WORKPRO 多协议模块

结果: 34
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - 蜂窝、Nbiot、LTE 协议 - GPS、GLONASS 协议 - Sub GHz 协议 - WiFi - 802.11 协议 - ANT、Thread、Zigbee - 802.15.4 封装
Ezurio 多协议模块 BL5340PA Series Multi-Core / Protocol (Nordic nRF5340) Integrated antenna (Cut Tape) 249库存量
最低: 1
倍数: 1

BL5340PA 2.402 GHz to 2.48 GHz I2C, SPI, UART 3 V 3.6 V - 40 C + 105 C MHF4 21 mm x 10 mm x 2.55 mm Bluetooth LE 802.15.4 Cut Tape
Signetik 多协议模块 Nordic Cellular CAT M-1 GNSS/GPS Intelligent IoT Low Profile Connector 374库存量
最低: 1
倍数: 1

SigCell 700 MHz to 2.2 GHz GPIO, I2C, I2S, PWM, SPI, UART 2.5 V 5.5 V - 40 C + 85 C u.FL 32.8 mm x 24.5 mm x 4.5 mm Cellular, NBIoT, LTE GNSS, GPS
Telink 多协议模块 Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this 6库存量
最低: 1
倍数: 1

ML3 2.4 GHz to 2.483 GHz 8.4 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 125 C 26 mm x 11.3 mm x 2.6 mm Zigbee Reel
Telink 多协议模块 Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this 6库存量
最低: 1
倍数: 1

ML7 2.4 GHz to 2.483 GHz 8.5 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 85 C 26 mm x 11.3 mm x 2.6 mm Reel
Seeed Studio 多协议模块 The factory is currently not accepting orders for this product. 188库存量
最低: 1
倍数: 1

2.4 GHz, 5 GHz USB 3.6 V 3.6 V u.FL 92 mm x 32 mm x 25 mm Bluetooth 5.0 802.11 b/g/n
Espressif Systems 多协议模块 ESP32-S3-WROOM-2 is based on ESP32-S3R16V, with flash memory of Octal 32 MB and PSRAM memory of 16 MB. It provides acceleration for neural network computing and signal processing workloads. 1,588库存量
7,150在途量
最低: 1
倍数: 1
卷轴: 650

2.412 GHz to 2.484 GHz SPI 3 V 3.6 V - 40 C + 65 C 25.5 mm x 18 mm x 3.1 mm Bluetooth 802.11 b/g/n Reel, Cut Tape
Ezurio 多协议模块 BL5340PA Series Multi-Core / Protocol (Nordic nRF5340) Integrated antenna (Tape/Reel) 1,674库存量
最低: 1
倍数: 1
卷轴: 1,000

BL5340PA 2.402 GHz to 2.48 GHz I2C, SPI, UART 3 V 3.6 V - 40 C + 105 C MHF4 21 mm x 10 mm x 2.55 mm Bluetooth LE 802.15.4 Reel, Cut Tape
Ezurio 多协议模块 BL5340PA Series Multi-Core / Protocol (Nordic nRF5340) Trace pin (Tape/Reel) 987库存量
最低: 1
倍数: 1
卷轴: 1,000

BL5340PA 2.402 GHz to 2.48 GHz I2C, SPI, UART 3 V 3.6 V - 40 C + 105 C MHF4 21 mm x 10 mm x 2.55 mm Bluetooth LE 802.15.4 Reel, Cut Tape
Ezurio 多协议模块 BL5340PA Series Multi-Core / Protocol (Nordic nRF5340) Trace pin (Cut Tape) 132库存量
最低: 1
倍数: 1

BL5340PA 2.402 GHz to 2.48 GHz I2C, SPI, UART 3 V 3.6 V - 40 C + 105 C MHF4 21 mm x 10 mm x 2.55 mm Bluetooth LE 802.15.4 Cut Tape
Ezurio 多协议模块 BL5340 series - Multi-Core / Protocol Bluetooth + 802.15.4 + NFC Module (Nordic nRF52340) - Integrated Antenna (Cut Tape) 198库存量
1,000预期 2026/7/20
最低: 1
倍数: 1

BL5340 2.4 GHz 3 dBm ADC, GPIO, I2C, I2S, SPM, UART, USB 1.7 V 5.5 V - 40 C + 105 C Integrated 15 mm x 10 mm x 2 mm Bluetooth LE NFC 802.15.4 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Ezurio 多协议模块 BL5340 series - Multi-Core / Protocol Bluetooth + 802.15.4 + NFC Module (Nordic nRF52340) - Trace Pad (Cut Tape) 287库存量
最低: 1
倍数: 1

BL5340 2.4 GHz 3 dBm ADC, GPIO, I2C, I2S, SPM, UART, USB 1.7 V 5.5 V - 40 C + 105 C External 15 mm x 10 mm x 2 mm Bluetooth LE NFC 802.15.4 802.15.4 (ANT, Thread, Zigbee) Cut Tape


