -40 to +85 C
105预期 2026/11/2
最低: 1
倍数: 1

SMARC 2.1.1 i.MX 93 1.7 GHz 4 GB 2 GB 5 V CAN, GPIO, I2C, SPI, UART, USB - 40 C + 85 C 82 mm x 50 mm Tray
Octavo Systems 模块化系统 - SOM Complete System-in-Package: Texas Instruments AM3358 ARM Cortex A8 Processor, 512MB DDR2, TPS65217C PMIC, TL5209 LDO, 4GB eMMC, 24MHz Oscillator, 4KB EEPROM, Passives - 27mm x 27mm 400 Ball BGA - 0 C to 85 C
120预期 2026/8/25
最低: 1
倍数: 1

OSD3358 Texas Instruments AM3358 1 GHz 512 MB 512 MB 1.1 V CAN, Ethernet, GPIO, I2C, SPI, UART, USB 0 C + 85 C 27 mm x 27 mm Tray
GHI Electronics 模块化系统 - SOM G120 Module SOM .net MICRO FRAMEWORK 无库存交货期 11 周
最低: 120
倍数: 24

NXP LPC1788 120 MHz 16 MB 0 GB 3.3 V 1-Wire, CAN, Ethernet, GPIO, I2C, PWM, SPI, UART, USB, WiFi - 40 C + 85 C 38.1 mm x 26.67 mm Tray
Octavo Systems 模块化系统 - SOM System-in-Package: ST Micro STM32MP157F Dual ARM Cortex A7 + M4 Processor, 512MB DDR3L, STPMIC1A, 4KB EEPROM, 24MHz Oscillator, Passives - 18mm x 18mm 302 Ball BGA - 20 C to 85 C 无库存交货期 18 周
最低: 1
倍数: 1

STMicroelectronics STM32MP157F 209 MHz, 800 MHz 384 kB 2.8 V to 5.5 V CAN, I2C, SPI, UART, USB 0 C + 85 C Tray
Digi 模块化系统 - SOM ConnectCore i.MX8X Quad,2GB LPDDR4, 8GB eMMC, 1.2 G 无库存交货期 30 周
最低: 1
倍数: 1

Digi SMTplus NXP i.MX 8X QuadPlus 1.2 GHz 2 GB 2 GB 5 V CAN, Ethernet, GPIO, I2C, I2S, MIPI-CSI, MIPI-DSI, SPI, UART, USB 2.0 OTG, USB 3.0 OTG - 40 C + 85 C 45 mm x 40 mm x 3.5 mm Tray
Digi 模块化系统 - SOM ConnectCore 8X SoM, DualXZ, 8GB eMMC, 1GB LPDDR4Note: Limited graphics and no Cortex-M4 无库存交货期 34 周
最低: 200
倍数: 50

ConnectCore 8X Digi SMTplus NXP i.MX 8X Dual 1.2 GHz 2 GB 1 GB 5 V Ethernet, FlexCAN, GPIO, I2C, I2S/SSI, MIPI-CSI, MIPI-DSI, PCIe, S/PDIF, SPI, UART, USB 3.0 OTG - 40 C + 85 C 45 mm x 40 mm x 3.5 mm Tray
Ezurio 模块化系统 - SOM Nitrogen8M PLUS SMARC: i.MX8M Quad Plus / 4GB / 16GB eMMC / LWB5+ N/A
最低: 1
倍数: 1

NXP i.MX 8M Plus 1.8 GHz 5 V I2C, SPI, UART, USB - 40 C + 85 C 82 mm x 50 mm Tray
GHI Electronics 模块化系统 - SOM G120E SOM .net MICRO FRAMEWORK 无库存
最低: 120
倍数: 1

NXP LPC1788 120 MHz 6 MB 6 MB 3.3 V Ethernet, I2C, GPIO, SPI, UART, USB, WiFi - 40 C + 85 C 45.75 mm x 39.4 mm x 4.4 mm Tray
GHI Electronics 模块化系统 - SOM G400-D SODIMM SOM ARM9 400MHz NETMF 无库存
最低: 1
倍数: 1

SO-DIMM Atmel SAM9X35 400 MHz 128 MB 128 MB 3.3 V 1-Wire, CAN, Ethernet, GPIO, I2C, PWM, SPI, UART, USB, WiFi - 40 C + 85 C 67.49 mm x 32.05 mm Tray
Octavo Systems 模块化系统 - SOM System-in-Package: AMD Zynq UltraScale+ MPSoC ZU3, 2GB LPDDR4, Power Management System, 32MB 3V3 NOR QSPI, Osciallator, Passives - 20.5mmX40mm 600 Ball BGA - 40C to 85C

