THE BEST SOLUTION 多协议模块

结果: 1,656
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - 蜂窝、Nbiot、LTE 协议 - GPS、GLONASS 协议 - Sub GHz 协议 - WiFi - 802.11 协议 - ANT、Thread、Zigbee - 802.15.4 资格 封装
Crowd Supply 多协议模块 SuperB (built-in trace) by Macchina 27库存量
最低: 1
倍数: 1
2.4 GHz 18.5 dBm GPIO, SPI, UART 2.7 V 3.6 V - 40 C + 65 C Built-In 26.2 mm x 25.5 mm x 7.8 mm Bluetooth 802.11 b/g/n
Intel 多协议模块 Intel Wi-Fi 6 AX201 (Gig+), 1216, 2x2 AX+BT, No vPro 766库存量
最低: 1
倍数: 1

Wi-Fi 6 AX201 2.4 GHz, 5 GHz Bluetooth, M.2, WiFi 0 C + 80 C 12 mm x 16 mm x 1.65 mm Bluetooth 5.2 802.11 ax
HMS Networks 多协议模块 Wireless Bolt-CAN Interface 2库存量
最低: 1
倍数: 1

Anybus Wireless 2.4 GHz, 5 GHz 18 dBm CAN, Ethernet, WiFi 9 V 30 V - 40 C + 65 C Built-In 68 mm x 75 mm Bluetooth 2.1 802.11 a/b/g/n/d Bulk
Ezurio 多协议模块 Module, Sterling LWB+, M.2, Key E, SDIO, UART 59库存量
最低: 1
倍数: 1

Sterling-LWB+ 2.4 GHz USART 3.2 V 4.8 V - 40 C + 85 C MHF4 Bluetooth 5.2 WiFi 4, 802.11 b/g/n Tray
Intel 多协议模块 Intel Wi-Fi 6 AX201 (Gig+), 1216, 2x2 AX+BT, No vPro 940库存量
最低: 1
倍数: 1

AX201 2.4 GHz, 5 GHz Bluetooth, M.2, WiFi 0 C + 80 C 12 mm x 16 mm x 1.65 mm Bluetooth 5.2 802.11 ax
Espressif Systems 多协议模块 SMD module, ESP32-U4WDH with 4 MB flash die inside, ESP32 ECO V3, IPEX connector, -40C - +105C 3,306库存量
最低: 1
倍数: 1
: 6,500
2.4 GHz 19.5 dBm I2C, I2S, SDIO, SPI, PWM, UART 3 V 3.6 V - 40 C + 85 C PCB 13.2 mm x 19 mm x 2.4 mm Bluetooth 4.2 Reel, Cut Tape
Silicon Labs 多协议模块 Mighty Gecko lighting module, +12 dBm, 2.4 GHz, 1 MB Flash, -40 to 105 C, PCB trace antenna, certified. 99库存量
最低: 1
倍数: 1

MGM210L 2.4 GHz 12.5 dBm I2C, SPI, UART 1.8 V 3.8 V - 40 C + 105 C PCB 12.5 mm x 15.5 mm x 2.25 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Cut Tape
ADLINK Technology Wi-Fi 6 / BT M.2 Type 2230 Combo Module
ADLINK Technology 多协议模块 Wireless: IEEE 802.11a/b/g/n/ac/ax (2Tx2R) Bluetooth: V5.2 / V4.2 / V4.1 / V4.0 LE / V3.0 / V2.1+EDR Frequency Range: 2.402 2.480 GHz Antenna: Dual MHF4 Antenna Connectors 2库存量
最低: 1
倍数: 1
2.402 GHz to 2.48 GHz MHF4 Bluetooth 5.2 802.11 a/b/g/n/ac/ax
Silicon Labs 多协议模块 MGM13S02F512GN Mighty Gecko SiP Module for Zigbee and Thread 802.15.4 Mesh and Multiprotocol Connectivity 260库存量
最低: 1
倍数: 1

MGM13S 2.4 GHz 10 dBm I2C, SPI, UART 1.8 V 3.8 V - 40 C + 85 C RF 6.5 mm x 6.5 mm x 1.4 mm Bluetooth Thread, Zigbee Tray
Crowd Supply 多协议模块 SuperBx (U.FL for external antenna) by Macchina 39库存量
最低: 1
倍数: 1
2.4 GHz 18.5 dBm GPIO, SPI, UART 2.7 V 3.6 V - 40 C + 65 C u.FL 26.2 mm x 25.5 mm x 7.8 mm Bluetooth 802.11 b/g/n
Telit Cinterion 多协议模块 392库存量
最低: 1
倍数: 1

1.4 MHz 23 dBm I2C, SPI, UART 2.2 V 4.5 V - 40 C + 85 C 18 mm x 15 mm Cellular, NBIoT, LTE GPS Tray
Telit Cinterion 多协议模块 239库存量
最低: 1
倍数: 1

