+ 85 C 模块化系统 - SOM

结果: 500
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 外观尺寸 处理器品牌 处理器类型 频率 RAM最大容量 已安装RAM 工作电源电压 接口类型 最小工作温度 最大工作温度 尺寸 封装
Trenz Electronic 模块化系统 - SOM FPGA Module with AMD Artix 7A50T-2I, 16 MByte Flash, 1.8V Config., 3 x 4 cm

AMD XC7A50T-2CSG325I - 40 C + 85 C 40 mm x 30 mm
Toradex 模块化系统 - SOM 00351102ApalisiMX6D1GBIT
Apalis iMX6 Apalis NXP i.MX 6Dual 800 MHz 1 GB 3.3 V Analog, CAN, I2C, IrDA, PCIe, SPI, UART, USB - 40 C + 85 C 82 mm x 45 mm x 6 mm
Toradex 模块化系统 - SOM 00521004ColibriiMX8DX1GB

Colibri iMX8X Colibri NXP i.MX 8DualX 1.2 GHz 1 GB 3.3 V Analog, CAN, I2C, IrDA, SPI, UART, USB - 25 C + 85 C 67.6 mm x 36.7 mm x 6.2 mm
Critical Link 模块化系统 - SOM MitySOM-3358 AM3358
MitySOM-335x SO-DIMM Texas Instruments AM335x 1 GHz 512 MB 512 MB 3.2 V to 5.2 V CAN, Ethernet, I2C, GPIO, SPI, UART, USB - 40 C + 85 C 67.6 mm x 38.1 mm
iWave Global 模块化系统 - SOM i.MX 8M Quad SMARC SOM with 2GB LPDDR4, 8GB eMMC, 2xETH, MIPI, 802.11ac Wi-Fi + BLE5.0 - boot code

iW-G33M 82 mm x 50 mm NXP i.MX 8M Quad 266 MHz, 1.5 GHz 2 GB 2 GB 5 V CAN, Ethernet, HDMI, I2C, I2S, MIPI-CSI, MIPI-DSI, PCIe, QSPI, SPI, UART, USB 2.0, USB 3.0, USB 3.0 OTG - 40 C + 85 C 82 mm x 50 mm
Trenz Electronic 模块化系统 - SOM MPSoC Module with AMD Zynq UltraScale+ ZU7EV-1I, 4 GByte DDR4, 5.2 x 7.6 cm

4 GB JTAG, I2C - 40 C + 85 C 5.2 cm x 7.6 cm
Trenz Electronic 模块化系统 - SOM MPSoC Module with AMD Zynq UltraScale+ ZU4EV-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm

4 cm x 5 cm AMD XCZU4EV-1SFVC784E 2 GB 2 GB DP, GMII, PCIe, SATA 3.1, USB 3.0 0 C + 85 C 50 mm x 40 mm
Trenz Electronic 模块化系统 - SOM MPSoC Module with AMD Zynq UltraScale+ ZU4EV-1I, 2 GByte DDR4 SDRAM, 4 x 5 cm

4 cm x 5 cm AMD XCZU4EV-1SFVC784I 2 GB 2 GB DP, GMII, PCIe, SATA 3.1, USB 3.0 - 40 C + 85 C 50 mm x 40 mm
Octavo Systems 模块化系统 - SOM System-in-Package: AMD Zynq UltraScale+ MPSoC ZU3, 2GB LPDDR4, Power Management System, 32MB 1V8 NOR QSPI, Osciallator, Passives - 20.5mmX40mm 600 Ball BGA - 40C to 85C

OSDZU3 Standard BGA XCZU3EG1 2 GB 4.5 V to 5.5 V CAN, I2C, SPI, UART, USB - 40 C + 85 C 20.5 mm X 40 mm Tray
Trenz Electronic 模块化系统 - SOM MPSoC Module with AMD Zynq UltraScale+ ZU4EV-1E, 4 GByte DDR4, 5.2 x 7.6 cm

AMD XCZU4EV-1SFVC784E 4 GB 4 GB 3.3 V 0 C + 85 C 76 mm x 52 mm
Digi 模块化系统 - SOM ConnectCore 93, i.MX 93 Dual A55, M33, NPU, 1GB LPDDR4, 8GB eMMC, -40/+85C

ConnectCore 93 - 40 C + 85 C 45 mm x 40 mm
Digi 模块化系统 - SOM ConnectCore MP133, STM32MP133, Single 650MHz, 256MB SLC NAND, 256MB DDR3, 2xGbE, 802.11a/b/g/n/ac 1x1, Bluetooth 5.2, -40/+85C

ConnectCore MP1 STMicroelectronics STM32MP133C 650 MHz - 40 C + 85 C 29 mm x 29 mm x 3 mm
Analog Devices 模块化系统 - SOM RF System on Module

