RISC-V 核心 多协议模块

结果: 20
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数量 RoHS ECAD模型 系列
频率
输出功率
接口类型
电源电压-最小
电源电压-最大
最小工作温度
最大工作温度
天线连接器类型
尺寸
协议 - 蓝牙、BLE - 802.15.1
协议 - WiFi - 802.11
协议 - ANT、Thread、Zigbee - 802.15.4
封装
Telink 多协议模块 Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
数据表
6库存量
最低： 1
倍数： 1

ML3 2.4 GHz to 2.483 GHz 8.4 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 125 C 26 mm x 11.3 mm x 2.6 mm Zigbee Reel
Telink 多协议模块 Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
数据表
6库存量
最低： 1
倍数： 1

ML7 2.4 GHz to 2.483 GHz 8.5 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 85 C 26 mm x 11.3 mm x 2.6 mm Reel
Espressif Systems 多协议模块 "ESP32-C5-WROOM-1 and ESP32-C5-WROOM-1U are two general-purpose 2.4 and 5 GHz dual-band Wi-Fi 6 (802.11ax), Bluetooth 5 (LE), Zigbee, and Thread (802.15.4) modules. The rich set of peripherals and high performance make the module an ideal choice for 1,819库存量
最低： 1
倍数： 1

240 MHz 20 dBm I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 27.5 mm x 18 mm x 3.3 mm
Espressif Systems 多协议模块 "ESP32-C5-WROOM-1 and ESP32-C5-WROOM-1U are two general-purpose 2.4 and 5 GHz dual-band Wi-Fi 6 (802.11ax), Bluetooth 5 (LE), Zigbee, and Thread (802.15.4) modules. The rich set of peripherals and high performance make the module an ideal choice for 723库存量
1,950预期 2026/3/23
最低： 1
倍数： 1

240 MHz 20 dBm I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 27.5 mm x 18 mm x 3.3 mm
Espressif Systems 多协议模块 SMD Module, ESP32-H2FH2S, Chip revision v1.2 and above, 2 MB SPI flash, PCB antenna, -40 C +105 C Required ESP-IDF version: v5.1.6 and v5.2.5, v5.3.3 (expected on 3/27), v5.4.1 (expected on 4/4), and above
数据表
3,055库存量
最低： 1
倍数： 1

2.402 GHz to 2.48 GHz 20 dBm SPI 3 V 3.6 V - 40 C + 105 C 16.6 mm x 13.2 mm x 2.4 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee)
Espressif Systems 多协议模块 SMD Module, ESP32-H2FH4S, Chip revision v1.2 and above, 4 MB SPI flash, PCB antenna, -40 C +105 C. Required ESP-IDF version: v5.1.6 and v5.2.5, v5.3.3 (expected on 3/27), v5.4.1 (expected on 4/4), and above
数据表
1,981库存量
最低： 1
倍数： 1

2.402 GHz to 2.48 GHz 20 dBm SPI 3 V 3.6 V - 40 C + 105 C 16.6 mm x 13.2 mm x 2.4 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee)
Espressif Systems 多协议模块 "ESP32-C5-WROOM-1 and ESP32-C5-WROOM-1U are two general-purpose 2.4 and 5 GHz dual-band Wi-Fi 6 (802.11ax), Bluetooth 5 (LE), Zigbee, and Thread (802.15.4) modules. The rich set of peripherals and high performance make the module an ideal choice for 4,261库存量
最低： 1
倍数： 1

240 MHz 20 dBm I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 27.5 mm x 18 mm x 3.3 mm
u-blox 多协议模块 ESP32-C6, 802.11ax+BLE, ant pin, open CPU, 4MB flash
数据表
500库存量
最低： 1
倍数： 1
卷轴: 500

2.4 GHz to 2.484 GHz GPIO, I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
u-blox 多协议模块 ESP32-C6, 802.11ax+BLE, ant pin, open CPU, 8MB flash
数据表
500库存量
最低： 1
倍数： 1
卷轴: 500

2.4 GHz to 2.484 GHz GPIO, I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
u-blox 多协议模块 ESP32-C6, 802.11ax+BLE, PCB ant, open CPU, 4MB flash
数据表
493库存量
最低： 1
倍数： 1
卷轴: 500

2.4 GHz to 2.484 GHz GPIO, I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
u-blox 多协议模块 ESP32-C6, 802.11ax+BLE, PCB ant, open CPU, 8MB flash
数据表
490库存量
最低： 1
倍数： 1
卷轴: 500

2.4 GHz to 2.484 GHz GPIO, I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
Seeed Studio 多协议模块 XIAO ESP32S3 - 2.4GHz WiFi, BLE 5.0, Dual-Core, Battery Charge,Smart Homes, IoT, Wearable Devices, Robotics
数据表
1,422库存量
最低： 1
倍数： 1

2.4 GHz I2C, SPI, UART - 40 C + 85 C 21 mm x 17.5 mm 802.11 b/g/n
SparkFun 多协议模块 ESP32-C6 WROOM Module - 16MB (PCB Antenna)
数据表
5库存量
30预期 2026/2/9
最低： 1
倍数： 1
2.4 GHz GPIO, I2C, I2S, Parallel, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 19.2 mm x 18 mm x 3.2 mm Bluetooth 5.3, Bluetooth Mesh 802.11 b/g/n/ax Thread, Zigbee
SparkFun 多协议模块 ESP32-C6 MINI Module - 4MB (PCB Antenna)
数据表
8库存量
最低： 1
倍数： 1
2.4 GHz GPIO, I2C, I2S, Parallel, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 19.2 mm x 18 mm x 3.2 mm Bluetooth 5.3, Bluetooth Mesh 802.11 b/g/n/ax Thread, Zigbee
Seeed Studio 多协议模块 Seeed Studio XIAO ESP32C3
更多信息可用

2.4 GHz I2C, SPI, UART - 40 C + 85 C 21 mm x 17.5 mm 802.11 b/g/n
Telink 多协议模块 Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
数据表

ML7 2.4 GHz to 2.483 GHz 8.5 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 85 C 35.29 mm x 18 mm x 2.6 mm Reel
GigaDevice 多协议模块 RISC-V with BLE 5.2 and WiFi 6 certified module / 24 x 16 / 18 GPIO / -40-105 degC / external IPEX connection
数据表

RISC-V 2.412 GHz to 2.484 GHz 23.2 dBm UART 3 V 3.6 V - 40 C + 105 C 24 mm x 16 mm x 2.2 mm BLE WiFi
GigaDevice 多协议模块 RISC-V with BLE 5.2 and WiFi 6 certified module / 24 x 16 / 18 GPIO / -40-105 degC / onboard PCB antenna
数据表

RISC-V 2.412 GHz to 2.484 GHz 23.2 dBm UART 3 V 3.6 V - 40 C + 105 C 24 mm x 16 mm x 2.2 mm BLE WiFi
Quectel 多协议模块 Wi-Fi 6, 2.4GHz, BLE5.2, RISC-V, ACK SDK for Matter, 4MB Flash, 512 KB SRAM, PCB antenna, -40C to 105C
数据表
2.4 GHz UART 3 V 3.6 V - 40 C + 105 C 17.3 mm x 15 mm x 2.8 mm BLE 5.2 802.11 b/g/n/ax Reel
Quectel 多协议模块
2.4 GHz UART 3 V 3.6 V - 40 C + 105 C 17.3 mm x 15 mm x 2.8 mm BLE 5.2 802.11 b/g/n/ax