多协议模块

结果: 1,524
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - 蜂窝、Nbiot、LTE 协议 - GPS、GLONASS 协议 - Sub GHz 协议 - WiFi - 802.11 协议 - ANT、Thread、Zigbee - 802.15.4 资格 封装
Espressif Systems 多协议模块 "ESP32-C5-WROOM-1 and ESP32-C5-WROOM-1U are two general-purpose 2.4 and 5 GHz dual-band Wi-Fi 6 (802.11ax), Bluetooth 5 (LE), Zigbee, and Thread (802.15.4) modules. The rich set of peripherals and high performance make the module an ideal choice for 4,198库存量
最低: 1
倍数: 1

240 MHz 20 dBm I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 27.5 mm x 18 mm x 3.3 mm
Espressif Systems 多协议模块 ESP32-C61-WROOM-1 is a powerful, general-purpose Wi-Fi, and Bluetooth LE modules. The rich set of peripherals and high performance make the module an ideal choice for smart homes, industrial automation, health care, consumer electronics, etc. 1,839库存量
1,300预期 2026/7/21
最低: 1
倍数: 1

Espressif Systems 多协议模块 SMD Module, ESP8684H4, 4 MB flash inside, -40 C - +105 C 1,272库存量
1,950在途量
最低: 1
倍数: 1

u-blox 多协议模块 Host-based dual-band Wi-Fi 6 and Bluetooth LE module for IoT, 1 antenna pin 400库存量
最低: 1
倍数: 1
卷轴: 500

MAYA-W4 2.4 GHz, 5 GHz 15 dBm, 18 dBm SPI, UART, USB 3.13 VDC 3.46 VDC - 40 C + 85 C Pin 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
u-blox 多协议模块 Host-based dual-band Wi-Fi 6 and Bluetooth LE module for IoT, embedded PCB antenna. 437库存量
最低: 1
倍数: 1
卷轴: 500

MAYA-W4 PCB Reel, Cut Tape
u-blox 多协议模块 Host-based dual-band Wi-Fi 6, Bluetooth LE and Thread/Zigbee module for IoT, 1 antenna pin 450库存量
最低: 1
倍数: 1
卷轴: 500

MAYA-W4 Pin Reel, Cut Tape
u-blox 多协议模块 Host-based dual-band Wi-Fi 6, Bluetooth LE and Thread/Zigbee modules for IoT, embedded PCB antenna. 160库存量
500预期 2026/3/4
最低: 1
倍数: 1
卷轴: 500

MAYA-W4 2.4 GHz, 5 GHz 15 dBm, 18 dBm SPI, UART, USB 3.13 VDC 3.46 VDC - 40 C + 85 C PCB 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
STMicroelectronics 多协议模块 Low-power Wi-Fi 6 - Bluetooth LE combo coprocessor module 1,173库存量
最低: 1
倍数: 1
最大: 50
卷轴: 800

ST67W 2.4 GHz 21 dBm SPI, UART 2.97 V 3.63 V - 40 C + 85 C Bluetooth 5.4 IEEE 802.11 b/g/n/ax IEEE 802.15.4 Thread Reel, Cut Tape, MouseReel
STMicroelectronics 多协议模块 NB-IoT module with extra ADC. Supported LTE FDD frequency bands: B1, B3, B5, B8, B20, B2 597库存量
最低: 1
倍数: 1
最大: 25
卷轴: 800

ST67W 2.412 GHz to 2.484 GHz 10 dBm SPI, UART 2.97 V 3.63 V - 40 C + 85 C RF Bluetooth WiFi Reel, Cut Tape, MouseReel
Silex Technology 多协议模块 Wi-Fi+BLE Mod 2 ufl connect SamPck 209库存量
最低: 1
倍数: 1

SX-SDMAC 2.4 GHz, 5 GHz Bluetooth 5.0 802.11 a/b/g/n/ac Cut Tape
Silex Technology 多协议模块 2x2 Dual Band 802.11 ac WLAN+BT PCIe 58库存量
最低: 1
倍数: 1

SX-PCEAC2 2.4 GHz, 5 GHz PCIe, USB 3.135 V 3.465 V - 20 C + 70 C MHF4 30 mm x 26.8 mm x 3.4 mm Bluetooth 5.0 802.11 a/b/g/n/ac Bulk

Murata Electronics 多协议模块 Type 1XA Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 5.2 1,408库存量
最低: 1
倍数: 1
卷轴: 1,000

1XA 2.4 GHz, 5 GHz 17 dBm PCIe, UART 1.62 V 3.63 V - 40 C + 85 C u.FL 11.4 mm x 8.9 mm x 1.4 mm Bluetooth 5.2 802.11 a/b/g/n/ac Reel, Cut Tape
Jorjin 多协议模块 Based on STM BlueNRG-1 + S2-LP and supports Sigfox and BLE4.2 1,650库存量
最低: 1
倍数: 1
卷轴: 550