OSDZU3 Standard BGA XCZU3EG1 2 GB 4.5 V to 5.5 V CAN, I2C, SPI, UART, USB - 40 C + 85 C 20.5 mm X 40 mm Tray
Ezurio 模块化系统 - SOM 60 Series SOM using 1 Gb LPDDR2 RAM and 2 Gb NAND flash

60 Series SOM Atmel ATSAMA5D36 536 MHz, 2.4 GHz, 5 GHz 1 GB 1 GB 1.8 V, 3.3 V Audio, Bluetooth, CAN, Ethernet, HDMI, I2C, MIPI-CSI, MIPI-DSI, SDIO, SPI, UART, USB 3.0, WiFi, Video - 30 C + 85 C 30 mm x 30 mm x 2.8 mm Tray
Ezurio 模块化系统 - SOM Nitrogen93 SMARC SOM: i.MX 93 Dual / 2GB / 16GB eMMC / NX611 / -40 to +85 C

Nitrogen93 SMARC SMARC 2.2 NXP ARM Cortex A55, ARM Cortex M33 2.4 GHz, 5 GHz, 6 GHz 5 V CAN, I2C, SPI, UART, USB - 40 C + 85 C 82 mm x 50 mm Tray
Octavo Systems 模块化系统 - SOM System-in-Package: AMD Zynq UltraScale+ MPSoC ZU3, 2GB LPDDR4, Power Management System, 32MB 1V8 NOR QSPI, Osciallator, Passives - 20.5mmX40mm 600 Ball BGA - 40C to 85C

OSDZU3 Standard BGA XCZU3EG1 2 GB 4.5 V to 5.5 V CAN, I2C, SPI, UART, USB - 40 C + 85 C 20.5 mm X 40 mm Tray
Octavo Systems 模块化系统 - SOM System-in-Package: ST Micro STM32MP153C Dual ARM Cortex A7 + M4 Processor, 512MB DDR3L, STPMIC1A, 4KB EEPROM, 24MHz Oscillator, Passives - 18mm x 18mm 302 Ball BGA - -40 C to 85 C

STMicroelectronics STM32MP153C 209 MHz, 800 MHz 384 kB 2.8 V to 5.5 V CAN, I2C, SPI, UART, USB 0 C + 85 C Tray
Octavo Systems 模块化系统 - SOM System-in-Package: ST Micro STM32MP153C Dual ARM Cortex A7 + M4 Processor, 512MB DDR3L, STPMIC1A, 4KB EEPROM, 24MHz Oscillator, Passives - 18mm x 18mm 302 Ball BGA - 0 C to 85 C

STMicroelectronics STM32MP153C 209 MHz, 800 MHz 384 kB 2.8 V to 5.5 V CAN, I2C, SPI, UART, USB 0 C + 85 C Tray
Octavo Systems 模块化系统 - SOM System-in-Package: ST Micro STM32MP157F Dual ARM Cortex A7 + M4 Processor, 512MB DDR3L, STPMIC1A, 4KB EEPROM, 24MHz Oscillator, Passives - 18mm x 18mm 302 Ball BGA - 0 C to 85 C

STMicroelectronics STM32MP157F 209 MHz, 800 MHz 384 kB 2.8 V to 5.5 V CAN, I2C, SPI, UART, USB 0 C + 85 C Tray
Octavo Systems 模块化系统 - SOM System-in-Package: AMD Zynq UltraScale+ MPSoC ZU3, 2GB LPDDR4, Power Management System, 32MB 1V8 NOR QSPI, Osciallator, Passives - 20.5mmX40mm 600 Ball BGA - 0C to 85C

OSDZU3 Standard BGA XCZU3EG1 2 GB 4.5 V to 5.5 V CAN, I2C, SPI, UART, USB 0 C + 85 C 20.5 mm X 40 mm Tray
Ezurio 模块化系统 - SOM Nitrogen8M PLUS SMARC: i.MX8M Quad Plus / 2GB / 16GB eMMC / LWB5+ / Industrial Temp

NXP i.MX 8M Plus 1.8 GHz 5 V I2C, SPI, UART, USB - 40 C + 85 C 82 mm x 50 mm Tray
Ezurio 模块化系统 - SOM Nitrogen8M PLUS SMARC: i.MX8M Quad Plus / 4GB / 16GB eMMC / LWB5+ / Industrial Temp

NXP i.MX 8M Plus 1.8 GHz 5 V I2C, SPI, UART, USB - 40 C + 85 C 82 mm x 50 mm Tray