WORKPRO 多协议模块

结果: 47
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描述 数据表 供货情况 单价（含13%增值税） 根据您的数量，按照单价筛选表格中的结果。
数量 RoHS ECAD模型 系列
频率
输出功率
接口类型
电源电压-最小
电源电压-最大
最小工作温度
最大工作温度
天线连接器类型
尺寸
协议 - 蓝牙、BLE - 802.15.1
协议 - 蜂窝、Nbiot、LTE
协议 - GPS、GLONASS
协议 - Sub GHz
协议 - WiFi - 802.11
协议 - ANT、Thread、Zigbee - 802.15.4
封装
Silex Technology 多协议模块 2x2 Dual Band 802.11 ac WLAN+BT PCIe
数据表
无库存交货期 30 周
最低： 100
倍数： 100

SX-PCEAC2 2.4 GHz, 5 GHz Serial 3.3 V 3.3 V 0 C + 70 C 30 mm x 26.8 mm x 3.4 mm Bluetooth 5.0 PCIe 802.11 a/b/g/n/ac Tray
Silex Technology 多协议模块 2x2 Dual Band 802.11 ac WLAN+BT SMT
数据表
无库存交货期 30 周
最低： 1,500
倍数： 1,500
: 1,500

SX-PCEAC2 2.4 GHz, 5 GHz Serial 3.3 V 3.3 V 0 C + 70 C 12 mm x 16 mm x 1.5 mm Bluetooth 5.0 802.11 a/b/g/n/ac Reel
Silex Technology 多协议模块 2.4 GHz/5 GHz dual-band Wi-Fi 6 plus BLE v5.3 BR/EDR/LE SDIO 3.0 module Sample
数据表
无库存交货期 26 周
最低： 1
倍数： 1

SX-SDMAX 2.4 GHz, 5 GHz UART 1.8 V 3.3 V - 40 C + 85 C MHF 17 mm x 18 mm x 2.65 mm Bluetooth 5.3 802.11 a/b/g/n/ac/ax Cut Tape
Quectel 多协议模块 12+256GB, Wi-Fi 7, no cellular, with Ethernet(EAU >2000pcs) (Do not promote)
数据表
无库存交货期 16 周
最低： 560
倍数： 80
: 80

Reel
Quectel 多协议模块 longevity extended till 2028, not recommended for new designs. please promote SC200E series. (EAU >2000pcs)
数据表
无库存交货期 16 周
最低： 600
倍数： 200
: 200

Reel
Quectel 多协议模块 longevity extended till 2028, not recommended for new designs. please promote SC200E series. (EAU >2000pcs)
数据表
无库存交货期 16 周
最低： 600
倍数： 200
: 200

Reel
Quectel 多协议模块 longevity extended till 2028, not recommended for new designs. please promote SC200E series. (EAU >2000pcs)
数据表
无库存交货期 16 周
最低： 600
倍数： 200
: 200

Reel
ADLINK Technology INTEL AC9260 Non-VPRO WIFI/BT KIT
ADLINK Technology 多协议模块 INTEL AC9260 Non-VPRO WIFI/BT KIT2x2 WiFi 802.11a/b/g/n/acBluetooth5.0M.2 2230 with PCIe/USB I/FOperating Temperature: 0-80C Driver for WIN10, Linux2pcs x IPEX MHF4 cables2pcs x Antenna
2.4 GHz, 5 GHz PCIe, USB 0 C + 80 C 30 mm x 22 mm x 2.4 mm Bluetooth 5.1 802.11 a/b/g/n/ac
Arduino 多协议模块 Portenta Proto Kit ME ABX00042; ASX00055; TPX00200; ABX00050
数据表

Portenta CAN, Ethernet, I2C, SPI, USB 7 VDC 30 VDC - 40 C + 85 C Bluetooth 5.0 LTE Cat.4, 4G GNSS Bulk
Arduino 多协议模块 Portenta Proto Kit VE ABX00042; ASX00055; TPX00200; ABX00051; ABX00089

