UARTS 多协议模块

结果: 320
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描述 数据表 供货情况 单价（含13%增值税） 根据您的数量，按照单价筛选表格中的结果。
数量 RoHS ECAD模型 系列
频率
输出功率
接口类型
电源电压-最小
电源电压-最大
最小工作温度
最大工作温度
天线连接器类型
尺寸
协议 - 蓝牙、BLE - 802.15.1
协议 - 蜂窝、Nbiot、LTE
协议 - GPS、GLONASS
协议 - Sub GHz
协议 - WiFi - 802.11
协议 - ANT、Thread、Zigbee - 802.15.4
封装
Quectel 多协议模块
数据表
无库存
最低： 250
倍数： 250

2.4 GHz, 5 GHz 17.5 dBm Bluetooth, SDIO, UART, WiFi 3.3 V 3.3 V - 40 C + 85 C 16.6 mm x 13 mm x 2.1 Bluetooth 802.11 a/b/g/n/ac
Quectel 多协议模块
数据表
无库存
最低： 1
倍数： 1

850 MHz, 900 MHz, 1.575 GHz, 1.601 GHz, 1.8 GHz, 1.9 GHz, 2.4 GHz 2 W GPIO, PCM, UART, USIM, WiFi 3.3 V 4.6 V - 40 C + 85 C Pad 25.6 mm x 15 mm x 2.3 mm GSM/GPRS GNSS 802.11 b/g/n
Quectel 多协议模块 GSM/GPRS/GNSS, Quad-band, Supports BT3.0 only, Ultra-small, LCC form factor
数据表
无库存交货期 12 周
最低： 250
倍数： 250
: 250

MC60 1.561 GHz, 1.575 GHz, 1.602 GHz 2 W Audio, Bluetooth, PCM, SD Card, UART 3.3 V 4.6 V - 35 C + 75 C 18.7 mm x 16 mm x 2.1 mm Bluetooth 3.0 GSM/GPRS GNSS Reel
Quectel 多协议模块
数据表
无库存
最低： 1
倍数： 1

850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 2 W ADC, Audio, Bluetooth PCM, UART 3.3 V 4.6 V - 40 C + 85 C Pad 17.7 mm x 15.8 mm x 2.3 mm Bluetooth 3.0 GSM/GPRS Reel
Quectel 多协议模块
数据表
无库存
最低： 1
倍数： 1

850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 2 W ADC, Audio, Bluetooth PCM, UART 3.3 V 4.6 V - 40 C + 85 C Pad 17.7 mm x 15.8 mm x 2.3 mm Bluetooth 3.0 GSM/GPRS
Advantech 多协议模块 Advantech Wi-Fi 7+BT5.3, Qualcomm WCN7851, 2T2R, M.2 2230 E key (Wi-Fi: PCIe/BT:USB)
数据表
更多信息可用

AIW-173BQ 6 GHz UART, USB 3 V 3.3 V - 40 C + 85 C MHF4 BLE 5.3 802.11 b/g/n/ac/ax/be, WiFi 7
Ezurio 多协议模块 Module, Sona TI351, 1216, MHF4L, Tape and Reel
数据表

Sona TI351 2.4 GHz, 5 GHz SDIO, UART 1.62 V 3.6 V - 40 C + 85 C 16 mm x 12 mm x 0.43 mm Bluetooth 5.4, Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax Reel, Cut Tape
Ezurio 多协议模块 Module, Sona NX611, 2 x RF Trace, MIMO, SIP, Cut Tape
数据表

Sona NX611 2.4 GHz, 5 GHz UART 1.8 V 3.3 V - 40 C + 85 C MHF4 Bluetooth 5.4, Bluetooth LE WiFi 6 Cut Tape
Ezurio 多协议模块 Module, Sona NX611, 1 x RF Trace, MIMO, SIP, Cut Tape
数据表

Sona NX611 2.4 GHz, 5 GHz UART 1.8 V 3.3 V - 40 C + 85 C MHF4 Bluetooth 5.4, Bluetooth LE WiFi 6 Cut Tape
GigaDevice 多协议模块 RISC-V with BLE 5.2 and WiFi 6 certified module / 15 x 12.4 / 21 GPIO / -40-105 degC / onboard PCB antenna
数据表
更多信息可用

