congatec 热管理产品

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congatec CPU与芯片冷却器 Standard active cooling solution for high performance COM-HPC module conga-HPC/cTLH with integrated heatpipe, 29mm height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
congatec CPU与芯片冷却器 Standard active cooling solution for high performance COM-HPC module conga-HPC/cTLH with integrated heatpipe, 29mm height and integrated 12V fan. All standoffs are M2.5mm thread.
congatec CPU与芯片冷却器 Standard passive cooling solution for high performance COM-HPC module conga-HPC/cTLH with integrated heatpipe, 29mm height. All standoffs are with 2.7mm bore hole.
congatec CPU与芯片冷却器 Standard passive cooling solution for high performance COM-HPC module conga-HPC/cTLH with integrated heatpipe, 29mm height. All standoffs are with M2.5mm thread.
congatec 散热片 Standard heatspreader for high performance COM-HPC module conga-HPC/cTLH with integrated heatpipe, 13mm height. All standoffs are with 2.7mm bore hole.
congatec 散热片 Standard heatspreader for high performance COM-HPC module conga-HPC/cTLH with integrated heatpipe, 13mm height. All standoffs are with M2.5mm thread.
congatec CPU与芯片冷却器 Standard passive cooling solution for conga-JC370 (bore hole). 16mm fins, 21mm overall heat sink height and total height 26.3mm.
congatec CPU与芯片冷却器 Standard passive cooling solution for conga-JC370 (threaded). 16mm fins, 21mm overall heat sink height and total height 26.3mm.
congatec 散热片 Standard heatspreader for conga-JC370 (bore hole). Total height 12mm.
congatec 散热片 Standard heatspreader for conga-JC370 (threaded). Total height 12mm.
congatec 散热片 Standard heatspreader for COM Express Basic modules conga-B7XI with integrated heat pipes and 11mm overall cooling height. Through hole mounting with bore hole standoffs 2.7mm.
congatec CPU与芯片冷却器 Passive cooling solution for Qseven module conga-QMX8 with lidded NXP i.MX 8 ARM Cortex-A72 processor. All standoffs are with 2.7mm bore hole.

congatec CPU与芯片冷却器 Passive cooling solution for Qseven module conga-QMX8 with lidded NXP i.MX 8 ARM Cortex-A72 processor. All standoffs are M2.5mm thread.

congatec 散热片 Standard heatspreader for Qseven module conga-QMX8 with lidded NXP i.MX 8 ARM Cortex-A72 processor. All standoffs are with 2.7mm bore hole.

congatec 散热片 Standard heatspreader for Qseven module conga-QMX8 with lidded NXP i.MX 8 ARM Cortex-A72 processor. All standoffs are M2.5mm thread.

congatec 散热片 Standard heatspreader for SMARC Module conga-STDA4 based on TI ARM Jacinto 7 ARM

congatec 散热片 Standard heatspreader for SMARC Module conga-STDA4 based on TI ARM Jacinto 7 ARM processor. All standoffs are with 2.7mm bore hole.

JUMPtec 散热片 HSK COMe-bBD6/7 passive (w/o HSP)

JUMPtec CPU与芯片冷却器 HSP COMh-sdID (E2) thread

JUMPtec CPU与芯片冷却器 HSP COMh-sdID (E2) through

JUMPtec CPU与芯片冷却器 Cooling COMh-sdID (E2): Adapter

JUMPtec CPU与芯片冷却器 Cooling COMh-sdID (E2): Backplate

JUMPtec CPU与芯片冷却器 Cooling COMh-sdID (E2): Cooler-LGA115x

congatec 散热片 Standard active cooling solution for high performance COM Express Type 6 module conga-TS170, conga-TS175 and conga-TS370 with heat pipes, 15mm fins, 20mm overall heat sink height and integrated 12V fan. All stand-offs are with 2.7mm bore hole.

congatec 散热片 Standard active cooling solution for high performance COM Express module conga-TS170, conga-TS175 and conga-TS370 with heat pipes, 15mm fins, 20mm overall heat sink height and integrated 12V fan. All stand-offs are M2.5 threaded.