Portenta CAN, Ethernet, I2C, SPI, USB 7 VDC 30 VDC - 40 C + 85 C LTE Cat.4, 4G GNSS Bulk
Telink 多协议模块 Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
数据表

ML7 2.4 GHz to 2.483 GHz 8.5 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 85 C 35.29 mm x 18 mm x 2.6 mm Reel
Texas Instruments 多协议模块 SimpleLink Wi-Fi 6 c ompanion module
数据表
否
CC3300MOD 2.412 GHz to 2.472 GHz 18.4 dBm SPI, UART 1.62 V, 2.97 V 1.98 V, 3.63 V - 40 C + 85 C 11 mm x 11 mm Bluetooth Wi-Fi 6, 802.11ax Reel, Cut Tape, MouseReel
Texas Instruments 多协议模块 SimpleLink dual-band (2.4GHz and 5GHz) W
数据表
否
CC3351MOD 2.41 GHz to 2.47 GHz 18.3 dBm SPI - 40 C + 85 C 10.9 mm x 10.9 mm x 2.1 mm Bluetooth WiFi Reel, Cut Tape, MouseReel
Quectel 多协议模块 Wi-Fi /BT variant.2+16GB - Consumer temperature range. Do Not promote
数据表
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.5 V 3.5 V - 10 C + 75 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac Reel
Quectel 多协议模块 No connectivity, Consumer temperature range EAU >2000pcs (Do not promote)
Reel
Quectel 多协议模块 Wi-Fi /BT variant. 8+64GB - Consumer temperature range Do Not promote
数据表
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.5 V 3.5 V - 10 C + 75 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac Reel
Quectel 多协议模块 Do not promote
数据表
2.4 GHz, 5 GHz, 6 GHz ADC, GPIO, I2C, I2S, MIPI-CSI, MIPI-DSI, PCIe, PWM, SPI, UART, USB 2.0, USB 3.1 3.55 V 4.4 V - 35 C + 75 C 56.5 mm x 42.5 mm x 2.95 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax Reel
Quectel 多协议模块 Do not promote
数据表
2.4 GHz, 5 GHz, 6 GHz ADC, GPIO, I2C, I2S, MIPI-CSI, MIPI-DSI, PCIe, PWM, SPI, UART, USB 2.0, USB 3.1 3.55 V 4.4 V - 35 C + 75 C 56.5 mm x 42.5 mm x 2.95 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax Reel
Quectel 多协议模块 Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 768 KB Flash, 64 KB SRAM, up to 20dBm, Antenna: PCB
数据表
80 MHz 20 dBm I2C, I2S, SPI, UART 1.71 V 3.8 V - 40 C + 85 C RF Coaxial Connector 20 mm x 12 mm x 2.2 mm BLE 5.3 Zigbee 3.0 Reel
Quectel 多协议模块 Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 1024 KB Flash, 96 KB SRAM, up to 20dBm, Antenna: 1st gen RF coax
数据表
80 MHz 20 dBm I2C, I2S, SPI, UART 1.71 V 3.8 V - 40 C + 85 C RF Coaxial Connector 20 mm x 12 mm x 2.2 mm BLE 5.3 Zigbee 3.0 Reel
Quectel 多协议模块 Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 1024 KB Flash, 96 KB SRAM, up to 20dBm, Antenna: PCB
数据表
80 MHz 20 dBm I2C, I2S, SPI, UART 1.71 V 3.8 V - 40 C + 85 C RF Coaxial Connector 20 mm x 12 mm x 2.2 mm BLE 5.3 Zigbee 3.0 Reel
Quectel 多协议模块 Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 768 KB Flash, 64 KB SRAM, up to 20dBm, Antenna: 1st gen RF coax
数据表
80 MHz 20 dBm I2C, I2S, SPI, UART 1.71 V 3.8 V - 40 C + 85 C PCB Antenna 20 mm x 12 mm x 2.2 mm BLE 5.3 Zigbee 3.0 Reel