902 MHz, 920 MHz 8 dBm, 16 dBm I2C, SPI, UART 2 V 3.6 V - 40 C + 85 C u.FL 22 mm x 24 mm x 2.8 mm Bluetooth 4.2 Sub GHz Reel, Cut Tape, MouseReel
Microchip Technology 多协议模块 ATWINC3400 802.11 b/g/n + Bluetooth 5 Module U.FL Antenna 65库存量
最低: 1
倍数: 1
2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C u.FL 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 Tray
Jorjin 多协议模块 Based on STM BlueNRG-2 + S2-LP and supports Sigfox and BLE5.0 1,623库存量
最低: 1
倍数: 1
卷轴: 550

860 MHz to 943 MHz, 2.4 GHz 8 dBm, 27 dBm I2C, SPI, UART 1.8 V 3.6 V - 40 C + 85 C 22 mm x 22 mm x 2.8 mm Bluetooth Sub GHz Reel, Cut Tape, MouseReel
Jorjin 多协议模块 Based on STM BlueNRG-1 + S2-LP and supports Sigfox and BLE4.2 2,144库存量
最低: 1
倍数: 1
卷轴: 550

860 MHz to 943 MHz 8 dBm, 16 dBm I2C, SPI, UART 1.8 V 3.6 V - 40 C + 85 C u.FL 22 mm x 24 mm x 2.8 mm Bluetooth 4.2 Sub GHz Reel, Cut Tape, MouseReel
M5Stack 多协议模块 M5stamp EsP32s3A Module 34库存量
30在途量
最低: 1
倍数: 1

Seeed Studio 多协议模块 XIAO ESP32S3 & Wio-SX1262 Kit with 3D case for Meshtastic & LoRa 32库存量
57在途量
最低: 1
倍数: 1

XIAO 862 MHz to 930 MHz 22 dBm SPI 1.8 V 3.6 V - 40 C + 85 C 11.6 m x 11 mm x 2.95 mm
Embedded Artists 多协议模块 2LL M.2 Module 25库存量
8在途量
最低: 1
倍数: 1

UART 3.3 V 3.46 V - 40 C + 85 C U.FL Bluetooth WiFi Bulk
SparkFun 多协议模块 Edimax 2-in-1 Wi-Fi 4 N150 & Bluetooth 4.2 Nano USB Adapter 3库存量
5预期 2026/4/1
最低: 1
倍数: 1

2.4 GHz 17 dBm USB 2.0 0 C + 40 C Internal 18.9 mm x 14.9 mm x 7.1 mm Bluetooth 4.2 802.11 b/g/n

Murata Electronics 多协议模块 Type 1LD Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 4.2 845库存量
最低: 1
倍数: 1
卷轴: 1,000

1LD 2.4 GHz 17 dBm GPIO, I2C, SPI, UART 1.8 V 3.6 V - 40 C + 85 C External 8.9 mm x 7.8 mm x 1.2 mm Bluetooth 4.2 802.11 a/b/g/n/ac AWS Reel, Cut Tape
Quectel 多协议模块 Embedded, 2400-2500 MHz, 4900-5850 MHz,5925-7125MHz, Wi-Fi (Bluetooth), PFC with cable, 100 +/-2 mm, IPEX ?(U.FL Generation ?), Adhesive, 28.9x11x0.2 136库存量
最低: 1
倍数: 1

850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 21 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm EGPRS, LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS
InnoPhase IoT 多协议模块 WiFi/BLE5/MCU Module w/ U.FL Antenna Connector 396库存量
最低: 1
倍数: 1

2.4 GHz 17.5 dBm SPI, UART 2.6 V 3.6 V - 40 C + 85 C u.FL 19.1 mm x 21.6 mm x 2.5 mm BLE 5.0 802.11 b/g/n Tray
Espressif Systems 多协议模块 ESP32-C61-based module supporting 2.4 GHz Wi-Fi 6(802.11ax) and Bluetooth 5 Low Energy. Ultra-low power, compact size, high cost performance, and rich peripheral interfaces. 633库存量
2,600预期 2026/3/23
最低: 1
倍数: 1

Bluetooth
Espressif Systems 多协议模块 SMD Module, ESP32-H2FH4S, Chip revision v1.2 and above, 4 MB SPI flash, IPEX antenna connector, -40 C - +105 C.Required ESP-IDF version: v5.1.6 and v5.2.5, v5.3.3 (expected on 3/27), v5.4.1 (expected on 4/4), and above 168库存量
2,600预期 2026/4/20
最低: 1
倍数: 1