Texas Instruments 多协议模块 SimpleLink Wi-Fi 6 a nd Bluetooth Low En 1,050库存量
最低: 1
倍数: 1
卷轴: 1,500
CC3301MOD 2.412 GHz to 2.472 GHz 18.4 dBm SPI, UART 1.62 V, 2.97 V 2.97 V, 3.63 V - 40 C + 85 C 11 mm x 11 mm Bluetooth WiFi 6, 802.11ax Reel, Cut Tape, MouseReel
Silicon Labs 多协议模块 PMOD Card 802.11abgn BT4.0 + ZigBee 1库存量
最低: 1
倍数: 1

RS9113 2.4 GHz, 5 GHz 18 dBm SDIO, SPI, UART, USB 3 V 3.6 V - 40 C + 85 C Integrated, u.FL 16 mm x 27 mm x 3.1 mm Bluetooth 4.0 802.11 a/b/g/n 802.15.4 (ANT, Thread, Zigbee) Bulk
Seeed Studio 多协议模块 Wio Tracker L1 Pro
8预期 2026/4/9
最低: 1
倍数: 1

Ezurio 多协议模块 BL5340 series - Multi-Core / Protocol Bluetooth + 802.15.4 + NFC Module (Nordic nRF52340) - Integrated Antenna (Tape/Reel)
1,996预期 2026/6/4
最低: 1
倍数: 1
卷轴: 1,000

BL5340 2.4 GHz 3 dBm ADC, GPIO, I2C, I2S, SPM, UART, USB 1.7 V 5.5 V - 40 C + 105 C Integrated 15 mm x 10 mm x 2 mm Bluetooth LE NFC 802.15.4 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape
M5Stack 多协议模块 a highly integrated embedded module based on the Espressif ESP32-S3FN8, equipped with a 240MHz Xtensa 32-bit LX7 dual-core processor, integrated 8MB Flash
30在途量
最低: 1
倍数: 1

I2C 25.93 mm x 18 mm x 4.7 mm
DFRobot 多协议模块 The factory is currently not accepting orders for this product. 无库存交货期 5 周
最低: 1
倍数: 1

30 mm to 22 mmm Bluetooth 5.2 802.11 a/b/g/n/ac/ax
Signetik 多协议模块 LoRa Sensor End Node with BLE Intelligent IoT Low Profile Connector/Twin Connector 无库存
最低: 50
倍数: 50

SigLRN 2.4 GHz GPIO, I2S, PWM, SPI, UART 1.8 V 5.5 V u.FL 32.8 mm x 24.5 mm x 8.3 mm Bluetooth 5.0
Signetik 多协议模块 LoRa Sensor End Node with BLE Intelligent IoT Low Profile Connector/Twin Connector 无库存
最低: 100
倍数: 100

SigLRN 2.4 GHz GPIO, I2S, PWM, SPI, UART 1.8 V 5.5 V u.FL 32.8 mm x 24.5 mm x 8.3 mm
Silex Technology 多协议模块 The Silex SX-SDCAC Plus is a next generation 802.11a/b/g/n/ac plus Bluetooth SDIO card based on the QCA9377-3 System-on-Chip (SoC). The SX-SDCAC Plus is mechanically designed in a SD card form factor to provide customers with a vendor independent for 无库存交货期 30 周
最低: 1
倍数: 1
Bulk
Silex Technology 多协议模块 2x2 Dual Band 802.11 ac WLAN+BT SMT 无库存交货期 30 周
最低: 1,500
倍数: 1,500
卷轴: 1,500

SX-PCEAC2 2.4 GHz, 5 GHz Serial 3.3 V 3.3 V 0 C + 70 C 12 mm x 16 mm x 1.5 mm Bluetooth 5.0 802.11 a/b/g/n/ac Reel
Silex Technology 多协议模块 2x2 Dual Band 802.11 ac WLAN+BT PCIe 无库存交货期 30 周
最低: 100
倍数: 100

SX-PCEAC2 2.4 GHz, 5 GHz Serial 3.3 V 3.3 V 0 C + 70 C 30 mm x 26.8 mm x 3.4 mm Bluetooth 5.0 PCIe 802.11 a/b/g/n/ac Tray
Silex Technology 多协议模块 2.4 GHz/5 GHz dual-band Wi-Fi 6 plus BLE v5.3 BR/EDR/LE SDIO 3.0 module Sample 无库存交货期 26 周
最低: 1
倍数: 1

SX-SDMAX 2.4 GHz, 5 GHz UART 1.8 V 3.3 V - 40 C + 85 C MHF 17 mm x 18 mm x 2.65 mm Bluetooth 5.3 802.11 a/b/g/n/ac/ax Cut Tape
Quectel 多协议模块 longevity extended till 2028, not recommended for new designs. please promote SC200E series. 无库存交货期 16 周
最低: 600
倍数: 200
卷轴: 200

Reel
Quectel 多协议模块 longevity extended till 2028, not recommended for new designs. please promote SC200E series. 无库存交货期 16 周
最低: 600
倍数: 200
卷轴: 200

Reel