BL54H20 Series Multi-Core BLE Modules

Ezurio BL54H20 Series Multi-Core BLE Modules integrate BLUETOOTH® LE 5.4, 802.15.4 protocols (Thread, Matter), and NFC, delivering high-performance wireless connectivity. These modules are powered by the Nordic nRF54H20 System on Chip (SoC). This SoC features dual Arm® Cortex®-M33 processors, RISC-V co-processors, 2MB flash, and 1MB RAM. The BL54H20 BLE modules incorporate a compact form factor (13.5mm x 10mm x 1.8mm), robust security (PSA Certified Level 3), and an industrial operating range of -40°C to 105°C. The BL54H20 Series multi-core BLE modules support secure boot, secure firmware update, secure storage, and integrated tamper sensors for physical security. These modules facilitate advanced use cases like asset tracking, secure medical peripherals, industrial automation, IoT, and smart devices. 

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数量 RoHS ECAD模型 系列
接口类型
电源电压-最小
电源电压-最大
最小工作温度
最大工作温度
天线连接器类型
尺寸
协议 - 蓝牙、BLE - 802.15.1
协议 - WiFi - 802.11
封装
Ezurio 多协议模块 Module, BL54H20, Bluetooth LE, Chip Antenna, Tape and Reel (Nordic Cortex-M33 RISC-V, nRF54H20)
数据表
985预期 2026/7/21
最低： 1
倍数： 1
卷轴: 1,000

BL54H20 UART 1.71 V 1.98 V - 40 C + 105 C Chip 13.5 mm x 10 mm x 1.8 mm Bluetooth 5.4 802.15.4 Reel, Cut Tape
Ezurio 多协议模块 Module, BL54H20, Bluetooth LE, MHF4, Tape and Reel (Nordic Cortex-M33 RISC-V, nRF54H20)
数据表
986预期 2026/7/21
最低： 1
倍数： 1
卷轴: 1,000

BL54H20 UART 1.71 V 1.98 V - 40 C + 105 C MHF4 13.5 mm x 10 mm x 1.8 mm Bluetooth 5.4 802.15.4 Reel, Cut Tape
Ezurio 多协议模块 Module, BL54H20, Bluetooth LE, Chip Antenna, Cut Tape (Nordic Cortex-M33 RISC-V, nRF54H20)
数据表
BL54H20 UART 1.71 V 1.98 V - 40 C + 105 C Chip 13.5 mm x 10 mm x 1.8 mm Bluetooth 5.4 802.15.4 Cut Tape
Ezurio 多协议模块 Module, BL54H20, Bluetooth LE, MHF4, Cut Tape (Nordic Cortex-M33 RISC-V, nRF54H20)
数据表
BL54H20 UART 1.71 V 1.98 V - 40 C + 105 C MHF4 13.5 mm x 10 mm x 1.8 mm Bluetooth 5.4 802.15.4 Cut Tape