1.4 MHz 23 dBm I2C, SPI, UART 2.2 V 4.5 V - 40 C + 85 C 18 mm x 15 mm Cellular, NBIoT, LTE GPS Tray
Insight SiP 多协议模块 nRF52832 LoRa Transceiver & BLE 5 Module AS 121库存量
最低: 1
倍数: 1
: 250
920 MHz to 923 MHz, 2.4 GHz 14 dBm SPI 1.8 V 3.6 V - 30 C + 85 C External 9.8 mm x 17.2 mm x 1.7 mm Bluetooth 5.0 Reel, Cut Tape
Microchip Technology 多协议模块 ATWINC3400 802.11 b/g/n + Bluetooth 5 Module Chip Antenna 130库存量
最低: 1
倍数: 1

ATWINC3400 2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
M5Stack 多协议模块 M5stamp EsP32s3A Module 64库存量
140预期 2026/7/22
最低: 1
倍数: 1

u-blox 多协议模块 88W8887, 802.11ac+BT, 1 antenna pin 277库存量
最低: 1
倍数: 1
: 500

2.4 GHz, 5 GHz 18 dBm GPIO, SDIO, UART 2.97 V 3.63 V - 40 C + 85 C External 19.8 mm x 13.8 mm x 2.5 mm Bluetooth 4.2 802.11 a/b/g/n/ac Reel, Cut Tape
Espressif Systems 多协议模块 SMD module, ESP32-PICO-V3 with 4MB flash die inside, ESP32 ECO V3, PCB antenna, for Alexa Connect Kit (ACK). 477库存量
最低: 1
倍数: 1
: 650

ESP32 2.4 GHz 19.5 dBm GPIO, I2C, I2S, SDIO, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 16 mm x 23 mm x 2.3 mm BLE, Bluetooth 4.2 802.11 b/g/n Reel, Cut Tape
InnoPhase IoT 多协议模块 WiFi/BLE5/MCU Module w/ PCB Antenna 385库存量
最低: 1
倍数: 1
2.4 GHz 17.5 dBm SPI, UART 2.6 V 3.6 V - 40 C + 85 C PCB 12.8 mm x 20 mm x 2.5 mm BLE 5.0 802.11 b/g/n Tray
Texas Instruments 多协议模块 TI WiLink8 SGL-Band Combo Mod A 595-WL18 A 595-WL1831MODGBMOCR 340库存量
最低: 1
倍数: 1
: 250

WL1831MOD 2.4 GHz 17.3 dBm SDIO, UART 2.9 V 4.8 V - 20 C + 70 C RF 13.4 mm x 13.3 mm x 2 mm BLE, Bluetooth 5.1 802.11 a/b/g/n Reel, Cut Tape, MouseReel
Seeed Studio 多协议模块 Wio Tracker L1 Pro 29库存量
最低: 1
倍数: 1
Silicon Labs 多协议模块 802.15.4 Module, SiP, Secure Boot with Root of Trust and Secure Loader (RTSL), +6.5 dBm, 2.4 GHz, 768kB flash, 64kB RAM, -40 to +105 C, 26 GPIO, Certified 772库存量
最低: 1
倍数: 1

MGM270S 76.8 MHz - 40 C + 105 C 6.5 mm x 6.5 mm x 1.3 mm Bluetooth Tray
Silicon Labs 多协议模块 Mighty Gecko lighting module, +12 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, PCB trace antenna, certified. 200库存量
最低: 1
倍数: 1

MGM210L 2.4 GHz 12.5 dBm I2C, SPI, UART 1.8 V 3.8 V - 40 C + 125 C PCB 12.5 mm x 15.5 mm x 2.25 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Espressif Systems 多协议模块 SMD Module, ESP32-H2FH2S, Chip revision v1.2 and above, 2 MB SPI flash, PCB antenna, -40 C +105 C Required ESP-IDF version: v5.1.6 and v5.2.5, v5.3.3 (expected on 3/27), v5.4.1 (expected on 4/4), and above 3,380库存量
最低: 1
倍数: 1

2.402 GHz to 2.48 GHz 20 dBm SPI 3 V 3.6 V - 40 C + 105 C 16.6 mm x 13.2 mm x 2.4 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee)
Espressif Systems 多协议模块 SMD Module, ESP32-H2FH4S, Chip revision v1.2 and above, 4 MB SPI flash, PCB antenna, -40 C +105 C. Required ESP-IDF version: v5.1.6 and v5.2.5, v5.3.3 (expected on 3/27), v5.4.1 (expected on 4/4), and above 2,869库存量
1,950预期 2026/8/24
最低: 1
倍数: 1

2.402 GHz to 2.48 GHz 20 dBm SPI 3 V 3.6 V - 40 C + 105 C 16.6 mm x 13.2 mm x 2.4 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee)
Seeed Studio 多协议模块 Seeed Studio XIAO ESP32-C5 (Pre-Soldered) 34库存量
32在途量
最低: 1
倍数: 1

GPIO, I2C, SPI, UART, USB