ADRV9361 100 mm x 62 mm Xilinx XC7Z035-L2FBG676I 800 MHz, 6 GHz 1 GB 1 GB 4.5 V to 5.5 V Ethernet, SDIO, UART, USB 2.0 - 40 C + 85 C 100 mm x 62 mm Bulk
Analog Devices 模块化系统 - SOM RF System on Module

ADRV9364 100 mm x 62 mm Xilinx XC7Z020-1CLG400I 800 MHz, 6 GHz 1 GB 1 GB 4.5 V to 5.5 V Ethernet, SDIO, UART, USB 2.0 - 40 C + 85 C 100 mm x 62 mm Bulk
Trenz Electronic 模块化系统 - SOM Starter Kit with AMD Zynq UltraScale+ ZU9EG-1E MPSoC Module

AMD XCZU9EG-1FFVC900E 4 GB 4 GB 0 C + 85 C 76 mm x 52 mm
Octavo Systems 模块化系统 - SOM System-in-Package: AMD Zynq UltraScale+ MPSoC ZU3, 2GB LPDDR4, Power Management System, 32MB 3V3 NOR QSPI, Osciallator, Passives - 20.5mmX40mm 600 Ball BGA - 40C to 85C

OSDZU3 Standard BGA XCZU3EG1 2 GB 4.5 V to 5.5 V CAN, I2C, SPI, UART, USB - 40 C + 85 C 20.5 mm X 40 mm Tray

Trenz Electronic 模块化系统 - SOM MPSoC Module with AMD Zynq UltraScale+ ZU4EG-1E, 4 GByte DDR4, 5.2 x 7.6 cm

AMD XCZU4EG-1SFVC784E 4 GB 4 GB 3.3 V 0 C + 85 C 76 mm x 52 mm
Amphenol Aerospace 模块化系统 - SOM Rugged SOM, eMMC memory
High Speed 5 V to 60 V UART, USB - 40 C + 85 C 45 mm x 45 mm x 18 mm
Digi 模块化系统 - SOM i.MX6UL-2 1GB 802.11 & BLE 4.2

ConnectCore 6UL Digi SMTplus NXP i.MX 6UltraLite-2 528 MHz 1 GB 1 GB 5 V Bluetooth, Ethernet, FlexCAN, I2C, I2S/SAI, SDIO, S/PDIF, SPI, UART, USB 2.0 OTG, WiFi - 40 C + 85 C 29 mm x 29 mm x 3.5 mm
Toradex 模块化系统 - SOM 00581102VerdiniMX8MPlusQ4GBWBIT
Verdin iMX8M plus Verdin NXP i.MX 8M Plus Quad 1.6 GHz 4 GB 3.3 V, 5 V Analog, CAN, I2C, SPI, UART, USB - 40 C + 85 C 69.6 mm x 35 mm x 6 mm
Ezurio 模块化系统 - SOM Carbon AM62 OSM-MF: AM625 / 4 A53 / 2GB / 16GB eMMC / Without Wireless / -40 to +85 C / Cut Tape
Carbon AM62 - 40 C + 85 C Cut Tape
Ezurio 模块化系统 - SOM Carbon AM62 OSM-MF: AM625 / 4 A53 / 2GB / 16GB eMMC / Sona TI351 1MHF4L / -40 to +85 C / Cut Tape
Carbon AM62 - 40 C + 85 C Cut Tape
Toradex 模块化系统 - SOM 00701101VerdiniMX8MPlusQ8GBWBIT

Verdin iMX8M Plus NXP i.MX 8M Plus 800 MHz, 1.6 GHz 3.135 V to 5.5 V - 40 C + 85 C 69.6 mm x 35 mm x 6 mm
Ezurio 模块化系统 - SOM 60 Series SOM using 1 Gb LPDDR2 RAM and 2 Gb NAND flash

60 Series SOM Atmel ATSAMA5D36 536 MHz, 2.4 GHz, 5 GHz 1 GB 1 GB 1.8 V, 3.3 V Audio, Bluetooth, CAN, Ethernet, HDMI, I2C, MIPI-CSI, MIPI-DSI, SDIO, SPI, UART, USB 3.0, WiFi, Video - 30 C + 85 C 30 mm x 30 mm x 2.8 mm Tray
Ezurio 模块化系统 - SOM Nitrogen93 SMARC SOM: i.MX 93 Dual / 2GB / 16GB eMMC / NX611 / -40 to +85 C

Nitrogen93 SMARC SMARC 2.2 NXP ARM Cortex A55, ARM Cortex M33 2.4 GHz, 5 GHz, 6 GHz 5 V CAN, I2C, SPI, UART, USB - 40 C + 85 C 82 mm x 50 mm Tray