存储器模块和存储卡

内存模块和内存卡类型
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结果: 41
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描述 数据表 供货情况 单价（含13%增值税） 根据您的数量，按照单价筛选表格中的结果。
数量 RoHS
DFRobot 存储卡 SD/MicroSD Memory Card (32GB Class10 SDHC with Adapter) 2库存量
6预期 2026/2/26
最低： 1
倍数： 1

DFRobot 存储卡 MicroSD Memory Card 128GB Class10 10库存量
最低： 1
倍数： 1

DFRobot 存储卡 MicroSD Memory Card 64GB Class10 100MB/S 10库存量
最低： 1
倍数： 1

Swissbit 存储卡 Industrial Compact Flash Card, C-56, 4 GB, PSLC Flash, 0 C to +70 C
数据表
无库存交货期 8 周
最低： 1
倍数： 1
DFRobot 存储卡 Sd/MicroSD Memory Card 16GB 无库存
最低： 1
倍数： 1

ADLINK Technology DDR4 2666MHZ 260P 16GB SODIMM
ADLINK Technology 存储器模块 DDR4-2666, 16GB, 2Gx64, SO-DIMM 260P, 1.2V, Rank:2, CL19, Non-ECC, OP Temp:0-85, Fix Die:No, Chip(1Gx8) 无库存
最低： 1
倍数： 1
ADLINK Technology Innodisk DDR4 260P 3200MHz 16G
ADLINK Technology 存储器模块 DDR4-3200, 16GB, 2Gx64, SO-DIMM 260P, 1.2V, Rank:2, CL22, Non-ECC, OP Temp:-40-85, Fix Die:No, Chip(1Gx8) 无库存
最低： 1
倍数： 1
ADLINK Technology DDR4 2666 288P 16GB ECC U-DIMM
ADLINK Technology 存储器模块 DDR4-2666, 16GB, 2Gx72, U-DIMM 288P, 1.2V, Rank:2, CL19, ECC, OP Temp:0-85, Fix Die:Yes(C-die), Samsung Chip(1Gx8), anti-sulfur
ADLINK Technology DDR4 260P 3200MHz 16G 2GX8
ADLINK Technology 存储器模块 DDR4-3200, 16GB, 2Gx64, SO-DIMM 260P, 1.2V, Rank:1, CL22, Non-ECC, OP Temp:-40-85, Fix Die:No(A-die), Samsung Chip(2Gx8), hight:30mm
ADLINK Technology DDR4 2666 260P 32GB ECC
ADLINK Technology 存储器模块 DDR4-2666, 32GB, 4Gx72, SO-DIMM 260P, 1.2V, Rank:2, CL19, ECC, OP Temp:0-85, Fix Die:No, Samsung Chip(2Gx8)
ADLINK Technology INNODISK DDR4 260P 3200MHZ 4G
ADLINK Technology 存储器模块 DDR4-3200, 4GB, 512Mx64, SO-DIMM 260P, 1.2V, Rank:1, CL22, Non-ECC, OP Temp:-40 85, Fix Die:No, Chip(512Mx8)
ADLINK Technology DDR4 2666 260P 8GB ECC SO-DIMM
ADLINK Technology 存储器模块 DDR4-2666, 8GB, 1Gx72, SO-DIMM 260P, 1.2V, Rank:1, CL19, ECC, OP Temp:0-85, Fix Die:No(C-die), Samsung Chip(1Gx8), anti-sulfur
ADLINK Technology DDR4 2666 288P 8GB U-DIMM
ADLINK Technology 存储器模块 DDR4-2666, 8GB, 1Gx64, U-DIMM 288P, 1.2V, Rank:1, CL19, Non-ECC, OP Temp:0-85, Fix Die:No(C-die), Samsung Chip(1Gx8)
ADLINK Technology Transcend DDR4 260P 3200MHz 16G
