ANTENNAS 多协议模块

结果: 427
选择 图像 零件编号
 制造商
描述 数据表 供货情况 单价（含13%增值税） 根据您的数量，按照单价筛选表格中的结果。
数量 RoHS ECAD模型 系列
频率
输出功率
接口类型
电源电压-最小
电源电压-最大
最小工作温度
最大工作温度
天线连接器类型
尺寸
协议 - 蓝牙、BLE - 802.15.1
协议 - 蜂窝、Nbiot、LTE
协议 - GPS、GLONASS
协议 - Sub GHz
协议 - WiFi - 802.11
协议 - ANT、Thread、Zigbee - 802.15.4
封装
Quectel 多协议模块 Wi-Fi 6 (dual band 2.4/5GHz) & Bluetooth 5.4 (Bluetooth LE Audio and BLE Long Range), SDI 3.0 interface, 1x antenna, -40 C to +85 C
数据表
更多信息可用
Reel, Cut Tape
Quectel 多协议模块 Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM, 8MB Flash, Antenna: PCB, -40 85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm
数据表
更多信息可用
2.4 GHz, 5 GHz GPIO, I2C, JTAG, SPI, UART, USB 3.14 V 3.46 V - 40 C + 85 C PCB Antenna 25.5 mm x 18 mm x 3.16 mm Reel, Cut Tape
Quectel 多协议模块 Wi-Fi 6 & Bluetooth 5.2, dual band 2.4/5GHz, 1x antenna, -20 C to +70 C, compact LCC package, USB 2.0 interface only, antenna pin interface
数据表
更多信息可用
Reel, Cut Tape
Quectel 多协议模块 Wi-Fi 4 & Bluetooth 5.2, dual band 2.4/5GHz, 1x antenna, -20 C to +70 C, ultra-compact LCC package, USB 2.0 interface only, antenna pin interface
数据表
更多信息可用

Reel, Cut Tape
Ezurio 多协议模块 Module, BL54L15, Bluetooth LE, Chip Antenna, Tape and Reel
数据表
BL54L15u 8 dBm I2S, SPI, UART 1.7 V 3.6 V - 40 C + 105 C 7.9 mm x 6.3 mm x 1.75 mm Bluetooth LE 802.15.4 Reel, Cut Tape
u-blox 多协议模块 ESP32, 802.11bgn+BT, PCB antenna, u-connectXpress

Reel
Ezurio 多协议模块 Module, BL54H20, Bluetooth LE, Chip Antenna, Cut Tape
数据表
BL54H20 UART 1.71 V 1.98 V - 40 C + 105 C Chip 13.5 mm x 10 mm x 1.8 mm Bluetooth 5.4 802.15.4 Cut Tape
Ezurio 多协议模块 Module, Vela IF310, Integrated Antenna, Tape and Reel
数据表
Vela IF310 2.402 GHz to 2.48 GHz 10 dBm UART 3 V 4.8 V - 40 C + 85 C 16 mm x 12 mm x 2 mm Bluetooth Reel
Ezurio 多协议模块 Module, Sona NX611, 1218 Chip Antenna, Tape and Reel
数据表
Sona NX611 Bluetooth 5.4, Bluetooth LE WiFi 6 Reel
Microchip Technology 多协议模块 Wi-Fi + Bluetooth LE Module,u.FL Antenna
数据表

2.412 GHz to 2.484 GHz 18.3 dBm SPI 2.7 V 3.6 V - 40 C + 85 C 22.4 mm x 14.7 mm x 2 mm Bluetooth Reel
Microchip Technology 多协议模块 Wi-Fi + Bluetooth LE Module, Chip Antenna
数据表

2.412 GHz to 2.484 GHz 18.3 dBm SPI 2.7 V 3.6 V - 40 C + 85 C 22.4 mm x 14.7 mm x 2 mm Bluetooth Tray
Microchip Technology 多协议模块 Wi-Fi + Bluetooth LE Module,u.FL Antenna
数据表

2.412 GHz to 2.484 GHz 18.3 dBm SPI 2.7 V 3.6 V - 40 C + 85 C 22.4 mm x 14.7 mm x 2 mm Bluetooth Tray
Microchip Technology 多协议模块 Wi-Fi + Bluetooth LE Module, Chip Antenna
数据表

