congatec CPU与芯片冷却器

结果: 101
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 高度 深度 宽度 工作电源电压 功率额定值 系列
JUMPtec CPU与芯片冷却器 COMe Active Uni Cooler (w/o HSP) 43库存量
最低: 1
倍数: 1
14 mm 78 mm 87 mm 20 W
JUMPtec CPU与芯片冷却器 HSK COMe-Basic active (w/o HSP) 7库存量
81在途量
最低: 1
倍数: 1
JUMPtec CPU与芯片冷却器 HSP COMe-cAP6 Cu-core threaded
1在途量
最低: 1
倍数: 1

JUMPtec CPU与芯片冷却器 COMe Passive Uni Cooler (w/o HSP) N/A
最低: 1
倍数: 1

14 mm 78 mm 87 mm
JUMPtec CPU与芯片冷却器 HSK COMe-Basic passive (w/o HSP) 无库存交货期 28 周
最低: 1
倍数: 1



congatec CPU与芯片冷却器 Passive cooling solution for SMARC module conga-SMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole.

congatec HPC/sILH-CSA-HP-T
congatec CPU与芯片冷却器 Standard active cooling solution for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes, 32.9mm overall cooling height and integrated 12V fan. Threaded mounting with threaded standoffs M2.5.
32.9 mm 12 V
congatec CPU与芯片冷却器 Passive cooling solution for COMe mini module conga-MA7 with lidded Intel Atom Exxx processor. All standoffs are with 2.7mm bore hole.

conga-MA7 Intel Elkhart Lake
congatec CPU与芯片冷却器 *Passive cooling for Pico ITX module conga-PA7*For CPUs with standard silicone die*Four stand-offs M2.5 threaded
conga-PA7 Intel Elkhart Lake
congatec CPU与芯片冷却器 Passive cooling solution for COM Express Compact module conga-TCA7 with lidded Intel Atom processor. thread

conga-TCA7 Intel Elkhart Lake
congatec CPU与芯片冷却器 Standard passive cooling solution for high performance COM-HPC module conga-HPC/cTLUwith integrated heatpipe, 28mm height. All standoffs are with 2.7mm bore hole.

28 mm conga-HPC/cTLU Intel Tiger Lake-UP3
congatec CPU与芯片冷却器 Standard active cooling solution and integrated 12V fan for conga-JC370 (threaded). 16mm fins, 21mm overall heat sink height and total height 27.3mm.
27.3 mm 12 V conga-JC370
congatec CPU与芯片冷却器 Standard active cooling solution and integrated 12V fan for conga-JC370 (bore hole). 16mm fins, 21mm overall heat sink height and total height 27.3mm.
27.3 mm 12 V conga-JC370
congatec conga-TCR8/CSA-HP-B
congatec CPU与芯片冷却器 Standard active cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes and 12V fan. All standoffs are with 2.7mm bore hole.

congatec HPC/cALP-CSA-HP-B
congatec CPU与芯片冷却器 Standard active cooling solution for COM-HPC module conga-HPC/cALP with integrated heat pipes, 29mm height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
29 mm 12 V
JUMPtec CPU与芯片冷却器 COMe Active Uni Cooler2 (w/o HSP)

JUMPtec 51099-0000-99-1
JUMPtec CPU与芯片冷却器 SMARC Passive Uni Cooler (w/o HSP)
congatec conga-HPC/mRLP-CSA-B
congatec CPU与芯片冷却器 Standard active cooling solution for COM-HPC module conga-HPC/mRLP with 25mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.

congatec conga-HPC/mRLP-CSA-T
congatec CPU与芯片冷却器 Standard active cooling solution for COM-HPC module conga-HPC/mRLP with 25mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm threaded.

congatec conga-HPC/mRLP-CSP-B
congatec CPU与芯片冷却器 Standard passive cooling solution for COM-HPC module conga-HPC/mRLP with 24.2mm overall heat sink height. All standoffs are with 2.7mm bore hole.

congatec CPU与芯片冷却器 Passive cooling solution for COMe mini module conga-MA7 with lidded Intel Atom Exxx processor. All standoffs are M2.5 threaded

conga-MA7 Intel Elkhart Lake
congatec CPU与芯片冷却器 * Passive cooling for SMARC 2.0 module conga-SA7* For modules with lidded Intel Atom processor* All stand-offs are with 2.7mm bore hole

conga-SA7 Intel Elkhart Lake
JUMPtec CPU与芯片冷却器 HSP COMe-cAP6 Cu-core through

JUMPtec CPU与芯片冷却器 COMe Passive Uni Cooler2 slim (w/o HSP)

JUMPtec CPU与芯片冷却器 COMe Passive Uni Cooler2 (w/o HSP)