ADLINK Technology 存储器模块 DDR4-3200, 16GB, 2Gx64, SO-DIMM 260P, 1.2V, Rank:2, CL22, Non-ECC, OP Temp:-40-85, Fix Die:No(C-die), Samsung Chip(1Gx8), anti-sulfur
ADLINK Technology DDR4 2666 260P 8GB ECC SO-DIMM INDUS
ADLINK Technology 存储器模块 DDR4-2666, 8GB, 1Gx72, SO-DIMM 260P, 1.2V, Rank:1, CL19, ECC, OP Temp:-40-85, Fix Die:No(C-die), Samsung Chip(1Gx8), anti-sulfur
ADLINK Technology DDR4 2666MHZ 8GB RDIMM
ADLINK Technology 存储器模块 DDR4-2666, 8GB, 512Mx8, RDIMM 288P, 1.2V, Rank:2, CL19, ECC, OP Temp:0 85, Fix Die:No, Chip(512Mx8), M4R0-8GSSBCIK
ADLINK Technology DDR4 2666MHZ 260P 8GB SODIMM
ADLINK Technology 存储器模块 DDR4-2666, 8GB, 1Gx64, SO-DIMM 260P, 1.2V, Rank:2, CL19, Non-ECC, OP Temp:0 85, Fix Die:No, Chip(512Mx8)
ADLINK Technology DDR4 PC4-2666 260P 32GB SODIMM
ADLINK Technology 存储器模块 DDR4-2666, 32GB, 4Gx64, SO-DIMM 260P, 1.2V, Rank:2, CL19, Non-ECC, OP Temp:-40-85, Fix Die:No, Samsung Chip(2Gx8)
ADLINK Technology 32GB DDR4 2666 ECC SODIMM
ADLINK Technology 存储器模块 DDR4-2666, 32GB, 4Gx72, SO-DIMM 260P, 1.2V, Rank:2, CL19, ECC, OP Temp:0-85, Fix Die:No, Chip(2Gx8)
ADLINK Technology DDR4 2666 288P 8GB ECC U-DIMM
ADLINK Technology 存储器模块 DDR4-2666, 8GB, 1Gx72, U-DIMM 288P, 1.2V, Rank:1, CL19, ECC, OP Temp:0-85, Fix Die:No(C-die), Samsung Chip(1Gx8)
ADLINK Technology DDR4 2666 260P 16GB non-ECC SO-DIMM
ADLINK Technology 存储器模块 DDR4-2666, 16GB, 2Gx64, SO-DIMM 260P, 1.2V, Rank:2, CL19, Non-ECC, OP Temp:0-85, Fix Die:No(C-die), Samsung Chip(1Gx8)
ADLINK Technology DDR4 2666 260P 2GB non-ECC SO-DIMM
ADLINK Technology 存储器模块 DDR4-2666, 2GB, 256Mx64, SO-DIMM 260P, 1.2V, Rank:1, CL19, Non-ECC, OP Temp:0-85, Fix Die:No(F-die), Samsung Chip(256Mx16)
ADLINK Technology DDR4 2666 260P 16GB ECC SO-DIMM INDUS
ADLINK Technology 存储器模块 DDR4-2666, 16GB, 2Gx72, SO-DIMM 260P, 1.2V, Rank:2, CL19, ECC, OP Temp:-40-85, Fix Die:No(C-die), Samsung Chip(1Gx8), anti-sulfur
ADLINK Technology DDR4 2666 288P 8GB U-DIMM non-ECC
ADLINK Technology 存储器模块 DDR4-2666, 8GB, 1Gx64, U-DIMM 288P, 1.2V, Rank:2, CL19, Non-ECC, OP Temp:0-85, Fix Die:No(F-die), Samsung Chip(512Mx8)
ADLINK Technology DDR4 2666 288P 4GB ECC U-DIMM
ADLINK Technology 存储器模块 DDR4-2666, 4GB, 512Mx72, U-DIMM 288P, 1.2V, Rank:1, CL19, ECC, OP Temp:0-85, Fix Die:Yes(F-die), Samsung Chip(512Mx8), anti-sulfur