2.412 GHz to 2.484 GHz 18.3 dBm SPI 2.7 V 3.6 V - 40 C + 85 C 22.4 mm x 14.7 mm x 2 mm Bluetooth Reel
u-blox 多协议模块 Secure industrial Wi-Fi and Bluetooth u-connectXpress software and internal antenna
数据表
NINA-W15 2.4 GHz to 2.4835 GHz 8 dBm, 18 dBm SPI, UART 3 V 3.6 V - 40 C + 85 C PCB Antenna 14 mm x 10 mm x 2.2 mm Reel, Cut Tape
Ezurio 多协议模块 Module, Veda SL917, 4MB Flash, NCP, Integrated Antenna, Cut Tape
数据表
Veda SL917 2.4 GHz I2C, SPI, UART 1.8 V 3.3 V - 40 C + 85 C Chip 21.1 mm x 16 mm x 2.3 mm Bluetooth 5.4, Bluetooth LE WiFi 6, 802.11 b/g/n/ax Reel
Ezurio 多协议模块 Module, Veda SL917, 8MB Flash, SoC, Integrated Antenna, Cut Tape
数据表
Veda SL917 2.4 GHz I2C, SPI, UART 1.8 V 3.3 V - 40 C + 85 C Chip 21.1 mm x 16 mm x 2.3 mm Bluetooth 5.4, Bluetooth LE WiFi 6, 802.11 b/g/n/ax Reel
u-blox JODY-W683-00B
u-blox 多协议模块 AW693, 802.11ax 2x2+BT/LE 5.3, 3 antenna pins

Reel
IEI 多协议模块 Radio Frequency Module,WIFI+Bluetooth Module,AP6275SDSR,2T2R,802.11 a/b/g/n/ac/ax Wi-Fi + BT 5.3; with external WIFI 6E antenna, FCC ID,RoHS
数据表

Fanstel 多协议模块 nRF5340 BLE 5.4 and nRF7002 WiFi 6 combo modules, 2 chip antennas
数据表

2.4 GHz, 5 GHz 3 dBm, 19 dBm GPIO, I2C, QSPI, SPI, SWD, UART, USB 2.0 3.3 V 3.3 V - 40 C + 85 C Chip 24.5 mm x 15.5 mm BLE 802.11 a/b/g/n/ac/ax 802.15.4 Reel
Ezurio 多协议模块 Module, BL54L15, Bluetooth LE, Trace Pin, Tape and Reel
数据表
BL54L15u 8 dBm I2S, SPI, UART 1.7 V 3.6 V - 40 C + 105 C 7.9 mm x 6.3 mm x 1.75 mm Bluetooth LE 802.15.4 Reel, Cut Tape
Ezurio BL652-SC
Ezurio 多协议模块 Bluetooth v4.2 Module with NFC (External Antenna) (Nordic nRF52832)
数据表

BL652 Bluetooth LE NFC
ADLINK Technology MVP AC9620 WIFI BT KIT
ADLINK Technology 多协议模块 Intel Wireless-AC 9260, cables, and antennas for the MVP-5200 and MVP-6200
2.4 GHz, 5 GHz PCIe, USB 0 C + 80 C Bluetooth 5.1 802.11 ac
IEI 7F200-iWBBCM43752R10-RS
IEI 多协议模块 Radio Frequency Card,WIFI+BlueTooth MODULE,AP6275S,2T2R,802.11 a/b/g/n/ac/ax,BT 5.0+Wifi6E Antenna

Telink 多协议模块 The ML9118A module is designed based on Telink WiFi 6 multiprotocol SoC, the TLSR9118. It features WiFi 6 + Bluetooth 5.4, tailored for lowpower IoT applications.
数据表

ML9118 I2C, SPI, QSPI, UART 3 V 3.6 V - 40 C + 105 C 18 mm x 25.5 mm x 3.1 mm BLE 802.11 b/g/n ANT, Thread, Zigbee
Silicon Labs 多协议模块 SiWG917Y SoC Module Wi-Fi 6 2.4 GHz Bluetooth LE 5.4 No Antenna, 4MB Flash in IC package
数据表

SIWG917Y I2C, SPI, UART, USART 1.71 V 3.63 V - 40 C + 85 C Reel