RISC-V 2.412 GHz to 2.484 GHz 23.4 dBm UART 3 V 3.6 V - 40 C + 105 C 15 mm x 12.4 mm x 2.4 mm BLE WiFi
GigaDevice 多协议模块 RISC-V with BLE 5.2 and WiFi 6 certified module / 24 x 16 / 18 GPIO / -40-105 degC / onboard PCB antenna
数据表
更多信息可用

RISC-V 2.412 GHz to 2.484 GHz 23.2 dBm UART 3 V 3.6 V - 40 C + 105 C 24 mm x 16 mm x 2.2 mm BLE WiFi
GigaDevice 多协议模块 RISC-V with BLE 5.2 and WiFi 6 certified module / 24 x 16 / 18 GPIO / -40-105 degC / external IPEX connection
数据表
更多信息可用

RISC-V 2.412 GHz to 2.484 GHz 23.2 dBm UART 3 V 3.6 V - 40 C + 105 C 24 mm x 16 mm x 2.2 mm BLE WiFi
GigaDevice 多协议模块 RISC-V with BLE 5.2 and WiFi 6 certified module / 9.5 x 12.4 / 21 GPIO / -40-85 degC / external IPEX connection
数据表
更多信息可用

RISC-V 2.412 GHz to 2.484 GHz 23.4 dBm UART 3 V 3.6 V - 40 C + 85 C 12.4 mm x 9.6 mm x 2.4 mm BLE WiFi
GigaDevice 多协议模块 RISC-V with BLE 5.2 and WiFi 6 certified module / 15 x 12.4 / 21 GPIO / -40-85 degC / onboard PCB antenna
数据表
更多信息可用

RISC-V 2.412 GHz to 2.484 GHz 23.4 dBm UART 3 V 3.6 V - 40 C + 85 C 15 mm x 12.4 mm x 2.4 mm BLE WiFi
NXP Semiconductors 多协议模块 IW610CHN/A1ZDI
数据表
更多信息可用

IW610CHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Tray
NXP Semiconductors 多协议模块 IW610GUK/A1ZDI
数据表
更多信息可用

IW610GUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Reel, Cut Tape
NXP Semiconductors 多协议模块 IW610BUK/A1ZDI
数据表
更多信息可用

IW610BUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Reel, Cut Tape
NXP Semiconductors 多协议模块 IW610CUK/A1ZDI
数据表
更多信息可用

IW610CUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Reel, Cut Tape
NXP Semiconductors 多协议模块 IW610FHN/A1ZDI
数据表
更多信息可用

IW610FHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Reel, Cut Tape
NXP Semiconductors 多协议模块 IW610BHN/A1ZDI
数据表
更多信息可用

IW610BHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Tray
NXP Semiconductors 多协议模块 IW610FUK/A1ZDI
数据表
更多信息可用

IW610FUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Reel, Cut Tape
Quectel 多协议模块 cloud enabled, Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: PCB, 2MB flash
更多信息可用
2.4 GHz UART 3 V 3.6 V - 40 C + 85 C PCB 20 mm x 18 mm x 2.6 mm BLE 5.2 802.11 b/g/n Reel, Cut Tape
Quectel 多协议模块 NXP platform, SDIO Interface
数据表
更多信息可用
2.4 GHz, 5 GHz SPI, UART, USB 3.14 V 3.46 V - 40 C + 85 C 12 mm x 12 mm x 2 mm BLE 5.4 802.11 a/b/g/n/ac/ax Reel, Cut Tape
Quectel 多协议模块 Wi-Fi 6 (2.4GHz/5GHz), IEEE 802.11a/b/g/n/ac/ax, BLE 5.4, Thread 802.15.4, Antenna 1 1 (1T1R), 2 antennas, Wi-Fi application: SDIO 3.0, -40C +85C
数据表
更多信息可用
2.4 GHz, 5 GHz SPI, UART, USB 3.14 V 3.46 V - 40 C + 85 C PCB Antenna 23 mm x 14 mm x 2.2 mm BLE 5.4 802.11 a/b/g/n/ac/ax Reel, Cut Tape
u-blox 多协议模块 M.2 card with MAYA-W271, in tray

2.4 GHz, 5 GHz GPIO, SPI, UART u.FL 22 mm x 30 mm x 2.8 mm 802.11 a/b/g/n/ac/ax Tray